Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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06/01/2011 | CN201848619U Wave-soldering jet flow hole device |
06/01/2011 | CN201848618U Full-automatic soldering machine |
06/01/2011 | CN201847083U Brush structure |
06/01/2011 | CN1969231B Method of forming plated product using negative photoresist composition |
06/01/2011 | CN1791300B Multi-layered circuit board and manufacturing method of multi-layered circuit board |
06/01/2011 | CN1582091B Method for forming store grid cofferdam and pattern ,photoelectronic device and electronic machine |
06/01/2011 | CN102084731A Printed wiring board and method for manufacturing same |
06/01/2011 | CN102084730A A support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device |
06/01/2011 | CN102083550A Metal and electronic device coating process for marine use and other environments |
06/01/2011 | CN102083282A Method for manufacturing printed circuit board (PCB) |
06/01/2011 | CN102083281A Method for enhancing welding reliability of high-frequency quad flat no lead (QFN) device |
06/01/2011 | CN102083280A Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof |
06/01/2011 | CN102083279A Board incoming control method and device for horizontal line and horizontal line |
06/01/2011 | CN102083278A Method of manufacturing printed circuit board |
06/01/2011 | CN102083277A Printed circuit board and wiring method thereof |
06/01/2011 | CN102083276A Circuit board cutting method |
06/01/2011 | CN102083275A Pin used for solder masking, elevating and positioning |
06/01/2011 | CN102083274A Method for manufacturing printed circuit board (PCB) |
06/01/2011 | CN102083273A Method for laminating covering film of flexible printed circuit board |
06/01/2011 | CN102083270A Circuit board and manufacturing method thereof |
06/01/2011 | CN102083269A Ceramic circuit substrate and manufacturing method thereof |
06/01/2011 | CN102080252A Rapid printed circuit board feeding and clamping device and electroplating equipment thereof |
06/01/2011 | CN102078993A Jet-type welding system and manufacture system of PCB (Printed Circuit Board) with same |
06/01/2011 | CN101496168B Substrate and process for semiconductor flip chip package |
06/01/2011 | CN101370615B Water-dispersed flux composition, electronic circuit board with electronic component, and their production methods |
06/01/2011 | CN101291565B Printed wiring board |
06/01/2011 | CN101114121B Method for forming pattern, and method for manufacturing liquid crystal display |
05/31/2011 | US7952372 Contacting component, method of producing the same, and test tool having the contacting component |
05/31/2011 | US7952274 Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same |
05/31/2011 | US7952202 Method of embedding passive component within via |
05/31/2011 | US7951710 Method for manufacturing thin film transistor and display device |
05/31/2011 | US7951460 Multilayer of a metal layer and a polyimide insulating layer; adhesive strength; semiconductors |
05/31/2011 | US7951301 Method for producing a ceramic printed-circuit board |
05/31/2011 | US7950775 Printhead integrated circuit having glass nozzle chambers |
05/31/2011 | US7950145 Component mounting apparatus and method for determining component holding members |
05/31/2011 | US7950144 Method for controlling warpage in redistributed chip packaging panels |
05/31/2011 | US7950143 Method for creating micro/nano wind energy gathering devices |
05/26/2011 | WO2011063105A2 Circuit board with air hole |
05/26/2011 | WO2011062252A1 Manufacturing method of module with built-in parts, and module with built-in parts |
05/26/2011 | WO2011062149A1 Circuit connection material, connection structure using same, and temporary pressure-bonding method |
05/26/2011 | WO2011062146A1 Method of manufacturing rigid/flexible multilayered wiring substrate, and integrated substrate |
05/26/2011 | WO2011062053A1 Flame-retardant solder resist composition and flexible wiring board which is obtained using same |
05/26/2011 | WO2011062037A1 Printed circuit board and manufacturing method of printed circuit board |
05/26/2011 | WO2011061969A1 Partially multilayer wiring board and method for producing same |
05/26/2011 | WO2011061899A1 Base treatment method for copper material, and copper material having base-treating coating film attached thereto |
05/26/2011 | WO2011061873A1 Mounting apparatus and manufacturing method of electronic module |
05/26/2011 | WO2011060605A1 Double-sided circuit board with pin soldered both on top circuit and bottom circuit and method for interconnection |
05/26/2011 | WO2011060604A1 Double-side wiring board and method for interconnecting and conducting |
05/26/2011 | WO2011060600A1 Double-faced circuit board with element and its interconnecting conduction method |
05/26/2011 | WO2011030542A3 Electronic part module and method for producing same |
05/26/2011 | US20110123839 Secondary battery and method of making secondary battery |
05/26/2011 | US20110123796 Interposer films useful in semiconductor packaging applications, and methods relating thereto |
05/26/2011 | US20110123725 Method of enabling selective area plating on a substrate |
05/26/2011 | US20110123724 Dielectric composite and a method of manufacturing a dielectric composite |
05/26/2011 | US20110122647 Method to assembly a turn signal indicator module and turn signal indicator sub-module |
05/26/2011 | US20110122589 Magnetic element having improved transformers and commom mode chokes |
05/26/2011 | US20110122587 Flexible circuit stretching |
05/26/2011 | US20110122498 Annular solid immersion lenses and methods of making them |
05/26/2011 | US20110122267 Shake correction module, camera module comprising the same, and method of manufacturing the camera module |
05/26/2011 | US20110121365 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
05/26/2011 | US20110121326 Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition |
05/26/2011 | US20110121083 Device having an rfid transponder in an electrically conductive object and method for producing said device |
05/26/2011 | US20110121059 Electrical bond connection system |
05/26/2011 | US20110120868 Nanopore and Carbon Nanotube Based DNA Sequencer and a Serial Recognition Sequencer |
05/26/2011 | US20110120760 Electroless copper plating method, printed wiring board, method for producing the same, and semiconductor device |
05/26/2011 | US20110120756 Circuit board, its manufacturing method, and joint box using circuit board |
05/26/2011 | US20110120749 Transparent conductor structure |
05/26/2011 | US20110120334 Process and Device for Printing a Substrate |
05/26/2011 | US20110120221 Mems sensor, method of manufacturing thereof, and electronic apparatus |
05/26/2011 | US20110119912 Method for manufacturing tape wiring board |
05/26/2011 | US20110119911 Wired circuit board |
05/26/2011 | US20110119910 Method and system for releasing a microelectronic assembly from a carrier substrate |
05/26/2011 | US20110119909 Alignment module utilizing transparent reticle to facilitate tool calibration during the high temperature process |
05/26/2011 | DE102009054236A1 Electronic component manufacturing method for automobile, involves electrically connecting electronic parts to conductor track structure by connecting medium, and processing connecting medium at temperature of less than preset value |
05/26/2011 | DE102009053974A1 Substrates i.e. films, connecting method for manufacturing high density interconnect-printed circuit board, involves positioning substrates relative to each other by considering aligning element before bringing into contact with each other |
05/26/2011 | DE102009047051A1 Conductive track punch grid for control device for controlling e.g. brake devices in lorry, has intermediate layer covered by plastic layers that are arranged at distance from each other by gap formed according to micro-cavity |
05/26/2011 | DE102009022514B4 Vorrichtung zum Aufbringen von Lot Apparatus for applying solder |
05/25/2011 | EP2326156A1 Multilayer flexible printed wiring board and electronic device |
05/25/2011 | EP2326155A1 Substrate module and method for manufacturing the same |
05/25/2011 | EP2326154A1 Process for fabricating a three dimensional molded feed structure |
05/25/2011 | EP2325948A1 Electroconductive rubber component |
05/25/2011 | EP2325693A1 Composition for Forming a Patterned Film of Surface-Modified Carbon Nanotubes |
05/25/2011 | EP1845762B1 Multilayer printed wiring board |
05/25/2011 | EP1436827B1 Device for soldering contacts on semiconductor chips |
05/25/2011 | EP1189495B1 Method of manufacturing multilayer ceramic substrate |
05/25/2011 | CN201846536U Heat-resisting carrier plate structure and circuit board assembling structure thereof |
05/25/2011 | CN201846535U Assembling jig for electronic component |
05/25/2011 | CN201846534U Solder paste coating aid |
05/25/2011 | CN201846533U Exposure positioning device |
05/25/2011 | CN201846532U Bending device for flexible circuit board |
05/25/2011 | CN201846531U Impregnation prevention device used for preventing bent strip-type connector from being impregnated in encapsulation process |
05/25/2011 | CN201846523U Crimping device for fixing structures on PCB (printed circuit board) |
05/25/2011 | CN201842892U Automatic dosing system |
05/25/2011 | CN201840920U Film peeling waste treatment device for substrate wet manufacture procedure |
05/25/2011 | CN1796109B Screen printing machine and printing method thereof |
05/25/2011 | CN1770974B Method of and apparatus for mounting an electronic part to a substrate |
05/25/2011 | CN1541047B Pins of outputting high current |
05/25/2011 | CN102077701A Printed-circuit board, printed-circuit board manufacturing method, and electronic device |
05/25/2011 | CN102077700A Circuit module and method for manufacturing same |
05/25/2011 | CN102076501A Inkjet printing of nanoparticulate functional inks |