| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/06/2011 | CN102118918A Flexible transparent electronic circuit and preparation method thereof |
| 07/06/2011 | CN102118915A Double-side copper foil substrate and manufacturing method thereof |
| 07/06/2011 | CN102115907A Method and device for electroplating printed circuit board |
| 07/06/2011 | CN102115888A Etching method and PCB manufacture method using the etching method |
| 07/06/2011 | CN101790285B Communication device and method for manufacturing circuit board of communication device |
| 07/06/2011 | CN101742822B Method for peeling rigid board from flexible board area of flexible-rigid board |
| 07/06/2011 | CN101711093B Reversible clamp for welding circuit board |
| 07/06/2011 | CN101699931B Method for manufacturing high-heat conduction ceramic circuit board |
| 07/06/2011 | CN101677491B Embedded structure and method for making the same |
| 07/06/2011 | CN101652028B Embedded structure and method for making the same |
| 07/06/2011 | CN101546759B Method for manufacturing an electronic module and an electronic module |
| 07/06/2011 | CN101472398B Multilayer flexible printed circuit board and method of manufacturing the same |
| 07/06/2011 | CN101460397B Potassium monopersulfate solutions |
| 07/06/2011 | CN101388436B Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board |
| 07/06/2011 | CN101370356B Circuit board and its manufacturing method |
| 07/06/2011 | CN101341278B Plating apparatus and method of plating |
| 07/06/2011 | CN101312615B Printed circuit board and manufacturing method thereof |
| 07/06/2011 | CN101290471B Photoresist combination and laminating body |
| 07/06/2011 | CN101281367B Solder resist compound and cured product thereof |
| 07/06/2011 | CN101223002B Solder free from lead for additional supply and method of regulating Cu concentration and Ni concentration in solder bath |
| 07/06/2011 | CN101207971B Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board |
| 07/06/2011 | CN101073296B Interposer bonding device |
| 07/06/2011 | CN101031181B Methods and apparatus for in-situ substrate processing |
| 07/05/2011 | US7974102 Integrated circuit carrier assembly |
| 07/05/2011 | US7973634 Electronic component and method for fixing the same |
| 07/05/2011 | US7973246 Electronic component |
| 07/05/2011 | US7972652 Electroless plating system |
| 07/05/2011 | US7972521 Method of making reliable wafer level chip scale package semiconductor devices |
| 07/05/2011 | US7971616 Apparatus for producing non-woven fabric |
| 07/05/2011 | US7971354 Method of manufacturing a multilayer printed wiring board |
| 07/05/2011 | US7971353 Production method of a wired circuit board |
| 07/05/2011 | US7971352 Method of manufacturing printed circuit board |
| 07/05/2011 | US7971351 Method of manufacturing a semiconductor device |
| 07/05/2011 | US7971350 Method of providing a RF shield of an electronic device |
| 07/05/2011 | US7971349 Bump bonding method |
| 07/05/2011 | US7971347 Method of interconnecting workpieces |
| 07/05/2011 | CA2563936C Method and device for continuously producing electronic film components, and an electronic film component |
| 07/05/2011 | CA2492596C Device for producing a coating on printed products from a printing press |
| 07/04/2011 | CA2726400A1 Electrical component comprising a hotmelt element |
| 06/30/2011 | WO2011078355A1 Circuit board, circuit board manufacturing method, suspension board, suspension assembly, suspension assembly with elements, and hard disk drive |
| 06/30/2011 | WO2011078345A1 Through-wired substrate and manufacturing method therefor |
| 06/30/2011 | WO2011078214A1 Assembly structure for injection molded substrate and for mounting component |
| 06/30/2011 | WO2011078114A1 Epoxy resin composition, process for production of assembly using same, and assembly |
| 06/30/2011 | WO2011078031A1 Process for production of printed circuit board, and printed circuit board |
| 06/30/2011 | WO2011077979A1 Anisotropic conductive adhesive |
| 06/30/2011 | WO2011077968A1 Circuit module manufacturing method, circuit module, and electronic apparatus provided with circuit module |
| 06/30/2011 | WO2011077918A1 Circuit module |
| 06/30/2011 | WO2011077917A1 Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board |
| 06/30/2011 | WO2011077777A1 Flexible circuit board and manufacturing method thereof |
| 06/30/2011 | WO2011077764A1 Method for producing laminate, and laminate |
| 06/30/2011 | WO2011077679A1 Conductive connection material, electronic component producing method, and electronic member and electronic component with conductive connection material |
| 06/30/2011 | WO2011077676A1 Wiring component |
| 06/30/2011 | WO2011077032A1 Semiaromatic polyamide, process for preparing same, composition comprising such a polyamide and uses thereof |
| 06/30/2011 | WO2011076730A1 Aromatic polycarbonate composition |
| 06/30/2011 | WO2011056967A3 Multi-layer circuit member with reference circuit |
| 06/30/2011 | WO2011012993A3 Modular prototyping of a circuit for manufacturing |
| 06/30/2011 | WO2011010889A3 Flexible printed circuit board and method for manufacturing the same |
| 06/30/2011 | US20110159713 Acrylic insulating adhesive |
| 06/30/2011 | US20110159245 Method for producing transfer structure and matrix for use therein |
| 06/30/2011 | US20110158077 Connection structure of flexible printed circuits and optical pickup device |
| 06/30/2011 | US20110157891 Systems, Methods, and Devices for Sealing LED Light Sources in a Light Module |
| 06/30/2011 | US20110157808 Patch on interposer through PGA interconnect structures |
| 06/30/2011 | US20110155809 Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards |
| 06/30/2011 | US20110155580 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion |
| 06/30/2011 | US20110155443 Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate |
| 06/30/2011 | US20110155441 Circuit board and process for fabricating the same |
| 06/30/2011 | US20110155440 Circuit board and process for manufacturing the same |
| 06/30/2011 | US20110155435 Method to form lateral pad on edge of wafer |
| 06/30/2011 | US20110155429 Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof |
| 06/30/2011 | US20110155428 Circuit board and manufacturing method thereof |
| 06/30/2011 | US20110155424 Producing electrical circuit patterns using multi-population transformation |
| 06/30/2011 | US20110154664 Structure of circuit board and method for fabricating the same |
| 06/30/2011 | US20110154663 Memory Device |
| 06/30/2011 | US20110154662 Method of manufacturing electronic cards |
| 06/30/2011 | US20110154661 Method of fabricating printed circuit board assembly |
| 06/30/2011 | US20110154660 Conductive paste composition for inner electrodes and method of manufacturing multilayer ceramic capacitor using the same |
| 06/30/2011 | US20110154659 Optimizing pcb power and ground connections for lead free solder processes |
| 06/30/2011 | US20110154658 Circuit substrate and manufacturing method thereof |
| 06/30/2011 | US20110154657 Manufacturing method of package carrier |
| 06/30/2011 | DE102010020900B3 Verfahren zur Herstellung von Leistungshalbleitersubstraten A process for producing power semiconductor substrates |
| 06/29/2011 | EP2339903A2 Lead plate and protection circuit module having the same |
| 06/29/2011 | EP2339902A1 Printed wiring board connecting structure |
| 06/29/2011 | EP2339901A1 BGA footprint pattern for increasing the number of routing channels per PCB layer |
| 06/29/2011 | EP2339695A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 06/29/2011 | EP2339624A2 Multi-layer interconnection structure manufacturing method thereof |
| 06/29/2011 | EP2338320A1 Protective cover for a flexible printed circuit board |
| 06/29/2011 | EP1584101B1 Semiconductor package having non-ceramic based window frame |
| 06/29/2011 | DE202011000450U1 Steuergerät zum Ansteuern von Leuchtdioden-Modulen Control unit for driving light-emitting diode modules |
| 06/29/2011 | CN201888033U Full-automatic patch mounting/dismounting all-in-one machine based on machine vision |
| 06/29/2011 | CN201888032U Sheet clamp |
| 06/29/2011 | CN201888031U Universal jig for alignment of flexible circuit board and placement carrier |
| 06/29/2011 | CN201888030U Fully automatic pneumatic plate separating machine |
| 06/29/2011 | CN201888029U Positioning clamp for assembling and connecting flexible circuit boards |
| 06/29/2011 | CN201888028U Magnetic locating element used by circuit board for replacing process |
| 06/29/2011 | CN1930927B A method of creating electronic packages |
| 06/29/2011 | CN1824460B Method for determining the position of a milling tool and a machining head designed for carrying out the method |
| 06/29/2011 | CN1810065B Printed wiring board |
| 06/29/2011 | CN102113425A 刚挠性电路板以及电子设备 Rigid wiring board and an electronic device |
| 06/29/2011 | CN102113424A 感应装置和加工方法 Sensing devices and processing methods |
| 06/29/2011 | CN102113423A 基板模块及其制造方法 Base module and its manufacturing method |