Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2012
12/26/2012CN102843870A Flexible circuit board heating and bending mechanism
12/26/2012CN102843869A Vacuum laminating machine of flexible circuit board
12/26/2012CN102843868A Outer-cover type full-automatic flexible plate bending machine
12/26/2012CN102843867A Manual laminating machine of flexible circuit board
12/26/2012CN102843866A Full-automatic hot press of flexible board
12/26/2012CN102843865A Matched bending mechanism of flexible circuit board module
12/26/2012CN102843864A Flexible plate upward jacking and lateral pushing bending mechanism
12/26/2012CN102843863A High precision electric testing and positioning method
12/26/2012CN102843861A Printed circuit board and printed circuit board composite structure
12/26/2012CN102843860A Flex-rigid wiring board and method for manufacturing the same
12/26/2012CN102843858A Line base plate for fixedly providing semiconductor chip and manufacturing method thereof
12/26/2012CN102843856A Flexible circuit board welded with a plurality of conductive contact blocks and manufacture method thereof
12/26/2012CN102843852A Blind slot type high-frequency multilayer board and board laminating method
12/26/2012CN102839411A Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry
12/26/2012CN102838947A Modifier used for adhesive, production method thereof, adhesive, and circuit connection structure body
12/26/2012CN102209438B 高密度柔性线路板及其制作方法 High-density flexible circuit board and its manufacturing method
12/26/2012CN102202466B Copper-clad laminate-based method for micro-removing copper film from selected area by assistance of laser
12/26/2012CN102098880B Surface processing method of PCB (printed circuit board)
12/26/2012CN102088824B Method and system for repairing miniature passive element on printed circuit board (PCB)
12/26/2012CN102036495B Method, device and system for processing printed circuit boards on floating bed
12/26/2012CN102036483B Method and system for forming blind gongs on printed circuit board (PCB) and circuit board
12/26/2012CN102014584B Process for manufacturing whole gold-plated board
12/26/2012CN101998766B Method for manufacturing soft and hard composite board
12/26/2012CN101861056B Method for processing high-density integrated circuit
12/26/2012CN101822132B Substrate with semiconductor element mounted thereon
12/26/2012CN101730387B PCB jointed board clamp
12/26/2012CN101681107B Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
12/26/2012CN101544784B Photocurable resin composition, dry film and cured object thereof, and printed circuit board with the same
12/26/2012CN101371197B Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board
12/25/2012US8338234 Hybrid integrated circuit device and manufacturing method thereof
12/25/2012US8337606 Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface
12/25/2012US8336456 Printing in a medium
12/25/2012US8336203 Printed circuit board and layout method thereof
12/25/2012US8336202 Method of manufacturing a wiring board
12/25/2012US8336201 Method of manufacturing printed circuit board having flow preventing dam
12/20/2012WO2012174384A1 Thermally decomposable polymer compositions incorporating thermally activated base generators
12/20/2012WO2012173654A2 Flexible circuit assembly and method thereof
12/20/2012WO2012173242A1 Photocurable/thermosetting resin composition
12/20/2012WO2012173241A1 Flame-retardant curable resin composition, dry film using same, and printed wiring board
12/20/2012WO2012173059A1 Solder paste
12/20/2012WO2012172972A1 Cross-linked polyimide resin and method for producing same, adhesive resin composition and cured product thereof, cover lay film, circuit board, heat-conductive substrate, and heat-conductive polyimide film
12/20/2012WO2012172890A1 Printed-wiring board, electronic-component mounting structure, and method for manufacturing electronic-component mounting structure
12/20/2012WO2012172854A1 Bonding method and production method
12/20/2012WO2012172792A1 Printed wiring board and method for manufacturing same
12/20/2012WO2012172757A1 Wiring board and wiring board manufacturing method
12/20/2012WO2012171668A1 Printed circuit for interconnecting and measuring battery cells in a battery
12/20/2012WO2012171596A1 Conducting track assembly for a motor vehicle equipment part
12/20/2012WO2012171565A1 Electrical contact device for connecting circuit boards
12/20/2012US20120323098 Connectors for Making Connections Between Analyte Sensors and Other Devices
12/20/2012US20120321781 Pre-treatment process for electroless nickel plating
12/20/2012US20120320558 Electromagnetic Shielding Structures for Selectively Shielding Components on a Substrate
12/20/2012US20120320556 Frame member, frame unit, mounting board unit, and manufacturing method
12/20/2012US20120320550 Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device
12/20/2012US20120320549 Conductor Structural Element and Method for Producing a Conductor Structural Element
12/20/2012US20120320536 Module substrate, module-substrate manufacturing method, and terminal connection substrate
12/20/2012US20120320532 Flexible circuit assembly and method thereof
12/20/2012US20120320085 Display outputting image
12/20/2012US20120319978 Display device
12/20/2012US20120319724 System and methods for generating unclonable security keys in integrated circuits
12/20/2012US20120319562 Led package and manufacturing method thereof
12/20/2012US20120318960 Image Sensor and Method for Packaging Same
12/20/2012US20120318770 Manufacturing method of circuit board
12/20/2012US20120318585 Touch Panel and Method for Manufacturing the Same
12/20/2012US20120318569 Substrates having voltage switchable dielectric materials
12/20/2012US20120318568 Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
12/20/2012US20120318563 Printed circuit board and method of manufacturing the same
12/20/2012US20120318561 Pattern formation method, method for manufacturing electronic device, and electronic device
12/20/2012US20120317806 Method for Forming Package Substrate
12/20/2012US20120317805 Printed Circuit Board Having Aluminum Traces with a Solderable Layer of Material Applied Thereto
12/20/2012US20120317804 Electronic component mounting device and an operation performing method for mounting electronic components
12/20/2012US20120317803 Component mounting device and component mounting method
12/20/2012US20120317801 Reusable electronic circuit assembling and testing system and uses thereof
12/20/2012DE10149559B4 Vorrichtung und Verfahren zur Laserbearbeitung einer gedruckten Verdrahtungsplatte Apparatus and method for laser processing of a printed wiring board
12/19/2012EP2535137A1 Apparatus for and method of providing an inerting gas during soldering
12/19/2012EP2534932A1 Apparatus for manufacturing antennas for radio-frequency identifying devices
12/19/2012EP2534680A1 Component placement on flexible and/or stretchable substrates
12/19/2012EP2534194A1 Sulfite softwood based cellulose triacetate for lcd films
12/19/2012CN202617524U A reflow soldering auxiliary tool of a flexibility printed circuit
12/19/2012CN202617523U Novel guiding mechanism for PCB plate carrier
12/19/2012CN202617522U Semi-automatic connection machine for connecting FPC with glass circuit
12/19/2012CN202617521U Limiting structure for discharge outlet of chip mounter
12/19/2012CN202617520U Automatic bonding machine for connecting chip with glass circuit
12/19/2012CN202617519U Pneumatic device of placement machine
12/19/2012CN202617518U Cleaning device for reducing liquid medicine carry-over amount of FPC horizontal line
12/19/2012CN202617517U Stuck board preventive guide jig
12/19/2012CN202617516U FPC hot-pressing device
12/19/2012CN202617507U Printed circuit board capable of preventing wiring copper foil from being disconnected with dielectric layer under heated condition
12/19/2012CN202615559U Material-receiving confirmation and alarm device for automatic placement machine
12/19/2012CN202615116U Para-position exposure auxiliary mechanism
12/19/2012CN202610377U Multifunctional plating clay target
12/19/2012CN202610330U Double-layer compressing device for front screen at etching section
12/19/2012CN202607035U Multifunctional wave soldering carrier
12/19/2012CN202607024U Reflow soldering machine
12/19/2012CN102835196A Improved backdrilling of multilayer printed circuit boards
12/19/2012CN102835195A Soldering device and cover support/sealing structure
12/19/2012CN102835194A Designed debond interconnect structures
12/19/2012CN102835193A Board and method for manufacturing board
12/19/2012CN102834979A Relief plug-in connector and multilayer circuit board
12/19/2012CN102834474A Two-component, polyaspartic coating compositions
12/19/2012CN102833994A Feeding device for chip mounter