Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2012
11/29/2012US20120300461 Cuttable illuminated panel
11/29/2012US20120300426 Connection structure of printed circuit board, method for producing same, and anisotropic conductive adhesive
11/29/2012US20120300424 Crystal Device Without External Package and Manufacturing Method Thereof
11/29/2012US20120300423 Interconnect formation under load
11/29/2012US20120300421 Electrical feedthrough for implantable medical device
11/29/2012US20120300404 Resin-sealed electronic controller and method of fabricating the same
11/29/2012US20120300140 Patterned conductive layers for sensor assembly and method of making the same
11/29/2012US20120298413 Wiring substrate and method for manufacturing wiring substrate
11/29/2012US20120298412 Printed circuit board and method of manufacturing the same
11/29/2012US20120298410 Interposer Testing Using Dummy Connections
11/29/2012US20120298409 Circuit board and method of manufacturing the same
11/29/2012US20120298402 Method for forming patterned conductive film
11/29/2012US20120297618 Printed circuit boards by massive parallel assembly
11/29/2012US20120297617 Multi-purpose architecture for ccd image sensors
11/29/2012US20120297616 Method for applying soft solder to a mounting surface of a component
11/29/2012US20120297615 Handheld computing device
11/29/2012US20120297609 Rfid label technique
11/29/2012DE102012201324A1 Harz-abgedichteter elektronischer Controller und Verfahren zum Herstellen desselben Of the same resin-sealed electronic controller and methods for preparing
11/29/2012DE102011121221A1 Mehrschichtensubstrat Multilayer substrate
11/29/2012DE102011102555A1 Lotmaterial, Verwendung des Lotmaterials in einer Lotpaste sowie Verfahren zur Herstellung einer Lötverbindung mit Hilfe des Lotmaterials Solder material, the use of the solder material in a solder paste and process for forming a solder connection using the solder material
11/29/2012DE102011076273A1 Leiterplatte für elektrische Bauelemente und Leiterplattensystem Circuit board for electrical components and printed circuit boards
11/29/2012DE102009005570B4 Verfahren zum Herstellen einer Antenne auf einem Substrat A method of manufacturing an antenna on a substrate
11/28/2012EP2528422A1 Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board
11/28/2012EP2528066A1 Electron-beam-curable electrically conductive paste and process for production of circuit board using same
11/28/2012EP2527388A1 Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
11/28/2012EP2525922A1 Method for the application of a conformal nanocoating by means of a low pressure plasma process
11/28/2012CN202565589U Turnover type capacitor welding tooling
11/28/2012CN202565588U Automatic feeder
11/28/2012CN202565587U Cross-positioning device for chip mounter
11/28/2012CN202565586U Indium tin oxide conductive film towing plate of etching station
11/28/2012CN202565585U Waste discharge device for processing flexible circuit board
11/28/2012CN202565584U Water-saving device of printed circuit board (PCB) electroplate coarse grinding line process
11/28/2012CN202565583U Thin plate trough for printing circuit board
11/28/2012CN202565582U High-precision automatic material storage stamping die
11/28/2012CN202565581U Smoothing jig
11/28/2012CN202560763U Surface-mounted fastener
11/28/2012CN202560747U Surface-mounted fastener of printed circuit board
11/28/2012CN202558939U Suspended basket specially for micropore copper chemical deposit
11/28/2012CN202558267U Printed circuit board (PCB) hanging rack
11/28/2012CN202555932U Laser soft soldering device
11/28/2012CN102804941A Circuit arrangement and associated controller for a motor vehicle
11/28/2012CN102804940A Layout of contact pads of a system in package, comprising circuit board and electronic integrated elements
11/28/2012CN102804939A Brazing crucible
11/28/2012CN102804938A Arrangement comprising an electric and/or electronic module and a circuit carrier
11/28/2012CN102804937A Light-emitting device
11/28/2012CN102804936A Method For Producing A Structured Metal Coating
11/28/2012CN102803562A Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles
11/28/2012CN102803384A Composition for film, and adhesive film and cover lay film formed therefrom
11/28/2012CN102802949A Offset printing device
11/28/2012CN102802864A Method of forming microstructures, laser irradiation device, and substrate
11/28/2012CN102802846A Bonding material and bonding method using same
11/28/2012CN102802367A Multilayer board manufacturing method for improving bonding force of hole wall of PTH slot
11/28/2012CN102802366A Degumming method of printed circuit board
11/28/2012CN102802365A Manufacturing method for embedding copper heat sink into circuit board
11/28/2012CN102802364A Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof
11/28/2012CN102802363A Printed circuit board and manufacturing method thereof
11/28/2012CN102802362A Production process of composite circuit board and novel composite circuit board
11/28/2012CN102802361A Making method of semi-flexible printed circuit board
11/28/2012CN102802360A Anti-breakdown isolated laser hole blasting method in PCB processing
11/28/2012CN102802359A Vertical oven with automatic timed door opening device
11/28/2012CN102802358A Method for bonding circuit board reinforcing patches
11/28/2012CN102802357A Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage
11/28/2012CN102802356A Manufacturing method of 3D eyeglass printed circuit board
11/28/2012CN102802355A Mounting jig
11/28/2012CN102802354A Electronic subassembly
11/28/2012CN102802352A Easy-to-be-electroplated COB (chip on board) substrate and manufacturing method thereof
11/28/2012CN102802348A High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board
11/28/2012CN102802346A Liquid-metal printed circuit board and preparation method thereof
11/28/2012CN102802344A Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
11/28/2012CN102802343A Metal printed circuit board having aperture reflection plane and manufacturing method
11/28/2012CN102802341A Multilayer substrate
11/28/2012CN102802340A Structure of single-scrapped contiguous circuit board
11/28/2012CN102800598A Substrate for embedding active element and embedding method
11/28/2012CN102800541A Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof
11/28/2012CN102799078A Auxiliary device achieving identical exposure on both sides of PCB and method
11/28/2012CN102796487A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
11/28/2012CN102796348A Thermosetting resin composition, dry film and printed circuit board (pcb)
11/28/2012CN102794981A Surface mount technology (SMT) template steel plate pneumatic screen frame and matched SMT template steel plate
11/28/2012CN102794529A Blowing motor device with Teflon sealing sheet and bowl type gasket
11/28/2012CN102170755B Process for producing ceramic mobile phone circuit board
11/28/2012CN102131347B Circuit substrate and manufacturing method thereof
11/28/2012CN102036506B Manufacturing method of golden fingers
11/28/2012CN102026498B Method for manufacturing circuit board, circuit board and chip packaging structure
11/28/2012CN101945536B Circuit substrate and manufacturing process thereof, circuit device and manufacturing process thereof
11/28/2012CN101836519B Flex-rigid wiring board and method for manufacturing the same
11/28/2012CN101815401B Circuit board and a fabricating method thereof
11/28/2012CN101658080B Apparatus and method for manufacturing multilayer wiring board
11/28/2012CN101589655B Circuit substrate manufacturing method, and circuit substrate
11/28/2012CN101543150B Multilayer-wired substrate
11/28/2012CN101427126B Print inspection method and device, and printer
11/28/2012CN101417758B Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus
11/28/2012CN101115353B Multilayered printed wiring board and method for manufacturing the same
11/28/2012CN101061760B Flexible printing circuit board and its production method
11/27/2012US8319113 Printed circuit board with reduced dielectric loss
11/27/2012US8318601 Method for manufacturing thin film transistor and display device
11/27/2012US8318047 Method for providing RF powder and RF powder-containing liquid
11/27/2012US8317993 Plating method and apparatus
11/27/2012US8316536 Multi-level circuit substrate fabrication method
11/27/2012US8316535 Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device
11/27/2012US8316534 Method for packaging airtight multi-layer array type LED