Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2012
11/07/2012CN102769994A Flexible circuit board assembly and assembling method thereof
11/07/2012CN102769000A Internal embedded element packaging structure and manufacturing method
11/07/2012CN102766874A Organic solderability preservative (OSP) protective agent for copper surfaces
11/07/2012CN102766870A Etching liquid and method for etching flexible circuit board
11/07/2012CN102300419B Welding method of coaxial diode and circuit board
11/07/2012CN102215641B Manufacturing process of high-density printed board with holes in pads
11/07/2012CN102201390B Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof
11/07/2012CN102164463B Method for pressing multi-layer rigid-flexible combined circuit board
11/07/2012CN101909407B Method for etching V-CUT on iron substrate
11/07/2012CN101902884B Method for making composite material circuit board structure
11/07/2012CN101901975B Connector set and jointer for use therein
11/07/2012CN101868127B Preparation process of superconductive planar circuit
11/07/2012CN101830365B PCB receiving machine push rod with adjustable thrust
11/07/2012CN101815769B Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
11/07/2012CN101730456B Circuit board of communication product and manufacture method thereof
11/07/2012CN101624463B Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board
11/07/2012CN101466555B Method for manufacturing screen printing mask with resin, and screen printing mask with resin
11/07/2012CN101288350B Multilayered printed circuit board and method for manufacturing the same
11/07/2012CN101010994B Method for manufacturing an electronics module
11/06/2012US8304883 Semiconductor device having multiple semiconductor elements
11/06/2012US8304325 Substrate dividing method
11/06/2012US8304015 Depositing droplets of resin liquid by inkjet method; width and film thickness of resin film pattern can be made uniform without the occurrence of bulges or jagged portions in the resin film
11/06/2012US8302303 Process for producing a contact piece
11/06/2012US8302289 Apparatus for preparing an antenna for use with a wireless communication device
11/06/2012US8302277 Module and manufacturing method thereof
11/01/2012WO2012149284A1 Vacuum pallet reflow
11/01/2012WO2012148332A1 Manufacturing method for printed circuit boards
11/01/2012WO2012147870A1 Novel flexible printed circuit integrated with conductive layer
11/01/2012WO2012147803A1 Circuit substrate having noise suppression structure
11/01/2012WO2012147745A1 Novel photosensitive resin composition and use thereof
11/01/2012WO2012147550A1 Flexible multilayer substrate
11/01/2012WO2012147484A1 Rigid-flexible substrate and method for manufacturing same
11/01/2012WO2012147412A1 Flexible circuit and method for manufacturing same
11/01/2012WO2012147314A1 Method for producing reuse paste and reuse paste
11/01/2012WO2012147313A1 Method for producing circuit board
11/01/2012WO2012147243A1 Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
11/01/2012WO2012147235A1 Method for producing transparent printed wiring board, and method for producing transparent touch panel
11/01/2012WO2012146754A1 Snap connector maintaining stable contact
11/01/2012WO2012146547A1 Printed circuit board arrangement comprising an oscillatory system
11/01/2012WO2012146544A1 Electrical arrangement having a coating and gear arrangement having such an arrangement
11/01/2012WO2012146507A1 Contact surface arranged on a carrier for connecting to a counter contact surface arranged on a further carrier, and device comprising a contact surface and a counter contact surface connected thereto
11/01/2012WO2012146468A1 Lighting device and method for producing a lighting device
11/01/2012WO2012087060A3 Printed circuit board and method for manufacturing the same
11/01/2012US20120276951 Low rise camera module
11/01/2012US20120276776 Electrical connector
11/01/2012US20120276761 Header connector assembly
11/01/2012US20120276754 Methods and systems for thermal-based laser processing a multi-material device
11/01/2012US20120276372 Multilayer thin film for ceramic electronic component and method of manufacturing the same
11/01/2012US20120275124 Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
11/01/2012US20120275119 Method and products related to deposited particles
11/01/2012US20120275117 Apparatus and method for embedding components in small-form-factor, system-on-packages
11/01/2012US20120274998 Security device
11/01/2012US20120274800 Multi-media device containing a plurality of image capturing devices
11/01/2012US20120273294 Power steering system and method for assembling the power steering system
11/01/2012US20120273263 Conductive Formulations For Use In Electrical, Electronic And RF Applications
11/01/2012US20120273262 Transparent conductive structure applied to a touch panel and method of making the same
11/01/2012US20120273261 Circuit substrate having a circuit pattern and method for making the same
11/01/2012US20120273256 Transparent conductive structure applied to a touch panel and method of making the same
11/01/2012US20120273034 Metal substrate with insulation layer and manufacturing method thereof, semiconductor device and manufacturing method thereof, solar cell and manufacturing method thereof, electronic circuit and manufacturing method thereof, and light-emitting element and manufacturing method thereof
10/2012
10/31/2012EP2519090A1 Method of manufacturing circuit board
10/31/2012EP2519089A1 Circuit module
10/31/2012EP2519088A1 Conductive connection material, electronic component producing method, and electronic member and electronic component with conductive connection material
10/31/2012EP2519087A1 Cover for encapsulating a system with electrical connections, manufacturing process therefore, encapsulated system comprising such a cover and piling of such systems
10/31/2012EP2519085A1 Many-up wiring substrate, wiring substrate, and electronic device
10/31/2012EP2519084A1 Assembly structure for injection molded substrate and for mounting component
10/31/2012EP2519083A1 Flexible circuit board and manufacturing method thereof
10/31/2012EP2516550A1 Aromatic polycarbonate composition
10/31/2012EP2516506A1 Semiaromatic polyamide, process for preparing same, composition comprising such a polyamide and uses thereof
10/31/2012EP2516172A1 Aromatic polycarbonate composition
10/31/2012DE112010005175T5 Elektronisches Modul und Kommunikationsvorrichtung Electronic module and communication apparatus
10/31/2012DE112010003967T5 Bauteil-Montagesystem und Bauteil-Montageverfahren Component mounting system and component mounting method
10/31/2012DE112004001671B4 Rühr-/Entlüftungsvorrichtung Agitation /
10/31/2012DE102012207107A1 Multi-layer circuit board for electronic circuit unit mounted in vehicle, has outermost resin layer whose coefficient of thermal conductivity is greater than thermal conductivity of inner resin layer
10/31/2012DE102011075009A1 Auf einem Träger angeordnete Kontaktfläche zur Verbindung mit einer auf einem weiteren Träger angeordneten Gegenkontaktfläche und Vorrichtung mit einer Kontaktfläche und einer damit verbundenen Gegenkontaktfläche Arranged on a carrier contact face for connection to a further carrier which is arranged on a counter-contact surface, and with a contact surface and an associated counter-contact surface
10/31/2012DE102011017790A1 Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung A lighting apparatus and method for manufacturing a lighting device
10/31/2012DE102011017746A1 Method for electrical and mechanical connection of transformer on printed circuit board to power clamp for supplying power to transformer, involves turning screw until main surface of contact of component contacts power clamp
10/31/2012DE102011017692A1 Leiterplattenanordnung mit einem schwingfähigen System PCB assembly with an oscillatory system
10/31/2012CN202514176U Automatic control system for light emitting diode (LED) chip mounter
10/31/2012CN202514175U Light-emitting diode (LED) chip mounter
10/31/2012CN202514174U LED mounter board feeding automatic control system
10/31/2012CN202514173U Printed circuit board (PCB) breaker of lamp
10/31/2012CN202514172U Molding mould with high and low punch pins
10/31/2012CN202514171U Two-surface exposed-conductor single-layer FPC direct-target-punching contraposition hole apparatus
10/31/2012CN202508556U PCB (Printed Circuit Board) substrate automatic on-line device
10/31/2012CN202506925U Intelligent scaling powder atomizing machine
10/31/2012CN202506920U Micro reflow soldering platform capable of improving utilization rate of heat source
10/31/2012CN102763494A Conductor structural element and method for producing a conductor structural element
10/31/2012CN102763493A Printed circuit board having aluminum traces with a solderable layer of material of applied thereto
10/31/2012CN102763492A Metallization having high power compatibility and high electrical conductivity
10/31/2012CN102763277A 复合印刷布线基板及无线通信系统 Complex printed circuit board and a wireless communication system
10/31/2012CN102763036A Layered structure and light-sensitive dry film used in same
10/31/2012CN102762627A Two-liquid mixing first and second liquids and method for producing printed circuit board
10/31/2012CN102762382A Screen stretch frame
10/31/2012CN102762041A Method for post-processing blind hole of circuit board
10/31/2012CN102762040A Method for forming golden fingers on PCB (printed circuit board) and processing method of PCB
10/31/2012CN102762039A Circuit board and manufacture method thereof
10/31/2012CN102762038A Automatic assembling machine of PCB (Public Circuit Board) terminal
10/31/2012CN102762037A Ceramic circuit board and manufacturing method thereof
10/31/2012CN102762036A Method for circuit manufacture of ultra-thin inner-layer board
10/31/2012CN102762035A Method of manufacturing circuit board
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