Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2013
01/23/2013CN202693998U Compound type film alignment work bench
01/23/2013CN202693996U Locating tool for reworking circuit board green oil exposure alignment
01/23/2013CN202688496U Printed circuit board electroplating clamp
01/23/2013CN202684270U Adjusting device of wave-welding jet-flow groove
01/23/2013CN202684268U Semi-automatic immersion tin device of immersion tin machine
01/23/2013CN1722930B Flexible circuit substrate
01/23/2013CN102893711A Wiring method, construction being wired on the surface thereof, semiconductor device, printed circuit board, memory card, electrical device, module, and multi-layered circuit board
01/23/2013CN102893710A Pcb antenna layout
01/23/2013CN102893709A A method for manufacturing a base material having gold-coated metallic fine pattern, a base material having gold-coated metallic fine pattern, a printed wiring board, an interposer and a semiconductor device
01/23/2013CN102893708A Wiring substrate, method for manufacturing wiring substrate, and via paste
01/23/2013CN102893344A Electronic component to be embedded in substrate and component embedded substrate
01/23/2013CN102892847A Conductive metal ink composition, and method for forming a conductive pattern
01/23/2013CN102892541A Insulation body for reflow device
01/23/2013CN102892277A Circuit board device and manufacture method thereof, and power supply with same
01/23/2013CN102892257A Method for locally burying PCB (Printed Circuit Board) daughter board in PCB
01/23/2013CN102892256A Method for mounting electronic element on surface of printed circuit board
01/23/2013CN102892255A Machining assembly line for printed circuit board (PCB) insert
01/23/2013CN102892254A Machining process and device of printed circuit board
01/23/2013CN102892253A Conductive and insulation ink circuit board and processing method thereof
01/23/2013CN102892252A Method for manufacturing three-dimensional circuit
01/23/2013CN102892250A Printed circuit board and manufacturing method thereof
01/23/2013CN102892249A Processing method for single-point grounding of printed circuit board (PCB)
01/23/2013CN102891116A Embedded element packaging structure and manufacturing method thereof
01/23/2013CN102355799B Width regulating device and surface mounting peripheral device
01/23/2013CN102159025B 电子组件及其制造方法 Electronic components and manufacturing method thereof
01/23/2013CN102143649B PCB board with heat radiation structure and processing method thereof
01/23/2013CN102138104B Photosensitive resin composition for protective film of printed wiring board for semiconductor package
01/23/2013CN102131350B Circuit board and manufacturing process thereof
01/23/2013CN102086365B Adhesive, preparation method and application in integrated circuit board embedment thereof
01/23/2013CN102076207B Method for manufacturing electronic assembly
01/23/2013CN102065640B Method for reducing warping in assembly of circuit board
01/23/2013CN102056404B Method for neutralizing capacitance of through hole
01/23/2013CN102045965B Lamination manufacturing method for imbedded inductance magnet ring
01/23/2013CN102026470B 电路板和电子组件 Circuit boards and electronic components
01/23/2013CN102014585B Process for plating gold on long and short gold fingers
01/23/2013CN101964249B Power induction structure
01/23/2013CN101960934B Multilayer printed wiring board
01/23/2013CN101911852B Multilayer printed wiring board and mounting body using the same
01/23/2013CN101903959B Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
01/23/2013CN101754591B Bonding tool, electronic component mounting apparatus and electronic component mounting method
01/23/2013CN101687390B Process for producing metal layer laminate with metal surface roughened layer
01/23/2013CN101443486B Method, clip and device for transporting an article to be treated in an electrolytic system
01/23/2013CN101312310B Maintenance structure of vibrating motor and the vibrating motor
01/22/2013US8358509 Reduced wiring requirements with signal slope manipulation
01/22/2013US8356406 Electronic device and method of manufacturing same
01/22/2013US8356405 Method of manufacturing printed circuit board
01/22/2013CA2520992C Method for manufacturing an electronic module and an electronic module
01/21/2013CA2779885A1 Grooved circuit board accommodating mixed-size components
01/17/2013WO2013008919A1 Ceramic circuit board
01/17/2013WO2013008799A1 Droplet discharge device and method
01/17/2013WO2013008703A1 Flexible printed wiring board for mounting led light-emitting element, flexible printed wiring board with led light-emitting element mounted thereto, and illumination device
01/17/2013WO2013008651A1 Circuit board and electronic device
01/17/2013WO2013008592A1 Wiring board
01/17/2013WO2013008590A1 Method for manufacturing substrate and substrate manufacturing device
01/17/2013WO2013008552A1 Wiring board incorporating electronic component, and method for manufacturing wiring board incorporating electronic component
01/17/2013WO2013008505A1 Method for reducing cuprous oxide particle, conductor, method for forming wiring pattern, electronic component, and wiring substrate
01/17/2013WO2013008415A1 Wiring board and method for manufacturing three-dimensional wiring board
01/17/2013WO2013007449A1 Method for populating a printed circuit board
01/17/2013WO2013007363A1 Process for the production of a layered body and layered bodies without masking obtainable therefrom
01/17/2013WO2013007362A1 Process for the production of a layered body and layered bodies obtainable therefrom
01/17/2013WO2013007083A1 Two-layer printed circuit board, printing method thereof, and mobile communication terminal
01/17/2013WO2013007032A1 Connecting structure of printed circuit boards and connecting method thereof
01/17/2013US20130018251 Sensor device with flexible joints
01/17/2013US20130017704 Processor loading system
01/17/2013US20130016480 Printed circuit board having heat gathering structures and manufacturing process thereof
01/17/2013US20130016478 Electronic package with thermal vias, and fabrication process
01/17/2013US20130015936 Converter and method for manufacturing the same
01/17/2013US20130015900 Countermeasure method and device for protecting data circulating in an electronic microcircuit
01/17/2013US20130015234 Method of Forming a Package Substrate
01/17/2013US20130015167 Substrate dividing method
01/17/2013US20130014982 Wiring board and method for manufacturing the same
01/17/2013US20130014979 Connector Structures and Methods
01/17/2013US20130014977 Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed Laminate
01/17/2013US20130014976 Wired circuit board and producing method thereof
01/17/2013US20130014595 Force sensor assembly and method for assembling a force sensor assembly
01/17/2013US20130014386 Mounting apparatus, coating apparatus, mounting method, coating method, and program
01/17/2013US20130014382 Method and system for manufacturing an electronic interface apparatus
01/17/2013DE112010004864T5 Montagestruktur für elektronische Bauteile Mounting structure for electronic components
01/17/2013DE102011107193A1 Elektrische Vorrichtung An electrical device
01/17/2013DE102011016453A1 Verfahren zur Herstellung einer Siebdruckform und damit hergestellte Solarzelle A method for producing a screen printing forme, and thus produced solar cell
01/16/2013EP2547184A1 Inductive coupling structure, multi-layer transmission-line plate, method of manufacturing inductive coupling structure, and method of manufacturing multi-layer transmission-line plate
01/16/2013EP2547183A1 Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof
01/16/2013EP2547182A1 Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof
01/16/2013EP2546899A1 Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module
01/16/2013EP2546869A1 Semiconductor device, and process for manufacture of semiconductor device
01/16/2013EP2546387A1 Adhesion promotion of metal to laminate with a multi-functional compound
01/16/2013EP2545755A1 Circuit board with anchored underfill
01/16/2013EP2545754A2 Attachment of a device to a substrate for operation under variable conditions
01/16/2013EP2545753A1 Method for the treatment of a metal contact formed on a substrate
01/16/2013EP2544598A1 Waterproof stretchable optoelectronics
01/16/2013CN202679907U Plug-in element leakage-proof device
01/16/2013CN202679814U Auxiliary tool for golden finger plug chamfering of circuit board
01/16/2013CN202679813U Automatic board brusher for PCB board
01/16/2013CN202679812U Conveying return device of PCB (printed circuit board) wave soldering jig
01/16/2013CN202679811U Wave-soldering jig
01/16/2013CN202679810U Automatic chip mounter
01/16/2013CN202679809U Board-dividing and forming integrated machine
01/16/2013CN202679808U Improved structure of stitching pad
01/16/2013CN202679807U Prepressing system of a flexible circuit board
01/16/2013CN202679806U Novel hydraulic copper-foil conducting press machine