Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/23/2013 | CN202693998U Compound type film alignment work bench |
01/23/2013 | CN202693996U Locating tool for reworking circuit board green oil exposure alignment |
01/23/2013 | CN202688496U Printed circuit board electroplating clamp |
01/23/2013 | CN202684270U Adjusting device of wave-welding jet-flow groove |
01/23/2013 | CN202684268U Semi-automatic immersion tin device of immersion tin machine |
01/23/2013 | CN1722930B Flexible circuit substrate |
01/23/2013 | CN102893711A Wiring method, construction being wired on the surface thereof, semiconductor device, printed circuit board, memory card, electrical device, module, and multi-layered circuit board |
01/23/2013 | CN102893710A Pcb antenna layout |
01/23/2013 | CN102893709A A method for manufacturing a base material having gold-coated metallic fine pattern, a base material having gold-coated metallic fine pattern, a printed wiring board, an interposer and a semiconductor device |
01/23/2013 | CN102893708A Wiring substrate, method for manufacturing wiring substrate, and via paste |
01/23/2013 | CN102893344A Electronic component to be embedded in substrate and component embedded substrate |
01/23/2013 | CN102892847A Conductive metal ink composition, and method for forming a conductive pattern |
01/23/2013 | CN102892541A Insulation body for reflow device |
01/23/2013 | CN102892277A Circuit board device and manufacture method thereof, and power supply with same |
01/23/2013 | CN102892257A Method for locally burying PCB (Printed Circuit Board) daughter board in PCB |
01/23/2013 | CN102892256A Method for mounting electronic element on surface of printed circuit board |
01/23/2013 | CN102892255A Machining assembly line for printed circuit board (PCB) insert |
01/23/2013 | CN102892254A Machining process and device of printed circuit board |
01/23/2013 | CN102892253A Conductive and insulation ink circuit board and processing method thereof |
01/23/2013 | CN102892252A Method for manufacturing three-dimensional circuit |
01/23/2013 | CN102892250A Printed circuit board and manufacturing method thereof |
01/23/2013 | CN102892249A Processing method for single-point grounding of printed circuit board (PCB) |
01/23/2013 | CN102891116A Embedded element packaging structure and manufacturing method thereof |
01/23/2013 | CN102355799B Width regulating device and surface mounting peripheral device |
01/23/2013 | CN102159025B 电子组件及其制造方法 Electronic components and manufacturing method thereof |
01/23/2013 | CN102143649B PCB board with heat radiation structure and processing method thereof |
01/23/2013 | CN102138104B Photosensitive resin composition for protective film of printed wiring board for semiconductor package |
01/23/2013 | CN102131350B Circuit board and manufacturing process thereof |
01/23/2013 | CN102086365B Adhesive, preparation method and application in integrated circuit board embedment thereof |
01/23/2013 | CN102076207B Method for manufacturing electronic assembly |
01/23/2013 | CN102065640B Method for reducing warping in assembly of circuit board |
01/23/2013 | CN102056404B Method for neutralizing capacitance of through hole |
01/23/2013 | CN102045965B Lamination manufacturing method for imbedded inductance magnet ring |
01/23/2013 | CN102026470B 电路板和电子组件 Circuit boards and electronic components |
01/23/2013 | CN102014585B Process for plating gold on long and short gold fingers |
01/23/2013 | CN101964249B Power induction structure |
01/23/2013 | CN101960934B Multilayer printed wiring board |
01/23/2013 | CN101911852B Multilayer printed wiring board and mounting body using the same |
01/23/2013 | CN101903959B Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
01/23/2013 | CN101754591B Bonding tool, electronic component mounting apparatus and electronic component mounting method |
01/23/2013 | CN101687390B Process for producing metal layer laminate with metal surface roughened layer |
01/23/2013 | CN101443486B Method, clip and device for transporting an article to be treated in an electrolytic system |
01/23/2013 | CN101312310B Maintenance structure of vibrating motor and the vibrating motor |
01/22/2013 | US8358509 Reduced wiring requirements with signal slope manipulation |
01/22/2013 | US8356406 Electronic device and method of manufacturing same |
01/22/2013 | US8356405 Method of manufacturing printed circuit board |
01/22/2013 | CA2520992C Method for manufacturing an electronic module and an electronic module |
01/21/2013 | CA2779885A1 Grooved circuit board accommodating mixed-size components |
01/17/2013 | WO2013008919A1 Ceramic circuit board |
01/17/2013 | WO2013008799A1 Droplet discharge device and method |
01/17/2013 | WO2013008703A1 Flexible printed wiring board for mounting led light-emitting element, flexible printed wiring board with led light-emitting element mounted thereto, and illumination device |
01/17/2013 | WO2013008651A1 Circuit board and electronic device |
01/17/2013 | WO2013008592A1 Wiring board |
01/17/2013 | WO2013008590A1 Method for manufacturing substrate and substrate manufacturing device |
01/17/2013 | WO2013008552A1 Wiring board incorporating electronic component, and method for manufacturing wiring board incorporating electronic component |
01/17/2013 | WO2013008505A1 Method for reducing cuprous oxide particle, conductor, method for forming wiring pattern, electronic component, and wiring substrate |
01/17/2013 | WO2013008415A1 Wiring board and method for manufacturing three-dimensional wiring board |
01/17/2013 | WO2013007449A1 Method for populating a printed circuit board |
01/17/2013 | WO2013007363A1 Process for the production of a layered body and layered bodies without masking obtainable therefrom |
01/17/2013 | WO2013007362A1 Process for the production of a layered body and layered bodies obtainable therefrom |
01/17/2013 | WO2013007083A1 Two-layer printed circuit board, printing method thereof, and mobile communication terminal |
01/17/2013 | WO2013007032A1 Connecting structure of printed circuit boards and connecting method thereof |
01/17/2013 | US20130018251 Sensor device with flexible joints |
01/17/2013 | US20130017704 Processor loading system |
01/17/2013 | US20130016480 Printed circuit board having heat gathering structures and manufacturing process thereof |
01/17/2013 | US20130016478 Electronic package with thermal vias, and fabrication process |
01/17/2013 | US20130015936 Converter and method for manufacturing the same |
01/17/2013 | US20130015900 Countermeasure method and device for protecting data circulating in an electronic microcircuit |
01/17/2013 | US20130015234 Method of Forming a Package Substrate |
01/17/2013 | US20130015167 Substrate dividing method |
01/17/2013 | US20130014982 Wiring board and method for manufacturing the same |
01/17/2013 | US20130014979 Connector Structures and Methods |
01/17/2013 | US20130014977 Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed Laminate |
01/17/2013 | US20130014976 Wired circuit board and producing method thereof |
01/17/2013 | US20130014595 Force sensor assembly and method for assembling a force sensor assembly |
01/17/2013 | US20130014386 Mounting apparatus, coating apparatus, mounting method, coating method, and program |
01/17/2013 | US20130014382 Method and system for manufacturing an electronic interface apparatus |
01/17/2013 | DE112010004864T5 Montagestruktur für elektronische Bauteile Mounting structure for electronic components |
01/17/2013 | DE102011107193A1 Elektrische Vorrichtung An electrical device |
01/17/2013 | DE102011016453A1 Verfahren zur Herstellung einer Siebdruckform und damit hergestellte Solarzelle A method for producing a screen printing forme, and thus produced solar cell |
01/16/2013 | EP2547184A1 Inductive coupling structure, multi-layer transmission-line plate, method of manufacturing inductive coupling structure, and method of manufacturing multi-layer transmission-line plate |
01/16/2013 | EP2547183A1 Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
01/16/2013 | EP2547182A1 Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof |
01/16/2013 | EP2546899A1 Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module |
01/16/2013 | EP2546869A1 Semiconductor device, and process for manufacture of semiconductor device |
01/16/2013 | EP2546387A1 Adhesion promotion of metal to laminate with a multi-functional compound |
01/16/2013 | EP2545755A1 Circuit board with anchored underfill |
01/16/2013 | EP2545754A2 Attachment of a device to a substrate for operation under variable conditions |
01/16/2013 | EP2545753A1 Method for the treatment of a metal contact formed on a substrate |
01/16/2013 | EP2544598A1 Waterproof stretchable optoelectronics |
01/16/2013 | CN202679907U Plug-in element leakage-proof device |
01/16/2013 | CN202679814U Auxiliary tool for golden finger plug chamfering of circuit board |
01/16/2013 | CN202679813U Automatic board brusher for PCB board |
01/16/2013 | CN202679812U Conveying return device of PCB (printed circuit board) wave soldering jig |
01/16/2013 | CN202679811U Wave-soldering jig |
01/16/2013 | CN202679810U Automatic chip mounter |
01/16/2013 | CN202679809U Board-dividing and forming integrated machine |
01/16/2013 | CN202679808U Improved structure of stitching pad |
01/16/2013 | CN202679807U Prepressing system of a flexible circuit board |
01/16/2013 | CN202679806U Novel hydraulic copper-foil conducting press machine |