Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2013
02/28/2013US20130047428 Method of manufacturing touch panel
02/28/2013US20130047427 Electronic component mounting system and electronic component mounting method
02/28/2013US20130047418 Method of manufacturing multilayer printed circuit board
02/28/2013DE19842237B4 Befestigungsanordnung für eine Zusatzleiterplatte auf einer Mutterleiterplatte Mounting arrangement for an additional circuit board on a mother board
02/28/2013DE112005002507B4 Verfahren und Vorrichtung zum Tragen und Einspannen eines Substrats Method and device for supporting and clamping a substrate
02/28/2013DE10324047B4 Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit Electronic unit as well as methods for producing an electronic unit
02/28/2013DE10323761B4 Vorrichtung zur Aufbringung und Trocknung einer Beschichtung auf einer Leiterplatte Device for applying and drying a coating on a printed circuit board
02/28/2013DE102012102804B3 Switching element for e.g. electrochromic display of e.g. children toy, has spacer formed such that switching portion applies compressive force on substrate layers to make conductors to contact in closed switch position
02/28/2013DE102011111488A1 Leiterplattensystem Printed circuit boards
02/28/2013DE102011111294A1 Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung A method for the treatment of plastic substrates and apparatus for regenerating a processing solution
02/28/2013DE102011110799A1 Substrat für den Aufbau elektronischer Elemente Substrate for the development of electronic elements
02/28/2013CA2845822A1 Method of forming a conductive image on a non-conductive surface
02/27/2013EP2563106A2 Lead component holder and electronic device
02/27/2013EP2563105A1 Printed substrate manufacturing method and printed substrate employing same
02/27/2013EP2563104A1 Substrate and substrate production method
02/27/2013EP2563103A1 Wiring substrate, method for manufacturing wiring substrate, and via paste
02/27/2013EP2562470A2 A method of producing a lighting device, and a corresponding lighting device
02/27/2013EP2562000A1 Method and apparatus for printing a multilayer pattern
02/27/2013EP2561731A1 Metal core circuit board with conductive pins
02/27/2013EP2561730A1 Transfer method for producing conductor structures by means of nano-inks
02/27/2013EP2561729A1 Printed circuit board with cavity
02/27/2013CN202759673U Printing tool and SMT printing machine
02/27/2013CN202759672U Support used for welding electronic components
02/27/2013CN202759671U Screen printing apparatus in electronic component installing system
02/27/2013CN202759670U Chip mounter
02/27/2013CN202759669U A subsequent etch compensation device of PCB board production
02/27/2013CN202759668U Chemical liquid adding device
02/27/2013CN202759667U Basic pressure system of flexible circuit board
02/27/2013CN202759661U Printed circuit board and electronic equipment
02/27/2013CN202759660U Electroless nickel/immersion gold (ENIG) printed circuit board
02/27/2013CN202755089U Plate hanging device used for printed circuit board (PCB) plating
02/27/2013CN202755087U Novel rack
02/27/2013CN202755086U Electroplating clamp of integrated circuit board
02/27/2013CN202751369U Dust adhering drum
02/27/2013CN1777655B Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards
02/27/2013CN102948269A Hbn insulator layers and associated methods
02/27/2013CN102948267A Transfer method for producing conductor structures by means of nano-inks
02/27/2013CN102948266A Printed circuit board with cavity
02/27/2013CN102948265A Bonded material, and process for production thereof
02/27/2013CN102948021A Tape adhesion device and tape adhesion method
02/27/2013CN102947103A Screen-printing stencil having amorphous carbon films and manufacturing method therefor
02/27/2013CN102947093A Method of manufacturing a radio frequency identification device
02/27/2013CN102947083A Foil laminate intermediate and method of manufacturing
02/27/2013CN102946698A Method for preventing lamination deviation in plate superposing method
02/27/2013CN102946697A Film circuit board manufacturing method and film circuit board
02/27/2013CN102946696A Method for improving slotting reliability of metalized footstep in PCB (Printed Circuit Board)
02/27/2013CN102946695A Through hole structure, printed circuit board, and manufacture method of through hole structure
02/27/2013CN102946694A Surface mounting technology for components of integrated electronic modules
02/27/2013CN102946693A Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof
02/27/2013CN102946692A Circuit board assembly and riveting tool thereof
02/27/2013CN102946691A Method for producing printed circuit board (PCB) with locally metalized stepped groove
02/27/2013CN102946690A Method for manufacturing circuit board
02/27/2013CN102946689A Metal lead framework integrated structure for assembling components by wave soldering and manufacture method of metal lead framework integrated structure
02/27/2013CN102946687A Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof
02/27/2013CN102944977A Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same
02/27/2013CN102942881A Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
02/27/2013CN102942823A Manufacture method of conductive ink and paper-based conductive circuit
02/27/2013CN102215627B Multilayer circuit board
02/27/2013CN101995772B Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
02/27/2013CN101873769B Method for forming welding convex block
02/27/2013CN101801156B Method for manufacturing flexible printed circuit board and structure thereof
02/27/2013CN101768357B Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product
02/27/2013CN101657073B Multi-power-supply PCB composite panel
02/27/2013CN101604641B Carrying method and carrying device of conductive ball
02/26/2013US8385073 Folded system-in-package with heat spreader
02/26/2013US8383952 Printed compatible designs and layout schemes for printed electronics
02/26/2013US8381395 Method for determining pick-up positions of electronic components
02/26/2013US8381394 Circuit board with embedded component and method of manufacturing same
02/21/2013WO2013024929A1 Method for fabricating light-curable inkjet ink for a battery or capacitor using an ultra-high-molecular-weight polymer layer
02/21/2013WO2013024683A1 Bus bar cutting mechanism, method of cutting bus bar, and vehicle interior illumination lamp
02/21/2013WO2013024280A1 High resolution printing
02/21/2013WO2013024038A1 Electronic module, lighting device and manufacturing method of the electronic module
02/21/2013WO2013023812A1 Method for metallizing polymer layer systems, and polymer layer systems
02/21/2013WO2013023388A1 Embeded circuit board and method for manufacturing the same
02/21/2013WO2012169550A9 Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate
02/21/2013US20130044470 Three-dimensional tensile and helical circuit board for light-emitting diode lamp and manufacturing method thereof
02/21/2013US20130044448 Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement
02/21/2013US20130044442 Sensor having damping
02/21/2013US20130044431 Liquid cooling of stacked die through substrate lamination
02/21/2013US20130043967 Rogowski coil assemblies and methods for providing the same
02/21/2013US20130043865 Pair comprising printed circuit board and further board and method for measuring current intensity
02/21/2013US20130043068 Touch panel and manufacturing method thereof
02/21/2013US20130043061 Circuit structure of electronic device and its manufacturing method
02/21/2013US20130042472 Method of manufacturing a printed circuit board having embedded electronic components
02/21/2013DE102011080934A1 Verfahren zum Metallisieren von Polymerschichtsystemen und Polymerschichtsysteme Method for metallizing layer polymer systems and polymer coating systems
02/20/2013EP2560468A1 Method of connecting elements of a plurality of elements to one another
02/20/2013EP2560467A1 Method for mounting a component to an electric circuit board, electric circuit board and electric circuit board arrangement
02/20/2013EP2560466A1 Board and method for manufacturing board
02/20/2013EP2560027A1 Connection substrate
02/20/2013EP2559327A1 Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein
02/20/2013EP2558605A1 Method for recycling of obsolete printed circuit boards
02/20/2013CN202750347U Tool device used for welding circuit board and keyboard plate
02/20/2013CN202750346U Tool equipment for bluetooth socket welded fastening
02/20/2013CN202750345U Circuit board fixing clamp
02/20/2013CN202750344U SMT (Surface Mounted Technology) circuit board receiving machine with cooling function
02/20/2013CN202750343U Device for controlling cooling time of printed circuit board assembly (PCBA)
02/20/2013CN202750342U Wear-resistant wave-soldering fixture
02/20/2013CN202750341U SMT (surface-mount technology) multi-panel jig
02/20/2013CN202750340U PCB concave pit repairing rod
02/20/2013CN202750339U PCB board soaking device