Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2012
10/24/2012CN102098879B Method for drilling internal layer thick copper plate
10/24/2012CN101803483B Process for producing multilayer printed wiring board
10/24/2012CN101790287B Manufacturing process for quickly interconnecting electronic components
10/24/2012CN101720165B Component built-in wiring substrate and manufacturing method thereof
10/24/2012CN101233793B method for manufacturing solder mounting structure and braze installation method thereof
10/24/2012CN101117275B Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
10/24/2012CN101080138B Printed wiring board, method for forming the printed wiring board, and board interconnection structure
10/23/2012US8294039 Surface finish structure of multi-layer substrate and manufacturing method thereof
10/23/2012US8293579 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
10/23/2012US8291586 Method for bonding two electronic components
10/23/2012US8291585 Method for manufacturing electronic component
10/23/2012US8291584 Method of manufacturing a printed wiring board with built-in electronic component
10/23/2012US8291583 Packaging method for assembling captive screw to printed circuit board
10/23/2012CA2472336C Technique for accommodating electronic components on a multilayer signal routing device
10/22/2012DE202010017772U1 Leiterplatte mit Kühlfluidkanal PCB with coolant channel
10/18/2012WO2012141331A1 Lead-free solder alloy
10/18/2012WO2012141278A1 Through-hole substrate and method of producing the same
10/18/2012WO2012141153A1 Photocurable resin composition, dry film, cured product, and printed wiring board
10/18/2012WO2012141124A1 Curable resin composition, cured product thereof and printed circuit board using same
10/18/2012WO2012141096A1 Flexible multilayer substrate
10/18/2012WO2012140964A1 Flexible multilayer substrate with built-in electronic components
10/18/2012WO2012140908A1 Laminate sheet, circuit board, and semiconductor package
10/18/2012WO2012140907A1 Laminate sheet, circuit board, semiconductor package, and method for producing laminate sheet
10/18/2012WO2012140744A1 Molded circuit component
10/18/2012WO2012140428A1 Improvements in and relating to transparent components
10/18/2012WO2012066018A3 Metal coating of objects using a plasma polymerisation pretreatment
10/18/2012US20120264238 Program controlled dicing of a substrate using a pulsed laser beam
10/18/2012US20120263868 Interconnect Structure to Reduce Stress Induced Voiding Effect
10/18/2012US20120263412 Optical Printed Circuit Board and Method of Fabricating the Same
10/18/2012US20120263209 Flexible temperature sensor and sensor array
10/18/2012US20120262892 Electronic unit case and method of manufacturing electronic unit
10/18/2012US20120262826 Directing the Flow of Electrostatic Discharge (ESD) Current to a Targeted Impedance Using Nested Plates
10/18/2012US20120262385 Touch panel and method for fabricating the same
10/18/2012US20120262382 Panel
10/18/2012US20120261823 Interconnect structures with engineered dielectrics with nanocolumnar porosity
10/18/2012US20120261801 Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board
10/18/2012US20120261267 Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids
10/18/2012US20120261179 Interposer substrate and method of manufacturing the same
10/18/2012US20120261173 Method for shielding printed circuit board and printed circuit board
10/18/2012US20120261172 Structure and pattern forming method of transparent conductive circuit
10/18/2012US20120261166 Printed circuit board and method of manufacturing the same
10/18/2012US20120261165 Interconnect device and method of fabricating same
10/18/2012US20120261067 Method for manufacturing a microfluidic sensor
10/18/2012US20120260502 Method for making circuit board
10/18/2012US20120260501 Method for manufacturing rigid-flexible printed circuit board
10/18/2012US20120260500 Monolithic Capacitive Transducer
10/18/2012US20120260499 Mounting method for mounting a circuit board in a housing and associated mounting tool
10/18/2012DE112011100208T5 Siebdruckmaschine Screen printing machine
10/18/2012DE112010004888T5 Substrat für IC-Bausteine mit Mehrschichtglaskern und Verfahren zu seiner Herstellung Substrate for IC devices with multi-layer core glass and process for its preparation
10/18/2012DE102012103191A1 Method for electrically connecting e.g. capacitor with ceramic circuit carrier, involves providing surface mounted device component with surfaces, and connecting component terminals with strip conductors of circuit carrier by bonding wires
10/17/2012EP2511036A1 Reflow furnace
10/17/2012EP2510762A2 Circuit module and method for producing such a circuit module
10/17/2012EP2510586A1 Relief plug-in connector and multilayer circuit board
10/17/2012CN202496139U LED numeral tube wire bonding fixture
10/17/2012CN202496138U LED numeral tube automatic die bond fixture
10/17/2012CN202496137U SMT positioning structure used for printed board component board
10/17/2012CN202496136U Printed circuit board unloading system
10/17/2012CN202496135U Alignment system of a plurality of BGA mountings
10/17/2012CN202496133U Integrated flexible printed circuit board
10/17/2012CN202492492U Adhesive tape
10/17/2012CN202490997U Solder bumping device of integrated circuit component
10/17/2012CN1939644B Laser machining method and laser machining apparatus
10/17/2012CN1874648B Wiring board and manufacturing method of wiring board
10/17/2012CN102742380A Process for creating an inspection program
10/17/2012CN102742372A Wiring board and manufacturing method for same
10/17/2012CN102742371A Assembly, component for an assembly and method of manufacturing an assembly
10/17/2012CN102742370A Method for manufacturing a metallized ceramic substrate
10/17/2012CN102742369A Tile, assembly of tiles with a carrier, method of manufacturing an assembly
10/17/2012CN102741751A Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
10/17/2012CN102741750A Photosensitive resin composition, photosensitive dry film, and pattern forming method
10/17/2012CN102741351A Thermosetting composition
10/17/2012CN102741329A Sulfite softwood based cellulose triacetate for LCD films
10/17/2012CN102740675A Mounting apparatus, electronic component placement method, and substrate manufacturing method
10/17/2012CN102740614A Method for manufacturing multilayer printed wiring board
10/17/2012CN102740613A Metal-clad laminate
10/17/2012CN102740612A Method for manufacturing rigid-flexible printed circuit board
10/17/2012CN102740611A Bracket for welding electronic element
10/17/2012CN102740610A Surface mounted device and assembly method
10/17/2012CN102740609A Printed circuit board, a supporting jig and a positioning method
10/17/2012CN102740608A Combined-type circuit board and manufacturing method thereof
10/17/2012CN102740607A Transmission mechanism and placement device with transmission mechanism
10/17/2012CN102740606A Mount apparatus and mount method thereof
10/17/2012CN102740605A Board splitting and forming all-in-one machine
10/17/2012CN102740604A Method for manufacturing insulating metal base plate of electronic circuit
10/17/2012CN102740603A Method for adjusting size of PCB (printed circuit board) negative film
10/17/2012CN102740602A Manufacture method for substrate with heat conduction graphite and product
10/17/2012CN102740601A Manufacture procedure for electronic substrate and applied adhesion agent
10/17/2012CN102740598A Three-layer anti-fake label PCB plate and preparation process thereof
10/17/2012CN102740597A Manufacturing method for substrate embedded with electronic element
10/17/2012CN102740595A Solar cell panel having serial connection or parallel connection structure and manufacturing method for solar cell panel
10/17/2012CN102740594A Printed circuit board and method of manufacturing the same
10/17/2012CN102740593A Circuit board for dissipating heat of LED (light emitting diode) and manufacture method of circuit board
10/17/2012CN102740591A Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof
10/17/2012CN102740590A Ceramic substrate and method for manufacturing the same
10/17/2012CN102740585A Circuit board and manufacturing method thereof
10/17/2012CN102740584A Printed circuit board and processing method thereof
10/17/2012CN102740582A Multilayer printed wiring board and producing method thereof
10/17/2012CN102739264A Adjustable radio frequency circuit and manufacturing method thereof
10/17/2012CN102738678A ACF (anisotropic conductive film) bonding device
10/17/2012CN102737753A Conducting paste and conducting pattern
1 ... 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 ... 1185