Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2013
01/30/2013CN202702791U Wet method sticking film machine
01/30/2013CN202701547U Preheating device for heating furnace and preheating zone using preheating device
01/30/2013CN1993457B Cleaning compositions for microelectronics substrates
01/30/2013CN102907188A Module substrate and method for manufacturing same
01/30/2013CN102907187A Substrate with built-in component
01/30/2013CN102907186A Method of manufacturing metal-base substrate and method of manufacturing circuit board
01/30/2013CN102907185A Method for attaching member plates to FPC product, and member plate tapes
01/30/2013CN102907184A Flexible circuit coverfilm adhesion enhancement
01/30/2013CN102907183A Film system for LED applications
01/30/2013CN102905800A Method and use of a binder for providing a metallic coat covering a surface
01/30/2013CN102905478A Process for embedding components into multilayer board
01/30/2013CN102905477A Cantilever type efficient chip mounter
01/30/2013CN102905476A Method for preparing electrodeless lamp circuit board
01/30/2013CN102905475A Correction method of flexible printed circuit board
01/30/2013CN102905474A Method for producing conductive bumps of circuit carrier board
01/30/2013CN102905473A Circuit board and producing method thereof
01/30/2013CN102905472A Method for manufacturing conducting circuits and conducting circuit board
01/30/2013CN102905471A Method for manufacturing polytetrafluoroethylene high-frequency circuit board
01/30/2013CN102905470A Method for forming radiating structures of circuit carrier boards
01/30/2013CN102905469A Leveling device and method for producing printed circuit board (PCB)
01/30/2013CN102905468A Printed circuit board having single reflective structure and led packaging manufacturing method utilizing the same
01/30/2013CN102905467A Circuit board and method for mounting air core coil
01/30/2013CN102905466A Element with pins and fixed to circuit board
01/30/2013CN102905464A Wiring board and method for manufacturing the same
01/30/2013CN102905463A PCB (printed circuit board) structure available for grafting and transplanting and PCB structure grafting method
01/30/2013CN102905462A Circuit board module, stacking of circuit board, and manufacturing method for circuit board module and circuit board module stack
01/30/2013CN102905461A Flexible printed circuit board with independent plug and production technology of flexible printed circuit board
01/30/2013CN102905460A Wiring board and method for manufacturing the same
01/30/2013CN102905459A Blue adhesive for gold plating of circuit board
01/30/2013CN102905458A Flexible circuit board device with pressure sensitive films and method for manufacturing flexible circuit board device
01/30/2013CN102903646A Chip welding method
01/30/2013CN102902085A Wire connecting machine
01/30/2013CN102291947B Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB
01/30/2013CN101631450B Pin correcting device for integrated circuit
01/29/2013US8362368 Method and apparatus for an improved filled via
01/29/2013US8362366 Circuit board, its manufacturing method, and joint box using circuit board
01/29/2013US8362361 Method for producing parts for passive electronic components and parts produced
01/29/2013US8361605 Photosensitive resin composition, dry film, and processed product made using the same
01/29/2013US8361267 Adhesive chuck, and apparatus and method for assembling substrates using the same
01/29/2013US8359740 Process for the wafer-scale fabrication of electronic modules for surface mounting
01/29/2013US8359739 Process for manufacturing a module
01/29/2013US8359738 Method of manufacturing wiring board
01/24/2013WO2013012899A1 Batch cleaning apparatus and method for batch cleaning printed circuit boards
01/24/2013WO2013012139A1 Method and apparatus for connecting an electronic component using a high frequency electromagnetic field
01/24/2013WO2013011873A1 Novel conductive layer integrated fpc
01/24/2013WO2013011845A1 Method for producing heat-dissipating multilayer material for mounting boards
01/24/2013WO2013011788A1 Method for forming pattern and method for manufacturing electric wiring substrate
01/24/2013WO2013011775A1 Thin film forming method and thin film forming apparatus
01/24/2013WO2013010612A1 Structuring antistatic and antireflection coatings and corresponding stacked layers
01/24/2013WO2013010607A1 Printed circuit board for use in mortise locks
01/24/2013WO2013010194A1 Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof
01/24/2013WO2013010193A1 Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof
01/24/2013US20130023816 Electrodes, electrode systems, and methods of manufacture
01/24/2013US20130021772 Package structure with electronic component and method for manufacturing same
01/24/2013US20130021769 Multichip module, printed wiring board, method for manufacturing multichip module, and method for manufacturing printed wiring board
01/24/2013US20130021766 Electronic Component
01/24/2013US20130021765 Composition of a solder, and method of manufacturing a solder connection
01/24/2013US20130021758 Interconnect Schemes, and Materials and Methods for Producing the Same
01/24/2013US20130021754 Circuit board device and manufacturing method thereof and power supply having the circuit board device
01/24/2013US20130021739 Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling
01/24/2013US20130021219 Radio-frequency modules having tuned shielding-wirebonds
01/24/2013US20130021115 Resonated bypass capacitor for enhanced performance of a microwave circuit
01/24/2013US20130020606 Circuit board with thermo-conductive pillar
01/24/2013US20130020313 Electrical components and circuits constructed as textiles
01/24/2013US20130020120 Wiring board and method for manufacturing the same
01/24/2013US20130020111 Substrate for power module package and method for manufacturing the same
01/24/2013US20130020109 Package and Manufacturing Method of the Same
01/24/2013US20130019904 Batch cleaning apparatus and method for batch cleaning printed circuit boards
01/24/2013US20130019688 Measurement system for measuring pressure of fluid and manufacture method thereof
01/24/2013US20130019470 Method of manufacturing three-dimensional circuit
01/24/2013DE112011101006T5 Leiterplatte mit Aluminium-Leiterbahnen, auf die eine lötbare Schicht aus Material aufgebracht ist Circuit board with aluminum interconnects, applied a solderable layer of material is
01/24/2013DE102011079660A1 Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente Layer composite of a layer arrangement and an electrical or electronic component
01/24/2013DE102011079377A1 Steckermodul, insbesondere für Fensterheberantriebe, sowie Verfahren zu dessen Herstellung Plug-in module, in particular for window lift drive, as well as methods for its preparation
01/24/2013DE102011079318A1 Contact element for connecting lead wire of electronic component with circuit board, has contact spring arranged on wire to connect with pressing surface and to press against contact surface that is greater than pressing surface
01/24/2013CA2842311A1 Batch cleaning apparatus and method for batch cleaning printed circuit boards
01/23/2013EP2549844A1 Structure for fixing electric part for motor-driven compressor
01/23/2013EP2549841A1 Grooved circuit board accommodating mixed-size components
01/23/2013EP2549268A1 Method and apparatus for determining acceptance/rejection of fine diameter wire bonding
01/23/2013EP2548678A1 Bonding material and bonding method using same
01/23/2013EP2548424A1 Circuit arrangement and associated controller for a motor vehicle
01/23/2013EP2548423A1 Circuit arrangement and associated controller for a motor vehicle
01/23/2013EP2548422A1 Control device
01/23/2013EP2548421A1 Arrangement comprising an electric and/or electronic module and a circuit carrier
01/23/2013EP2548420A1 Flexible printed circuit to glass assembly system and method
01/23/2013EP2548419A1 Film system for led applications
01/23/2013EP2547258A1 Implantable biomedical devices on bioresorbable substrates
01/23/2013CN202697152U Directly-taking type feeding and ordering system for bulk paster elements
01/23/2013CN202697151U Vibration plate blowing mechanism
01/23/2013CN202697050U Press board alignment jig for multilayer boards
01/23/2013CN202697049U Electronic component welding fixture on circuit board
01/23/2013CN202697048U Element stable embedding device
01/23/2013CN202697047U Automatic element embedding equipment
01/23/2013CN202697046U Tool for copper-covered substrate printing and reflow technology
01/23/2013CN202697045U Pressing device of repaired flexible circuit board
01/23/2013CN202697044U Gum attaching fixture
01/23/2013CN202697043U Laminated steel board for circuit board and production line for laminated steel board
01/23/2013CN202697042U Pressure disk for plate warping anti-straightening machine
01/23/2013CN202697041U Tool for bearing circuit board
01/23/2013CN202697023U LED module with single-side hybrid circuit
01/23/2013CN202697022U Light-emitting diode (LED) module with double-faced mixing circuit