Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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12/12/2012 | CN102822390A Composition and method for micro etching of copper and copper alloys |
12/12/2012 | CN102822284A Curable resin composition, dry film using same, and printed wiring board |
12/12/2012 | CN102822228A Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board |
12/12/2012 | CN102822112A Metal base substrate and manufacturing method thereof |
12/12/2012 | CN102821956A Taniguchi hirohito |
12/12/2012 | CN102821873A Method for the application of a conformal nanocoating by means of a low pressure plasma process |
12/12/2012 | CN102821559A Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
12/12/2012 | CN102821558A Method for metalizing blind hole of printed circuit board |
12/12/2012 | CN102821557A Method for splicing circuit boards |
12/12/2012 | CN102821556A Special chip mounter for LEDs |
12/12/2012 | CN102821555A Processing technique of transparent insulating layer of multi-layer circuit board |
12/12/2012 | CN102821554A Flexible circuit suction filtration forming method |
12/12/2012 | CN102821553A Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) |
12/12/2012 | CN102821552A Method for improving scrapped PCB (printed circuit board) marking process |
12/12/2012 | CN102821551A Manufacturing method for heavy-copper printed circuit boards |
12/12/2012 | CN102821550A Nanostructure composite LED (Light Emitting Diode) ceramic substrate and manufacturing method thereof |
12/12/2012 | CN102821549A Full-automatic reinforcing machine |
12/12/2012 | CN102821548A Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off |
12/12/2012 | CN102821547A Fixing method for double-faced circuit board machining process |
12/12/2012 | CN102821546A Circuit board assembly for contact image sensors and manufacturing method thereof |
12/12/2012 | CN102821545A Multilayer wiring board, manufacturing method thereof, and semiconductor device |
12/12/2012 | CN102821543A Printed circuit board laminating structure and laminating method |
12/12/2012 | CN102820270A Package substrate and fabrication method thereof |
12/12/2012 | CN102307437B Method for improving bonding force of laminated base material and laminated conductor layer in semi-additive process (SAP) |
12/12/2012 | CN102202465B Automatic reinforcement laminating machine for flexible printed circuit |
12/12/2012 | CN102056398B Circuit board structure and making method thereof |
12/12/2012 | CN102036505B Welding pad structure of circuit board and manufacturing method of welding pad structure |
12/12/2012 | CN101998753B 线路板及其制造方法 Circuit board and its manufacturing method |
12/12/2012 | CN101802261B Multilayer printed wiring boards with holes requiring copper wrap plate |
12/12/2012 | CN101682981B Control device of a motor vehicle |
12/12/2012 | CN101640974B Printed circuit board and method for manufacturing the same |
12/12/2012 | CN101592760B Opto-electric hybrid module and manufacturing method thereof |
12/12/2012 | CN101562950B Production method of suspension board with circuit |
12/12/2012 | CN101437914B Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
12/11/2012 | US8331102 Printed circuit board |
12/11/2012 | US8330258 System and method for improving solder joint reliability in an integrated circuit package |
12/11/2012 | US8329006 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
12/11/2012 | US8328564 Electrical connector solder terminal |
12/11/2012 | US8328074 Component-mounted board production apparatus and position control method for electronic components in component-mounted board production apparatus |
12/11/2012 | US8327535 Wired circuit board and producing method thereof |
12/11/2012 | US8327533 Printed wiring board with resin complex layer and manufacturing method thereof |
12/11/2012 | US8327532 Method for releasing a microelectronic assembly from a carrier substrate |
12/11/2012 | DE202011105468U1 Leiterplattentrenneinrichtung PCB separator |
12/10/2012 | DE202012005884U1 Mainboarddübel für Computer-Mainboards zur Montage von CPU-Kühlern oder anderen Bauteilen Mainboard plugs for computer motherboards for installation of CPU coolers or other components |
12/06/2012 | WO2012166405A1 Low temperature co-fired ceramic structure for high frequency applications and process for making same |
12/06/2012 | WO2012166028A1 Thermo/electrical conductor arrangement for multilayer printed circuit boards |
12/06/2012 | WO2012165665A1 Fire-retardant resin composition, metal-clad base laminate for flexible printed circuit board utilizing said composition, cover lay, adhesive sheet for flexible printed circuit board and flexible printed circuit board |
12/06/2012 | WO2012165530A1 Method for producing multi-layer substrate and multi-layer substrate |
12/06/2012 | WO2012165439A1 Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same |
12/06/2012 | WO2012165277A1 Substrate-processing assistance device |
12/06/2012 | WO2012165276A1 Board operation assisting device, and board operation assisting method |
12/06/2012 | WO2012165275A1 Electrical-circuit manufacturing assistance device and electrical-circuit manufacturing assistance method |
12/06/2012 | WO2012165274A1 Printed circuit board work inspection support device |
12/06/2012 | WO2012165168A1 Resin substrate having metal film pattern formed thereon |
12/06/2012 | WO2012165111A1 Method for producing multi-layer substrate and multi-layer substrate |
12/06/2012 | WO2012164957A1 Electronic component mounting method, electronic component loading device and electronic component mounting system |
12/06/2012 | WO2012164872A1 Plating method |
12/06/2012 | WO2012164805A1 Printer |
12/06/2012 | WO2012164796A1 Screen printing device |
12/06/2012 | WO2012164780A1 Screen printing device |
12/06/2012 | WO2012164776A1 Soldering device |
12/06/2012 | WO2012164720A1 Substrate with built-in component, and method for producing said substrate |
12/06/2012 | WO2012164719A1 Substrate with built-in component, and method for producing said substrate |
12/06/2012 | WO2012164660A1 Screen printing plate and method for using same |
12/06/2012 | WO2012164655A1 Automatic inspection device and automatic inspection method |
12/06/2012 | WO2012164654A1 Automatic inspection device and automatic inspection method for inspecting silk backing |
12/06/2012 | WO2012138131A3 Pattern-printing apparatus |
12/06/2012 | US20120309223 Guide element for a connector device |
12/06/2012 | US20120308718 Fabricating method for multilayer printed circuit board |
12/06/2012 | US20120308717 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom |
12/06/2012 | US20120308440 Ozone generator |
12/06/2012 | US20120307470 Wiring substrate and method for manufacturing wiring substrate |
12/06/2012 | US20120307469 Multilayer wiring board, manufacturing method thereof, and semiconductor device |
12/06/2012 | US20120307465 Solderless printed wiring boards |
12/06/2012 | US20120307185 Color filter substrate, method for manufacturing the same and touch-type liquid crystal display panel |
12/06/2012 | US20120306608 Wiring board and method for manufacturing same |
12/06/2012 | US20120305306 Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas |
12/06/2012 | US20120305301 Circuit board with heat sink and method of fabricating the same |
12/06/2012 | US20120305295 Thermosetting composition |
12/06/2012 | US20120305293 Circuit board assembly and method of assembling circuit boards |
12/06/2012 | US20120304460 Module manufacturing method |
12/06/2012 | US20120304459 Component mounting apparatus and method for photographing component |
12/06/2012 | US20120304458 Method for manufacturing multilayer printed wiring board |
12/06/2012 | DE102011076773A1 Method for manufacturing integrated circuit e.g. MOSFET, involves attaching strip conductors of power section to strip conductor attachments by cold gas spraying process, and equipping power component space with power components |
12/05/2012 | EP2531010A2 Light-emitting device and luminaire |
12/05/2012 | EP2530786A1 Conductive connection sheet, method for connecting terminals, method for forming connection terminal, semiconductor device, and electronic device |
12/05/2012 | EP2529931A1 Screen stretch frame |
12/05/2012 | EP2529930A1 Screen printing apparatus |
12/05/2012 | EP2529929A1 Screen printing apparatus |
12/05/2012 | EP2529861A1 Synthesis of Nanoparticles comprising oxidation sensitive metals with Tuned Particle Size and High Oxidation Stability |
12/05/2012 | EP2529607A2 Assembly, component for an assembly and method of manufacturing an assembly |
12/05/2012 | EP2529606A1 Tile, assembly of tiles with a carrier, method of manufacturing an assembly |
12/05/2012 | EP1754986B1 Optical communication device and optical communication device manufacturing method |
12/05/2012 | CN202587749U Electronic part repairing machine and production line |
12/05/2012 | CN202587627U Circuit board assembly structure |
12/05/2012 | CN202587626U Adjustable temperature measurement carrier |
12/05/2012 | CN202587625U Attachment welding jig |
12/05/2012 | CN202587624U Positioning device for welding electronic component |
12/05/2012 | CN202587623U Partition column for circuit board soldering |
12/05/2012 | CN202587622U Circuit board wire connection welding protection cover |