Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2012
12/19/2012CN102833963A Horizontal pre-treatment method for improving copper exposing at bottom of blind drilling hole in soft gold electroplating
12/19/2012CN102833962A Interconnected circuit board and method for manufacturing same
12/19/2012CN102833961A PCB (Printed circuit board) butt welding method and PCB butt welding device
12/19/2012CN102833960A Tooling device for fixedly welding Bluetooth sockets
12/19/2012CN102833959A Tooling device for welding circuit board and keyboard plate
12/19/2012CN102833958A EMI (Electromagnetic Interference) shielding method for circuit board lockhole and jig
12/19/2012CN102833957A Magnetic coil welding method
12/19/2012CN102833956A Automatic production line for LED application products
12/19/2012CN102833955A Printed circuit forming method
12/19/2012CN102833954A Pressure-sensitive adhesive printed circuit forming method
12/19/2012CN102833953A Releasing device
12/19/2012CN102833952A Adhesive-removal method for printed circuit board HDI (high density interconnection) product
12/19/2012CN102833951A Manufacture technology for 12oz thick-copper double-sided circuit board
12/19/2012CN102833950A Substrate manufacture method for improving heat conduction and current passing capability
12/19/2012CN102833949A Method for milling groove in FPC (Flexible Printed Circuit)
12/19/2012CN102833948A Method of using conductive elastomer for electrical contacts in assembly
12/19/2012CN102833947A Mobile communication terminal, embedded PCB (printed circuit board) structure and processing method of embedded PCB structure
12/19/2012CN102833946A Multi-layer circuit board with coil structure capable of encircling embedded element and manufacturing method for multi-layer circuit board
12/19/2012CN102833944A Single FPC board for connecting multiple modules and touch sensitive display module using same
12/19/2012CN102833943A Printed circuit board and method of manufacturing the same
12/19/2012CN102833941A Novel slide and preparation method thereof
12/19/2012CN102833940A Printed circuit board and method of manufacturing the same
12/19/2012CN102832176A Packaging method of quantum effect photoelectric detector and readout integrated circuit
12/19/2012CN102832013A Inductor module and base thereof
12/19/2012CN102307439B Foolproof method for layer misplacement of multilayer PCB
12/19/2012CN102215636B Circuit board wet processing device
12/19/2012CN102196671B Processing method of circuit board and circuit board with contour tolerance of +/-0.05mm
12/19/2012CN102143661B Multi-layered circuit board and manufacturing method thereof
12/19/2012CN102131910B Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
12/19/2012CN102045952B Manufacturing method for circuit board insulating protective layer
12/19/2012CN102014588B Method for plugging buried holes on high density interconnected printed circuit board
12/19/2012CN101938884B Explosion positioning method of manually made PCB (Printed Circuit Board)
12/19/2012CN101675717B Wiring board and method of manufacturing the same
12/18/2012US8333011 Method for making an electronic assembly
12/18/2012CA2754724C Methods of filling vias in a substrate
12/18/2012CA2648539C Stabilized metal nanoparticles and methods for depositing conductive features using stabilized metal nanoparticles
12/18/2012CA2442211C Device for and method of processing integrated circuits
12/13/2012WO2012169866A2 Printed circuit board and method for manufacturing the same
12/13/2012WO2012169674A1 Surface mounting gasket and method of manufacturing same
12/13/2012WO2012169619A1 Electroconductive ball mounting apparatus and electroconductive ball mounting method
12/13/2012WO2012169550A1 Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate
12/13/2012WO2012169535A1 Film-shaped circuit connecting material and circuit connecting structure
12/13/2012WO2012169497A1 Connection method, connected-body production method and connected body
12/13/2012WO2012169458A1 Pattern inspection method and pattern inspection device
12/13/2012WO2012169385A1 Composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
12/13/2012WO2012169384A1 Resin composition for plating resist, and multilayer printed wiring board
12/13/2012WO2012169249A1 Liquid crystal polymer-copper clad laminate and copper foil used for liquid crystal polymer-copper clad laminate
12/13/2012WO2012169076A1 Bonding material and bonded object produced using same
12/13/2012WO2012169074A1 Method for forming metallic film
12/13/2012WO2012168941A1 Flexible transparent conductive coatings by direct room temperature evaporative lithography
12/13/2012WO2012168902A2 Method to trace conductive tracks
12/13/2012WO2012168900A1 Method of polarization of a volume of substrate material and portable polarizer
12/13/2012WO2012168031A1 Encapsulation housing and led module with the same
12/13/2012WO2012168018A1 Printed circuit board and control device for a vehicle transmission comprising the printed circuit board
12/13/2012US20120315717 Methods of manufacturing wire, TFT, and flat panel display device
12/13/2012US20120315438 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
12/13/2012US20120314389 Wiring board and method for manufacturing same
12/13/2012US20120314382 Stretchable circuit assemblies
12/13/2012US20120314374 Heat dissipating high power systems
12/13/2012US20120314371 Group iii nitride based flip-chip integrated circuit and method for fabricating
12/13/2012US20120313886 Touch panel and method for making the same
12/13/2012US20120313874 Method of manufacturing a vibratory actuator for a touch panel with haptic feedback
12/13/2012US20120313766 Method of controlling a handheld object using haptic feedback
12/13/2012US20120313595 Power Converter Package Structure and Method
12/13/2012US20120313127 Manufacturing method of led base plate, led base plate and white light led structure
12/13/2012US20120312776 Method for making touch panel
12/13/2012US20120312775 Method for manufacturing a printed circuit board
12/13/2012US20120312591 Printed Circuit Board and Method of Manufacturing the Same
12/13/2012US20120312590 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
12/13/2012US20120312589 Laser Resin Activation to Provide Selective Via Plating for Via Stub Elimination
12/13/2012US20120312584 Package substrate and fabrication method thereof
12/13/2012US20120311858 Apparatus for conditioning semiconductor chips and test method using the apparatus
12/13/2012US20120311857 Method for Contacting a Lighting Device, Tool for Performing the Method and Connection Element for Attachment on a Lighting Device
12/13/2012US20120311856 Substrate for mounting light-emitting element and method for producing same
12/13/2012DE102011106104A1 Verfahren zum Herstellen von Leiterplatten und Leiterplattengesamtnutzen A method of producing printed circuit boards and PCB total utility
12/13/2012DE102010038492B4 Anordnung und Verfahren zum Anlöten eines elektronischen SMT-Bauelementes mit kreisrunden Kontaktfüßen Apparatus and method for soldering an electronic SMT component with circular contact pads
12/13/2012DE102010011604A9 Foliensystem für LED-Anwendungen Film system for LED applications
12/12/2012CN202603057U Assembly and positioning fixture for circuit substrate
12/12/2012CN202603056U Tooling seat for welding flexible printed circuit board
12/12/2012CN202603055U Circuit board solder paste printing troubleshooting machine
12/12/2012CN202603054U BGA-PCB relative-position adjustment system in BGA repair work station
12/12/2012CN202603053U BGA pickup-assembly adjusting device in BGA repair work station
12/12/2012CN202603052U Automatic magnetic ring sleeving machine for electronic components
12/12/2012CN202603051U Aligning tool for touch screen PCB
12/12/2012CN202603050U Jig for placing headed needle-shaped elements in batch mode
12/12/2012CN202603049U Chip mounting positioning system of simple chip mounter
12/12/2012CN202603048U Reverse-V-shaped conveying production line for PCB screen printing machine
12/12/2012CN202603047U Replacement carrying platform for PCB with BGA
12/12/2012CN202603046U Printed circuit board used for welding helical antenna and wireless terminal
12/12/2012CN202591786U Liquid height measuring device for and molten tin bath control system
12/12/2012CN202591784U Wave crest spout device capable of adjusting wave crest width
12/12/2012CN202591781U Chip reversal welding equipment
12/12/2012CN202591774U Crest generator having separating function
12/12/2012CN202591773U A reflow soldering machine realizing cyclic utilization of heat energy
12/12/2012CN102823337A Circuit board with anchored underfill
12/12/2012CN102823336A 电子零件安装方法 Electronic component mounting method
12/12/2012CN102823335A Method for manufacturing a double-sided printed circuit board
12/12/2012CN102823334A Method of forming microstructures, laser irradiation device, and substrate
12/12/2012CN102822960A Component placement on flexible and/or stretchable substrates
12/12/2012CN102822747A Photo-curable thermosetting resin composition