Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2012
11/21/2012CN102791079A Manufacturing method of flexible circuit board and flexible circuit board manufactured by using manufacturing method
11/21/2012CN102791078A Automatic mounting-demounting device for circuit board upper and lower plates
11/21/2012CN102791075A Manufacture method of loader with three-dimensional inductance and structure of loader
11/21/2012CN102791074A Flexible printed circuit and method of manufacturing the same
11/21/2012CN102789992A Method for using mask to carry conductive ball onto workpiece and ball carrying device
11/21/2012CN102789074A Connecting structure and a display device with said connecting structure
11/21/2012CN102787316A Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution
11/21/2012CN102787307A Electroless plating apparatus, method of electroless plating, and manufacturing method of printed circuit board
11/21/2012CN102785447A Method of producing flexible laminate sheet
11/21/2012CN102396037B Composition for forming conductor layer, conductor substrate, and method for producing conductor substrate
11/21/2012CN102307435B Cleaning process for high-density interconnected printed circuit board (HDI PCB)
11/21/2012CN102209440B Method and device for carrying out high-pressure-resistant water-proof treatment on PCB (printed circuit board) of LED (light-emitting diode) true-color nixie tube
11/21/2012CN102123567B Processing method for improving heat conductivity of printed circuit board
11/21/2012CN102121108B Compound OSP treating agent for lead-free printed circuit board
11/21/2012CN102083282B Method for manufacturing printed circuit board (PCB)
11/21/2012CN101998768B Novel manufacturing method for back drilling of PCB (Printed Circuit Board)
11/21/2012CN101983425B Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board
11/21/2012CN101979709B Novel chemical copper plating method
11/21/2012CN101969744B Conveying method and device of sheet treatment process
11/21/2012CN101958292B Printed circuit board, encapsulation piece and manufacture methods thereof
11/21/2012CN101958258B Ball filling device and method
11/21/2012CN101953238B Device for sticking films, device for transferring/fixing small piece member and head device thereof
11/21/2012CN101849445B Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
11/21/2012CN101747854B Adhesive combination, covering film and flexible circuit board
11/21/2012CN101670594B Method for processing contour of flexible circuit board
11/21/2012CN101533824B Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
11/21/2012CN101522305B Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace
11/21/2012CN101479311B Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition
11/21/2012CN101445645B White heat-hardening resin composition
11/21/2012CN101402808B Conductive pattern formation ink, conductive pattern and wiring substrate
11/21/2012CN101400213B Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method
11/21/2012CN101081903B Prepreg and conductive layer-laminated substrate for printed wiring board
11/21/2012CN101032880B Screen printing device
11/20/2012US8315678 Systems, methods, and apparatus for multilayer superconducting printed circuit boards
11/20/2012US8314346 Wiring board for light-emitting element
11/20/2012US8314343 Multi-layer board incorporating electronic component and method for producing the same
11/20/2012US8314013 Semiconductor chip manufacturing method
11/20/2012US8312624 Method for manufacturing a heat dissipation structure of a printed circuit board
11/20/2012US8312623 Methods for producing electrical conductors
11/15/2012WO2012152740A2 Synthesis of nanoparticles comprising oxidation sensitive metals with tuned particle size and high oxidation stability
11/15/2012WO2012152627A1 Method for fastening a circuit board to a body, and electric-motor-driven pump
11/15/2012US20120290172 Methods and apparatus for variable reduced effort steering in electric steering systems
11/15/2012US20120289065 Circuit board and method of manufacturing inkjet head
11/15/2012US20120288241 Opto-electronics with compliant electrical contacts
11/15/2012US20120287586 Wiring board and method for manufacturing the same
11/15/2012US20120287519 Optical system, optical module and method of manufacture thereof
11/15/2012US20120287492 Microelectromechanical system with a center of mass balanced by a mirror substrate
11/15/2012US20120286904 Connection terminal and transmission line
11/15/2012US20120286870 Integrated circuit of an integrator with enhanced stability and related stabilization method
11/15/2012US20120285990 Viscous Material Noncontact Jetting System
11/15/2012US20120285926 Dual-damascene bit line structures for microelectronic devices and methods of fabricating microelectronic devices
11/15/2012US20120285924 Method for manufacturing printed circuit board
11/15/2012US20120285736 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
11/15/2012US20120285013 Electronic Component-Embedded Board and Method of Manufacturing the Same
11/15/2012US20120285012 Component mounting apparatus and substrate conveyance method in component mounting apparatus
11/15/2012US20120285011 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
11/15/2012US20120285010 Method and apparatus for fluid guided self-assembly of microcomponents
11/15/2012US20120285009 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board
11/15/2012DE202010017809U1 Leiterstrukturelement, Halbleiterbauelement für ein Leiterstrukturelement und elektronische Baugruppe Head of structural element, semiconductor device for a conductor structure element and electronic assembly
11/15/2012DE102010004193B4 Bestückungsautomat und Lötverfahren zum thermischen Verbinden von Bauelementen an ein Substrat Placement machine and soldering for thermal connection of devices to a substrate
11/14/2012EP2522794A1 System for energy and/or data production and contacting unit for same
11/14/2012EP2522512A2 Extending tool of sheet-like material
11/14/2012EP2522511A2 Extending tool of sheet-like material
11/14/2012EP2522510A1 Printing apparatus
11/14/2012CN202535651U Online jumper wire forming machine
11/14/2012CN202535650U Reversing device for surface mounted elements
11/14/2012CN202535649U Steel needle used for automatic clip mounter of high-precision integrated circuit
11/14/2012CN202535648U Film structure for circuit board
11/14/2012CN202535647U Pcb board positioning system
11/14/2012CN202535646U Lamination cooling assemble line
11/14/2012CN202535641U Three-dimensional surface-curved guide perforation hole and metal layer structure
11/14/2012CN202528552U Gas guide plate for solder resistance hole plugging printing
11/14/2012CN1839219B Adhesion promotion in printed circuit boards
11/14/2012CN1819748B Etching liquid, bulking liquid and forming method of conductive image using same
11/14/2012CN102783259A Inductive coupling structure, multi-layer transmission-line plate, method of manufacturing inductive coupling structure, and method of manufacturing multi-layer transmission-line plate
11/14/2012CN102783258A Method of manufacturing printed circuit board and printed circuit board
11/14/2012CN102783257A Electrical contact arrangement
11/14/2012CN102783255A Copper foil for printed circuit board and copper-clad laminate for printed circuit board
11/14/2012CN102782945A Anisotropic conductive film, united object, and process for producing united object
11/14/2012CN102782578A Photosensitive resin composition, photosensitive dry film, and pattern forming method
11/14/2012CN102781661A Method for manufacturing a laminate with one metal-plated side
11/14/2012CN102781210A Method for generating reference mark model template
11/14/2012CN102781177A Method for drilling printed circuit board, printed circuit board and communication equipment
11/14/2012CN102781176A Splicing method of circuit board and splicing circuit board
11/14/2012CN102781175A Welding method and welding structure of conductor and circuit board
11/14/2012CN102781174A Circuit board exposure glass frame
11/14/2012CN102781173A Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material
11/14/2012CN102781172A Production method for mirror-surface aluminum base board
11/14/2012CN102781171A Method for manufacturing multilayer leadless golden-finger circuit boards
11/14/2012CN102781170A Method for preparing mirror-surface aluminum substrate
11/14/2012CN102781169A Method for producing silver-plated ceramic circuit boards
11/14/2012CN102781168A Manufacturing method for golden fingerboard without lead wire
11/14/2012CN102781167A Printed circuit board production apparatus and printing machine
11/14/2012CN102781166A Radiating substrate, production method thereof and coating device for producing radiating substrate
11/14/2012CN102781160A Flexible LED (light-emitting diode) bulb lamp aluminum-based circuit board and preparation method thereof
11/14/2012CN102778815A Photosensitive resin composition, photosensitive element, method of forming anti-corrosion pattern and method of manufacturing pcb
11/14/2012CN102773550A Dynamic sawing device, sawing method of circuit substrate dissected valley and circuit substrate
11/14/2012CN102307436B Method for manufacturing flexible printed circuit board
11/14/2012CN102291938B Manufacturing method of PCB (Printed Circuit Board) with metal micro-radiator
11/14/2012CN102212853B Surface treatment coarsening process for improving peel strength of copper foil