| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/14/2012 | CN102209442B Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| 11/14/2012 | CN102209437B Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof |
| 11/14/2012 | CN102170758B Circuit board double window resistance welding hole filling processing method and resistance welding exposure film |
| 11/14/2012 | CN102164455B Process for assembling radio frequency power amplifier circuit board |
| 11/14/2012 | CN102157499B Manufacturing method of hybrid integrated circuit module based on low temperature co-fired ceramic technology |
| 11/14/2012 | CN102149254B Manufacture method of flexible and rigid composite circuit board |
| 11/14/2012 | CN102111961B Method for detecting process capability of inner and outer layers of circuit board |
| 11/14/2012 | CN102036494B Embedded copper block punching machine and method using same for embedding copper block |
| 11/14/2012 | CN102036492B Drilling method for printed circuit board (PCB) |
| 11/14/2012 | CN102029450B Method for performing lead reformation to lead-free BGA apparatus |
| 11/14/2012 | CN102006730B Full-automatic pneumatic board parting machine |
| 11/14/2012 | CN101997256B Needling device of printed circuit board |
| 11/14/2012 | CN101911844B Metal-clad substrate, and method for production thereof |
| 11/14/2012 | CN101909837B Process for producing ceramic molded product |
| 11/14/2012 | CN101887880B Multilayer printed wiring board |
| 11/14/2012 | CN101875084B Quick-change die carrier for flexible circuit board |
| 11/14/2012 | CN101845622B Immersion Ni/Au method of blind hole plate |
| 11/14/2012 | CN101841972B Method for manufacturing high-AR and fine-line PCB |
| 11/14/2012 | CN101833181B Method for retrieving image of liquid crystal panel installing equipment |
| 11/14/2012 | CN101653052B Circuit connecting method |
| 11/14/2012 | CN101653051B Pin to be inserted in a receiving opening in a circuit board and method for inserting a pin into a receiving opening in a circuit board |
| 11/14/2012 | CN101468343B Method for production of cover plate for drilling hole and cover plate |
| 11/14/2012 | CN101466197B Circuit board and power amplifier double-channel transmit-receive unit and wireless base station provided thereon |
| 11/14/2012 | CN101337308B Solder |
| 11/13/2012 | US8310668 Producing method of wired circuit board |
| 11/13/2012 | US8309862 Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner |
| 11/13/2012 | US8309855 Flexible printed circuit board |
| 11/13/2012 | US8309854 Rigid-flex printed circuit board module having a working zone connected to a non-working zone |
| 11/13/2012 | US8309658 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 11/13/2012 | US8308967 Wet etched insulator and electronic circuit component |
| 11/13/2012 | US8307549 Method of making an electrical circuit |
| 11/13/2012 | US8307548 Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method |
| 11/13/2012 | US8307547 Method of manufacturing a circuit board with light emitting diodes |
| 11/13/2012 | US8307546 Method for manufacturing a ceramic elements module |
| 11/13/2012 | CA2558223C Flat transponder and method for the production thereof |
| 11/08/2012 | WO2012151500A1 Metal alloys from molecular inks |
| 11/08/2012 | WO2012150817A2 Method for manufacturing printed circuit board |
| 11/08/2012 | WO2012150777A2 The printed circuit board and the method for manufacturing the same |
| 11/08/2012 | WO2012150736A1 Composition for laser direct structuring and laser direct structuring method using same |
| 11/08/2012 | WO2012150263A1 Method for controlling deposition |
| 11/08/2012 | WO2012125481A3 Thin film through-glass via and methods for forming same |
| 11/08/2012 | US20120283808 Implantable paddle lead comprising stretching electrical traces and method of fabrication |
| 11/08/2012 | US20120281378 Split Electrical Contacts in an Electronic Assembly |
| 11/08/2012 | US20120280955 Mobile wireless communications device with reduced interfering energy from the display and related methods |
| 11/08/2012 | US20120280944 Touch sensor with modular components |
| 11/08/2012 | US20120280047 Method, System and Apparatus for Making Short Run Radio Frequency Identification Tags and Labels |
| 11/08/2012 | US20120280022 Manufacturing method of circuit substrate |
| 11/08/2012 | US20120279864 Process for electroplating metals into microscopic recessed features |
| 11/08/2012 | US20120279781 Conductive particle, and anisotropic conductive film, bonded structure, and bonding method |
| 11/08/2012 | US20120279775 Circuit board viaholes and method of manufacturing the same |
| 11/08/2012 | US20120279772 Package structure and manufacturing method thereof |
| 11/08/2012 | US20120279771 Package structure with electronic component and method for manufacturing same |
| 11/08/2012 | US20120279770 Printed wiring board and method for manufacturing the same |
| 11/08/2012 | US20120279767 Techniques for Improving Bond Pad Performance |
| 11/08/2012 | US20120279765 Circuit board and method of manufacturing thereof |
| 11/08/2012 | US20120279760 Package carrier and manufacturing method thereof |
| 11/08/2012 | US20120279759 Transparent conductive structure applied to a touch panel and method of making the same |
| 11/08/2012 | US20120279758 Transparent conductive structure applied to a touch panel and method of making the same |
| 11/08/2012 | US20120279757 Printed circuit board and method of manufacturing the same |
| 11/08/2012 | US20120279061 Clustered stacked vias for reliable electronic substrates |
| 11/08/2012 | US20120279060 Methods and apparatuses for non-planar chip assembly |
| 11/08/2012 | US20120279059 Microelectronic package and method for a compression-based mid-level interconnect |
| 11/08/2012 | US20120279050 Method for manufacturing printed wiring board |
| 11/08/2012 | DE112011100248T5 Lichtemittierende Vorrichtung A light emitting device |
| 11/08/2012 | DE112011100207T5 Siebdruckvorrichtung Screen printing apparatus |
| 11/08/2012 | DE102012206276A1 Verfahren zum Herstellen eines Leistungsmodul-Substrats und Leistungsmodul-Substrat A method for manufacturing a power module substrate, and the power module substrate |
| 11/08/2012 | DE102005017849B4 Elektronisches Bauteil Electronic component |
| 11/07/2012 | EP2521430A1 Method for fixing a PCB to a body and pump driven by an electric motor |
| 11/07/2012 | EP2521429A1 Method for soldering surface-mount component and surface-mount component |
| 11/07/2012 | EP2521428A1 Method and device for digital production of a cladding of a functional coating on a substrate surface and component |
| 11/07/2012 | EP2521165A1 Wiring structure and method for forming same |
| 11/07/2012 | EP2520331A2 Void-free implantable hermetically sealed structures |
| 11/07/2012 | EP2520141A2 Circuit board |
| 11/07/2012 | EP2520140A1 Method and device for the wet chemical treatment of material feedstock |
| 11/07/2012 | CN202524657U Anti-aging and corrosion-resistant wave soldering jig |
| 11/07/2012 | CN202524656U Deformation-preventing wave soldering jig |
| 11/07/2012 | CN202524655U Reflow soldering fixture |
| 11/07/2012 | CN202524654U Monitoring device of etching production line |
| 11/07/2012 | CN202524653U Device for bending flexible printed circuit board |
| 11/07/2012 | CN202524643U Tin sealing printed board |
| 11/07/2012 | CN202518976U Feeding device |
| 11/07/2012 | CN202517815U Screen printing special tool for conducting paste of printed circuit solid board |
| 11/07/2012 | CN202517166U Wave-soldering jig |
| 11/07/2012 | CN202517159U Table selective wave soldering device |
| 11/07/2012 | CN1910041B Polyimide metal laminate and circuit substrate |
| 11/07/2012 | CN1906027B Continuous production method for both-sided conductor polyimide laminate |
| 11/07/2012 | CN1826845B Land grid array connector |
| 11/07/2012 | CN102771200A Multilayer printed circuit board and manufacturing method therefor |
| 11/07/2012 | CN102771199A Substrate with embedded coil |
| 11/07/2012 | CN102771198A Composition for printing a seed layer and process for producing conductor tracks |
| 11/07/2012 | CN102771197A Method of forming circuits upon flexible laminate substrate |
| 11/07/2012 | CN102770957A Through mold via polymer block package |
| 11/07/2012 | CN102770951A Tape adhering apparatus, tape holding unit, and tape adhering method |
| 11/07/2012 | CN102770495A Resin composition for polyester base material and dry film and printed circuit boards using same |
| 11/07/2012 | CN102770278A Aromatic polycarbonate composition |
| 11/07/2012 | CN102770233A Solder paste |
| 11/07/2012 | CN102770216A Dispenser for highly viscous fluid |
| 11/07/2012 | CN102769997A Apparatus for bonding semiconductor chip |
| 11/07/2012 | CN102769996A Machining method of printed circuit board (PCB) of step blind slot |
| 11/07/2012 | CN102769995A Attaching and packaging method of substrate and substrate |