Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2012
10/31/2012CN102762034A A circuit board manufacture method and a basic circuit board
10/31/2012CN102762033A Circuit board production carrier and production method employing same
10/31/2012CN102762032A Method and system for tracking part quality
10/31/2012CN102762031A A printed distributing board and a manufacture method of the same
10/31/2012CN102762030A High-density PCB
10/31/2012CN102762026A Structure and manufacturing method of transparent conducting circuit
10/31/2012CN102760561A Transformer and electronic device comprising same
10/31/2012CN102759865A Exposure alignment system
10/31/2012CN102758193A Electroless copper plating pretreatment solution used for high-frequency circuit board
10/31/2012CN102159038B Plug-in board head of fully-automatic terminal plug-in board machine
10/31/2012CN102111953B Printed circuit board (PCB) and manufacturing method thereof
10/31/2012CN102007452B Photosensitive resin composition and layered object obtained therewith
10/31/2012CN101990370B Making method of ceramic matrix flex-rigid multilayer circuit board
10/31/2012CN101962776B Solder stripping agent and preparation method thereof
10/31/2012CN101489351B Built-in solid electrolytic capacitor for circuit board and circuit board using the built-in solid electrolytic capacitor of circuit board
10/31/2012CN101485238B Ball grid array (bga) connection system and related method and ball socket
10/31/2012CN101432094B Laser processing method and laser processing apparatus
10/31/2012CN101401496B Circuit board, electronic circuit device, and display
10/31/2012CN101390017B Heat curable composition for protective film, cured product, and liquid crystal display device
10/31/2012CN101341633B Capacitor interconnection
10/31/2012CN101188113B Suspension board with circuit and producing method thereof
10/30/2012US8300035 Liquid crystal display device
10/30/2012US8299706 Hermetic encapsulation of organic, electro-optical elements
10/30/2012US8299598 Grid array packages and assemblies including the same
10/30/2012US8299369 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
10/30/2012US8298968 Electrical components and circuits constructed as textiles
10/30/2012US8298754 Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste
10/30/2012US8298680 Composition of a solder, and method of manufacturing a solder connection
10/30/2012US8297222 Fully automated paste dispense system for dispensing small dots and lines
10/30/2012US8296943 Method for making surveillance devices with multiple capacitors
10/30/2012US8296942 Process for preparing a heatsink system and heatsink system obtainable by said process
10/30/2012US8296941 Conformal shielding employing segment buildup
10/30/2012US8296940 Method of forming a micro pin hybrid interconnect array
10/30/2012US8296939 Mounting method using dilatancy fluid
10/30/2012US8296938 Method for forming an electronic module having backside seal
10/26/2012WO2012145237A1 Led array having embedded led and method therefor
10/26/2012WO2012144855A2 Flux for solder paste, solder paste and solder bump, and preparation methods thereof
10/26/2012WO2012144493A1 Solder resist, solder resist starting material, led substrate, light-emitting module, apparatus having light-emitting module, method for producing led substrate, method for producing light-emitting module, and method for producing apparatus having light-emitting module
10/26/2012WO2012144492A1 Led substrate, light-emitting module, method for producing led substrate, and method for producing light-emitting module
10/26/2012WO2012144170A1 Tape attachment device, tape attachment method, and display device
10/26/2012WO2012144115A1 Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same
10/26/2012WO2012144114A1 Wiring board, multi-pattern wiring board, and method for producing same
10/26/2012WO2012143967A1 Solder jet nozzle, soldering device, and soldering method
10/26/2012WO2012143966A1 Solder jet nozzle and soldering device
10/26/2012WO2012143923A2 System and method for additive manufacturing of an object
10/26/2012WO2012143873A1 Electrical device
10/26/2012WO2012142712A1 Overmoulding method and overmoulded electronic device
10/26/2012WO2012078894A3 Method for depositing viscous material on a substrate with a combination stencil printer and dispenser
10/26/2012WO2012061511A3 Sintering materials and attachment methods using same
10/26/2012CA2831931A1 Overmoulding method and overmoulded electronic device
10/25/2012US20120269959 Screen printing apparatus and screen printing method
10/25/2012US20120268916 Light emitting device package and method of manufacturing the same
10/25/2012US20120268899 Reinforced fan-out wafer-level package
10/25/2012US20120268895 Electronic power module, and method for manufacturing said module
10/25/2012US20120268875 Mounting structure of circuit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof
10/25/2012US20120268854 Electronic component
10/25/2012US20120267778 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
10/25/2012US20120267158 Construction of reliable stacked via in electronic substrates - vertical stiffness control method
10/25/2012US20120267153 Coupling device, assembly having a coupling device, and method for producing an assembly having a coupling device
10/25/2012US20120267152 Substrate and method of manufacturing substrate
10/25/2012US20120267151 Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
10/25/2012US20120267149 Method of manufacturing power module substrate and power module substrate
10/25/2012US20120267147 Method for Producing an Electronic Component and Electronic Component
10/25/2012US20120266463 Method for manufacturing printed circuit board
10/25/2012US20120266461 Method for conductively connecting a component on a transparent substrate
10/25/2012US20120266460 Method of manufacturing inertial sensor
10/25/2012DE102012206468A1 Verfahren und Vorrichtungen, um flexible (Flex-)Schaltkreise von optischen Sende-Empfängermodulen davor zu schützen, während der Herstellung und des Zusammenbaus der Module beschädigt zu werden To methods and apparatus to protect flexible (Flex) circuits of optical transceiver modules before, during manufacture and assembly of the modules is damaged
10/25/2012DE102011007837A1 Kleberloser Verbund aus einer Polyarylenetherketon- und einer Metallfolie Clear adhesive composite of a Polyarylenetherketon- and a metal foil
10/25/2012DE102008003372B4 Verfahren zur Herstellung eines mehrlagigen zwei- oder dreidimensionalen Schaltungsträgers A method for producing a two or three dimensional multi-layer circuit substrate
10/24/2012EP2515160A1 Suspension and tolerance absorption subassembly for a display screen
10/24/2012EP2514853A2 Coating-forming liquid composition and coating-forming method therewith
10/24/2012EP2514781A1 Polymerizable compound and curable composition containing same
10/24/2012EP2514576A1 A method of producing ceramic substrates
10/24/2012EP2514283A1 Method and device for producing an interconnect device and interconnect device
10/24/2012CN202503824U Cooling device and post-processing system provided therewith
10/24/2012CN202503823U Fish nozzle clamp used for printed circuit board
10/24/2012CN202503822U Printed circuit board production board baking and placing frame
10/24/2012CN202503821U Circuit board back washing device
10/24/2012CN1988083B Thin-film capacitor and method for fabricating the same, electronic device and circuit board
10/24/2012CN1950750B Pattern forming material, pattern forming apparatus and pattern forming method
10/24/2012CN102754031A Layered structure and light-sensitive dry film used in same
10/24/2012CN102754030A Photocurable resin composition, dry film, cured article, and printed wiring board
10/24/2012CN102754027A Photosensitive composition and printed circuit board
10/24/2012CN102753732A Cyanide based electrolytic gold plating solution and plating method using same
10/24/2012CN102753630A Curable composition for inkjet and method for producing electronic component
10/24/2012CN102753002A Blowing mechanism of vibration plate
10/24/2012CN102752985A Fixing device
10/24/2012CN102752966A Gasket for printed circuit board
10/24/2012CN102752965A Arrangement method and device of patch terminal
10/24/2012CN102752964A Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein
10/24/2012CN102752963A Unit circuit board replacing method for integrated substrate and integrated substrate
10/24/2012CN102752962A Substrate provided with metal layer and manufacturing method thereof
10/24/2012CN102752961A Method for manufacturing circuit substrate with smooth surface
10/24/2012CN102752960A Method of producing ceramic substrates
10/24/2012CN102752959A Lamination device
10/24/2012CN102751256A Packaging substrate of embedded passive assembly and manufacture method of packaging substrate
10/24/2012CN102747395A Improved circuit board plating line
10/24/2012CN102744932A Adhesive-free composite made of a polyarylene ether ketone foil and of a metal foil
10/24/2012CN102316679B Manufacture method for double-side aluminum circuit board
10/24/2012CN102164460B Alignment method for attaching chip or flexible circuit board to circuit substrate
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