Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2013
02/06/2013CN202715578U Circuit board vibrating washing device
02/06/2013CN1947475B Printed wiring board assembled panel, unit sheet for mounting printed wiring board, rigid-flexible board and method for manufacturing them
02/06/2013CN102918939A Circuit board and manufacturing method therefor
02/06/2013CN102918938A 配线板和电子装置 Wiring boards and electronic devices
02/06/2013CN102918937A Printed circuit board and method for producing printed circuit board
02/06/2013CN102918936A Electronic packaging device and method
02/06/2013CN102918935A Wiring board and manufacturing process for same
02/06/2013CN102918384A Method and apparatus for determining acceptance/rejection of fine diameter wire bonding
02/06/2013CN102917835A Junction material, manufacturing method thereof, and manufacturing method of junction structure
02/06/2013CN102917554A Manufacturing method of multilayer double-copper conductor plate
02/06/2013CN102917553A Welding positioning structure
02/06/2013CN102917552A Welding accessory coating method, welding pad and printed circuit board
02/06/2013CN102917551A Printed circuit board surface processing method and printed circuit board
02/06/2013CN102917550A Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
02/06/2013CN102917549A Circuit board soldermask bridge processing method
02/06/2013CN102917548A Anti-expansion method of copper foil in plasma treatment process of rigid-flex board
02/06/2013CN102917547A Method for balancing stress on soft board area of rigid-flexible board
02/06/2013CN102917546A Method for manufacturing polytetrafluoroethylene high-frequency circuit board
02/06/2013CN102917545A Method for manufacturing high-frequency silver immersion circuit board
02/06/2013CN102917544A Manufacturing method of high-frequency three-layer circuit board with impermeable slot
02/06/2013CN102917543A Drilling deviation preventing method of plates with height falls
02/06/2013CN102917542A Method for manufacturing copper PCB (Printed Circuit Board) circuit
02/06/2013CN102917541A Method for laminating reinforcing plate by using hollow accompanying plates
02/06/2013CN102917540A Selective hole copper removing method for printed circuit board
02/06/2013CN102917538A Circuit board structure and manufacture method thereof
02/06/2013CN102917536A Adhesion assisting agent fitted metal foil, and printed wiring board using thereof
02/06/2013CN102917533A Printed circuit board, design method thereof and terminal product mainboard
02/06/2013CN102917532A Basic circuit board with isolating membrane protection and preparation method thereof
02/06/2013CN102917531A Composite structure copper clad laminate and manufacture method thereof
02/06/2013CN102917530A Glass plate with conductive circuit and method for manufacturing glass plate with conductive circuit
02/06/2013CN102915933A Surface mounting welding process for wafer-level chip
02/06/2013CN102915154A Method for processing lines of touch panels
02/06/2013CN102912350A Etching solution and method for forming patterned multilayer metal layer
02/06/2013CN102036482B Manufacturing method of wiring substrate and design method of wiring substrate
02/06/2013CN102010673B High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed
02/06/2013CN101967628B Pore wall charge regulating agent for circuit board
02/06/2013CN101809107B Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
02/06/2013CN101395978B Circuit wiring board incorporating heat resistant substrate
02/06/2013CN101271996B Radio frequency recognizing electronic label antenna and method for producing the same
02/05/2013US8369098 Bracket for supporting motherboard
02/05/2013US8368223 Paste for forming an interconnect and interconnect formed from the paste
02/05/2013US8366903 Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method
02/05/2013US8365401 Circuit board and manufacturing method thereof
02/05/2013US8365400 Manufacturing process for a circuit board
02/05/2013US8365399 Method of connecting components to a printed circuit board
02/05/2013US8365398 Accurate alignment for stacked substrates
02/05/2013US8365372 Piezoelectric oscillating circuit, method for manufacturing the same and filter arrangement
02/05/2013CA2489647C Lead-in for electronic bobbins
01/2013
01/31/2013WO2013015448A1 Busbar cutting unit, busbar cutting method, and interior illumination device for vehicle
01/31/2013WO2013015355A1 Method of manufacturing oxide ceramic circuit board, and oxide ceramic circuit board
01/31/2013WO2013015157A1 Device and method for producing substrate
01/31/2013WO2013015155A1 Conductive paste for electron beam curing and method for producing circuit board using same
01/31/2013WO2013015093A1 Substrate production device
01/31/2013WO2013015056A1 Conductive pattern and method for producing same
01/31/2013WO2013014925A1 Screen printing device and screen printing method
01/31/2013WO2013014918A1 Method for manufacturing reusable paste, reusable paste, and method for manufacturing wiring substrate using reusable paste
01/31/2013WO2013014838A1 Wiring substrate
01/31/2013WO2013014735A1 Method for manufacturing substrate
01/31/2013WO2013014032A1 Connector and electronic device equipped with said connector and lighting device
01/31/2013US20130029619 Signal path termination
01/31/2013US20130029481 Templated circuitry fabrication
01/31/2013US20130029433 Process condition measuring device
01/31/2013US20130029031 Method for manufacturing interposer
01/31/2013US20130027921 Led lighting assembly having electrically conductive heat sink for providing power directly to an led light source
01/31/2013US20130027896 Electronic component embedded printed circuit board and method of manufacturing the same
01/31/2013US20130027894 Stiffness enhancement of electronic substrates using circuit components
01/31/2013US20130026932 Single inductor control of multi-color led systems
01/31/2013US20130026638 Wafer-Level Chip Scale Package
01/31/2013US20130026159 Oscillator systems having annular resonant circuitry
01/31/2013US20130026013 Dome array for use with a switch
01/31/2013US20130025925 Wiring board and method for manufacturing the same
01/31/2013US20130025922 Bonding entities to conjoined strips of conductive material
01/31/2013US20130025921 Method for manufacturing circuit board using electrically conductive particles and circuit board manufactured by the method
01/31/2013US20130025917 Copper column and process for producing same
01/31/2013US20130025915 Aresistive device with flexible substrate and method for manufacturing the same
01/31/2013US20130025914 Wiring board and method for manufacturing the same
01/31/2013US20130025369 Inertial Measurement Systems, and Methods of Use and Manufacture Thereof
01/31/2013US20130025120 Wiring board and manufacturing method for same
01/31/2013US20130025119 Printed Circuit Board With Reduced Dielectric Loss
01/31/2013DE10261576B4 Vorrichtung zum Beschichten einer Leiterplatte Apparatus for coating a printed circuit board
01/31/2013DE10231168B4 Verfahren zur Herstellung von federelastischen elektrischen Kontakten Process for the preparation of resilient electrical contacts
01/31/2013DE102012212082A1 Verfahren zum Herstellen von Silbernanopartikeln A process for producing silver nanoparticles
01/31/2013DE102012012508A1 Method for manufacturing e.g. micro secure digital card, with reduced overall height, involves removing part of soldering body protruding over end contour, and forming electrical connecting pad for body on side wall of end contour
01/31/2013DE102011079708A1 Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser Support means, electrical assembly having a support apparatus and process for producing these
01/30/2013EP2552124A1 Substrate with electro-acoustic conversion element mounted thereon, microphone unit, and manufacturing methods therefor
01/30/2013EP2550477A2 Interface and fabrication method for lighting and other electrical devices
01/30/2013CN202713804U Silk screen printing net plate used for soldering microwave printed board with cushion block
01/30/2013CN202713803U 电路板焊接治具 Circuit board welding fixture
01/30/2013CN202713802U Cantilever-type high-efficiency chip mounter
01/30/2013CN202713801U LED dedicated chip mounter
01/30/2013CN202713800U Bulk material automatic chip-mounting tool used for spacecraft electronic products
01/30/2013CN202713799U Improved horizontal board-brushing machine
01/30/2013CN202713798U Jet-flow type cleaning drying machine
01/30/2013CN202713797U Device for dismounting patch components of circuit board
01/30/2013CN202713796U Circuit board processing mould
01/30/2013CN202713795U Improved board airing frame for circuit board
01/30/2013CN202713794U Breaking fixture for circuit board
01/30/2013CN202705546U PCB (Printed Circuit Board) electroplating wire line
01/30/2013CN202705541U PCB (Printed Circuit Board) electroplating chuck
01/30/2013CN202705525U Circuit board pattern plating device