| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/10/2013 | US20130008706 Coreless packaging substrate and method of fabricating the same |
| 01/10/2013 | US20130008705 Coreless package substrate and fabrication method thereof |
| 01/10/2013 | US20130008703 Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| 01/10/2013 | US20130008702 Printed wiring board and method for manufacturing printed wiring board |
| 01/10/2013 | US20130008701 Multilayer printed wiring board |
| 01/10/2013 | US20130008700 Method of manufacturing printed wiring board, and printed wiring board |
| 01/10/2013 | US20130008698 Multilayer wiring board, production method of the same, and via paste |
| 01/10/2013 | US20130008586 Circuit substrate, circuit module and method for manufacturing the circuit substrate |
| 01/10/2013 | US20130008025 Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof |
| 01/10/2013 | US20130008024 Electronic Component-Embedded Printed Circuit Board and Method Of Manufacturing The Same |
| 01/10/2013 | US20130008023 Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance, and cooling structure and process |
| 01/10/2013 | US20130008022 Electrical current sensor device |
| 01/10/2013 | US20130008017 Method for mounting electronic parts |
| 01/10/2013 | DE102011106762A1 Method for wave soldering of e.g. printed circuit boards in wave soldering station to connect cooling bodies, involves preheating products for even heat distribution via solder masks, which consist of infrared transparent material portions |
| 01/10/2013 | DE102006023660C5 Elektrisches oder elektronisches Gerät Electrical or electronic device |
| 01/09/2013 | EP2544516A1 Method for manufacturing a metallized ceramic substrate |
| 01/09/2013 | EP2544515A1 Method for manufacturing a metallized substrate |
| 01/09/2013 | EP2543466A1 Method of forming microstructures, laser irradiation device, and substrate |
| 01/09/2013 | EP2543240A1 Electrical contact arrangement |
| 01/09/2013 | EP2542351A2 Dispenser for highly viscous fluid |
| 01/09/2013 | CN202663669U Air guide board of solder-resistant/resin plug hole printing circuit board |
| 01/09/2013 | CN202663668U Multi-element integral support |
| 01/09/2013 | CN202663667U Reflow welding jig locating with high accuracy |
| 01/09/2013 | CN202663666U Head plug-in mechanism for plug-in machine |
| 01/09/2013 | CN202663665U Transverse chip mounting head |
| 01/09/2013 | CN202663664U Straight-connected sealed chip mounting head |
| 01/09/2013 | CN202663663U Chip-mounter vacuum collection-distribution supply system |
| 01/09/2013 | CN202663662U Improved solder back-wash rack of printed circuit board |
| 01/09/2013 | CN202663661U Exposure alignment structure in circuit manufacturing process of printed circuit board |
| 01/09/2013 | CN202663660U Jig for producing printed circuit board with ultra-thin thickness |
| 01/09/2013 | CN202663659U Automatic circuit board bender |
| 01/09/2013 | CN202663646U Semicircular alignment pin for producing fine-line PCB (printed circuit board) |
| 01/09/2013 | CN202662441U Planar transformer for light-emitting diode (LED) lighting tube |
| 01/09/2013 | CN202661042U Auxiliary examination device for solder mask exposure alignment precision |
| 01/09/2013 | CN202655757U Wave soldering support plate |
| 01/09/2013 | CN102870514A Manufacturing-work machine and manufacturing-work system |
| 01/09/2013 | CN102870510A Printed substrate manufacturing method and printed substrate employing same |
| 01/09/2013 | CN102870509A Method for the treatment of a metal contact formed on a substrate |
| 01/09/2013 | CN102870508A Method for producing transparent printed wiring board, and method for producing transparent touch panel |
| 01/09/2013 | CN102870507A Method for introducing electrical insulations in printed circuit boards |
| 01/09/2013 | CN102870506A Method for partially stripping a defined area of a conductive layer |
| 01/09/2013 | CN102870505A Printed wiring board and method for manufacturing printed wiring board |
| 01/09/2013 | CN102870210A Substrate on which element is to be mounted, and process for production thereof |
| 01/09/2013 | CN102870006A Connection substrate |
| 01/09/2013 | CN102869740A One part epoxy resin including a low profile additive |
| 01/09/2013 | CN102869732A Ink for printing a mobile phone antenna pattern, method for manufacturing a synthetic resin part for a mobile phone on which an antenna pattern is printed using the ink, and synthetic resin part for a mobile phone on which an antenna pattern is print |
| 01/09/2013 | CN102869512A Screen printer |
| 01/09/2013 | CN102869474A 激光加工装置 The laser processing apparatus |
| 01/09/2013 | CN102869208A Method for controlling depth of two-sided inserting blind hole of printed circuit board |
| 01/09/2013 | CN102869207A Laminating method for multi-layer LED mixed-material circuit boards |
| 01/09/2013 | CN102869206A Method for co-plating metallization of blind holes and through hole of printed circuit board |
| 01/09/2013 | CN102869205A Method for shaping printed circuit board (PCB) plated-through hole |
| 01/09/2013 | CN102869204A Manufacture method of rigid-flex board |
| 01/09/2013 | CN102869203A Method for fabricating the flexible electronic device |
| 01/09/2013 | CN102869202A Control system of LED chip mounter |
| 01/09/2013 | CN102869201A Module type high-speed mounting head for chip mounter |
| 01/09/2013 | CN102869200A Feeding mechanism for LED (light emitting diode) chip mounter |
| 01/09/2013 | CN102869199A Manufacture method of flexible circuit board |
| 01/09/2013 | CN102869198A Manufacturing method of wiring circuit board |
| 01/09/2013 | CN102869197A Method for forming flexible circuit board |
| 01/09/2013 | CN102869196A Method for preventing solder ball of PCB (printed circuit board) heat radiation pad and PCB heat radiation device with function of solder ball prevention |
| 01/09/2013 | CN102869195A Method and device for batch production of printed circuit board |
| 01/09/2013 | CN102869194A Manual film pressing device |
| 01/09/2013 | CN102869193A Method for processing printed circuit board (PCB) and PCB |
| 01/09/2013 | CN102869192A Manufacturing method of flexible substrate |
| 01/09/2013 | CN102869191A Manufacturing method of printed circuit board |
| 01/09/2013 | CN102869188A Printed circuit board with omnidirectional anti-static function and manufacture method thereof |
| 01/09/2013 | CN102867624A Inductor packaging structure |
| 01/09/2013 | CN102867620A Inductor component |
| 01/09/2013 | CN102866279A 电流传感器装置 Current sensor means |
| 01/09/2013 | CN102863872A Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
| 01/09/2013 | CN102862147A Latch device of workpiece reloading handle |
| 01/09/2013 | CN102281721B Manufacture method of printed circuit board with surface-pressure covering film |
| 01/09/2013 | CN102111965B Method for fabricating circuit board |
| 01/09/2013 | CN102059867B Printing method of blind-hole printing solder mask of printed circuit board (PCB) |
| 01/09/2013 | CN101985752B Spray etching device |
| 01/09/2013 | CN101808472B Method for producing electronic part unit |
| 01/09/2013 | CN101683011B Method for producing multilayer ceramic substrate and composite sheet |
| 01/09/2013 | CN101627668B Use of silane compositions for the production of mutilayer laminates |
| 01/09/2013 | CN101587981B Antenna and manufacturing method thereof |
| 01/09/2013 | CN101573784B Electrode structure and method for forming bump |
| 01/09/2013 | CN101553546B Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks |
| 01/09/2013 | CN101494950B Wiring board with through hole or non through hole and method of manufacturing the same |
| 01/09/2013 | CN101310384B A method of substrate manufacture that decreases the package resistance |
| 01/08/2013 | US8351215 Method of manufacturing a chip embedded printed circuit board |
| 01/08/2013 | US8351214 Electronics module comprising an embedded microcircuit |
| 01/08/2013 | US8349149 Apparatus for enhanced electrochemical deposition |
| 01/08/2013 | US8347494 Electronic component mounting method |
| 01/08/2013 | US8347493 Wiring board with built-in electronic component and method of manufacturing same |
| 01/04/2013 | DE202012104631U1 Rakelsystem für einen Siebdrucker Blade system for a screen printer |
| 01/03/2013 | WO2013003078A1 Bonded double substrate approach to solve laser drilling problems |
| 01/03/2013 | WO2013002875A1 Compact thermal module |
| 01/03/2013 | WO2013002684A1 A vehicle safety arrangement |
| 01/03/2013 | WO2013002407A1 Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module |
| 01/03/2013 | WO2013002308A1 Multilayer ceramic substrate and manufacturing method therefor |
| 01/03/2013 | WO2013002112A1 Process for producing solder joint with improved reliability |
| 01/03/2013 | WO2013002035A1 Component embedded substrate |
| 01/03/2013 | WO2013001973A1 Multilayer ceramic substrate, method for manufacturing same, and electronic component module |
| 01/03/2013 | WO2013001815A1 Screen printing device and image recognition method for screen printing device |
| 01/03/2013 | WO2013001801A1 Substrate, metal film, method for producing substrate, and method for producing metal film |