Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2013
01/02/2013CN102850982A Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
01/02/2013CN102850726A Composite material, high frequency circuit substrate produced by using composite material, and production method of high frequency circuit substrate
01/02/2013CN102848095A Bonding material, bonded portion and circuit board
01/02/2013CN102271465B Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers
01/02/2013CN102212304B Flexible circuit conductive composition, preparation method and using method thereof
01/02/2013CN102205459B Equipment for automatically welding battery circuit board and using method of equipment
01/02/2013CN102026484B Pressing and breakover process and laminating board structure of circuit board
01/02/2013CN102009515B Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof
01/02/2013CN101918505B Electrically conductive adhesive
01/02/2013CN101911846B Method for forming circuit
01/02/2013CN101687405B Release sheet
01/02/2013CN101658083B Use of an adhesive composition for die-attaching high power semiconductors
01/02/2013CN101658082B Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
01/02/2013CN101619450B Adhesive layer forming liquid
01/02/2013CN101514456B Etching liquid and cuprum wiring forming method by using the same
01/02/2013CN101511153B Electronics casing with a circuit board and method for producing an electronics casing
01/02/2013CN101370837B Active energy ray-curable resin composition and use thereof
01/02/2013CN101204124B Warpage preventing substrates and method of making the same
01/01/2013US8345203 Display device and manufacturing method thereof
01/01/2013US8344518 Apparatus for stacking integrated circuits
01/01/2013US8344257 Flexible printed circuit and fabrication method thereof
01/01/2013US8343270 Hardenable reaction resin system
01/01/2013US8342652 Molded nozzle plate with alignment features for simplified assembly
01/01/2013US8342384 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
01/01/2013US8341836 Manufacturing method of an airtight container
01/01/2013US8341835 Buildup dielectric layer having metallization pattern semiconductor package fabrication method
01/01/2013US8341834 Method of producing a land grid array (LGA) interposer structure
01/01/2013US8341833 Method for manufacturing printed wiring board
12/2012
12/27/2012WO2012178111A2 Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
12/27/2012WO2012176933A1 Noise suppression device and multilayer printed circuit board carrying same
12/27/2012WO2012176793A1 Pattern forming method, pattern forming system, and pattern structure manufacturing method
12/27/2012WO2012176764A1 Laminated body and method for producing same
12/27/2012WO2012176591A1 Surface treating composition for copper and copper alloy and utilization thereof
12/27/2012WO2012176424A1 Method for manufacturing laminated plate
12/27/2012WO2012176423A1 Laminated plate manufacturing method
12/27/2012WO2012176402A1 Circuit module
12/27/2012WO2012176247A1 Printed circuit board
12/27/2012WO2012176246A1 Printed circuit board
12/27/2012WO2012176230A1 Screen printing apparatus
12/27/2012WO2012176229A1 Screen printing apparatus
12/27/2012WO2012175207A2 Electronic assembly and method for the production thereof
12/27/2012WO2012124950A3 Pattern roll, method for pattern forming and printing apparatus comprising the same
12/27/2012WO2012120032A3 Assembly having a substrate, an smd component, and a lead frame part
12/27/2012US20120329933 Aromatic polycarbonate composition
12/27/2012US20120329912 Fused filler and its manufacturing method and use
12/27/2012US20120329359 Powered toy building structures and related devices and methods
12/27/2012US20120327626 Wiring substrate, its manufacturing method, and semiconductor device
12/27/2012US20120327623 Printed circuit board and layout method thereof
12/27/2012US20120327614 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
12/27/2012US20120327583 Robust power plane configuration in printed circuit boards
12/27/2012US20120326334 Interposer, its manufacturing method, and semiconductor device
12/27/2012US20120325524 Flex-rigid wiring board and method for manufacturing the same
12/27/2012US20120324725 Component mounting device and component mounting method
12/27/2012US20120324724 Method for making phase change memory
12/27/2012US20120324723 Method of manufacturing coreless substrate
12/27/2012DE112010003285T5 Kameramodul auf Wafer-Niveau mit gegossenem Gehäuse und Verfahren zu seiner Herstellung Camera module at the wafer level with molded case and process for its preparation
12/27/2012DE102012105488A1 Gedruckte Verdrahtungsplatine mit verbeserter Korrosionsbeständigkeit und Ausbeute Printed wiring board with verbeserter corrosion resistance and yield
12/27/2012DE102012105439A1 Gedruckte Verdrahtungsplatine (PWB) mit Lötaugen A printed wiring board (PWB) with pads
12/27/2012DE102011105596A1 Verfahren zum Herstellen von elektrischen,-elektronischen Funktionen auf einem Substrat sowie Bauteil A method for manufacturing of electrical, -elektronischen features on a substrate, as well as component
12/27/2012DE102011105346A1 Elektronische Baugruppe und Verfahren zu deren Herstellung An electronic assembly and methods for their preparation
12/27/2012DE102011077872A1 Electrically conductive flexible strip conductor for use as e.g. signal line element for seat of vehicle, has fiber material integrated into electrically conductive material, where conductor is molded onto flexible material by jet method
12/27/2012DE102010044299B4 Verfahren zur Herstellung von elektronischen Bauteilen und Tintenset zur Durchführung des Verfahrens A process for the production of electronic components and ink set for performing the method
12/26/2012EP2538761A1 Intelligent Power Module and related assembling method
12/26/2012EP2538439A1 Substrate for mounting element, and method for manufacturing the substrate
12/26/2012EP2537401A1 Composition for printing a seed layer and process for producing conductor tracks
12/26/2012EP2536564A1 Method for printing product features on a substrate sheet
12/26/2012EP2256793B1 Ball-arranging substrate for placement of bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls
12/26/2012CN202634901U Flexible printed circuit (FPC) combined bonding movable jig
12/26/2012CN202634900U Pressing device for multilayer flex-rigid printed circuit board
12/26/2012CN202634899U Low-temperature welding system for flexible polyester circuit board
12/26/2012CN202634898U Circuit board welding tool
12/26/2012CN202634897U Mounting component device for flexible circuit board
12/26/2012CN202634896U Visual identification assembly device
12/26/2012CN202634895U Bearing box for loading PCB board
12/26/2012CN202634894U Flexible printed circuit (FPC) hot-pressing auxiliary surrounding groove jig
12/26/2012CN202634893U Device for direct pre-overlapping after brownification
12/26/2012CN202634892U Novel steel sheet reinforcing machine for rigid-flexible plates
12/26/2012CN202634891U Leveling and V-shaped groove carving integrated machine of printed-circuit board
12/26/2012CN202634890U Antioxidant production line of printed circuit board
12/26/2012CN202634889U Water sucking device and wet processing apparatus
12/26/2012CN202634888U Circuit board compressed tablet fastener
12/26/2012CN202634881U Auxiliary aligning structure for inner-layer circuits of multilayer circuit board
12/26/2012CN202634720U FPC reinforcement process assembling and heating platform
12/26/2012CN202623489U Screen printing device in electronic part installation system
12/26/2012CN202622123U Board falling alarm device for wave soldering and wave soldering equipment
12/26/2012CN202622122U Locking and pressing device for tin-passing furnace jig
12/26/2012CN102845141A Circuit board and manufacturing method therefor
12/26/2012CN102845140A Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein
12/26/2012CN102845139A Membrane wiring board
12/26/2012CN102844849A Member mounting method
12/26/2012CN102844711A Solder resist composition and printed-circuit board
12/26/2012CN102844709A Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board
12/26/2012CN102844191A Screen printing head, method of screen printing and printing blade
12/26/2012CN102843877A A printed wiring board and a method for manufacturing the printed wiring board
12/26/2012CN102843876A A method of manufacturing a multilayer circuit board and the multilayer circuit board
12/26/2012CN102843875A Alignment control method for multiple layers of PCBs
12/26/2012CN102843874A Printed type glue adding method and equipment
12/26/2012CN102843873A Mounting head device for multifunctional chip mounting device with special shape
12/26/2012CN102843872A Mounting head structure of multifunctional special chip mounter
12/26/2012CN102843871A Adhesive tape forming and bending mechanism of flexible circuit board