Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2013
01/16/2013CN202679805U Novel cold press capable of controlling inlet air temperature
01/16/2013CN202679804U Auxiliary tool for producing soft circuit boards
01/16/2013CN202678701U ACF sticking device
01/16/2013CN202678078U Transformer and switch power source provided with the same and light-emitting diode (LED) daylight lamp
01/16/2013CN202671690U Clamp used in electroplating printed wiring board
01/16/2013CN202667868U Wave-soldering clamp for LED (Light Emitting Diode) illuminating tubes
01/16/2013CN202667857U Temperature raising device for solder paste
01/16/2013CN202667854U Reflow soldering equipment
01/16/2013CN1845984B Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards
01/16/2013CN102884878A Frame unit, mounting board unit, and method for manufacturing the mounting board unit
01/16/2013CN102884872A Multilayer wiring board and method for manufacturing multilayer wiring board
01/16/2013CN102884871A A pre-lamination core and method for making a pre-lamination core for electronic cards and tags
01/16/2013CN102884870A Selective patterning for low cost through vias
01/16/2013CN102884869A Method and composite assembly for processing or treating a plurality of printed circuit boards and use therefor
01/16/2013CN102884228A Copper foil for printed circuit
01/16/2013CN102883846A Solder return for wave solder nozzle
01/16/2013CN102883583A Heat dissipating high power systems
01/16/2013CN102883558A Manufacturing method of single plating hole copper
01/16/2013CN102883557A Production process improvement method of flexible printed circuit board containing welding finger
01/16/2013CN102883556A Copper block oxide method
01/16/2013CN102883555A Soft and hard combined plate lamination method
01/16/2013CN102883554A Mobile phone circuit board manufacture method, mobile phone circuit board and mobile phone
01/16/2013CN102883553A Maintenance jig of soldering block
01/16/2013CN102883552A LGA and BGA repair process
01/16/2013CN102883551A Mounting apparatus, coating apparatus, mounting method, coating method, and program
01/16/2013CN102883550A Welding method of shielding cover and electronic circuit board
01/16/2013CN102883549A Circuit board with heat collection structure and manufacturing method for circuit board
01/16/2013CN102883548A Component mounting and dispatching optimization method for chip mounter on basis of quantum neural network
01/16/2013CN102883547A Press fitting process for outgoing lines of printed boards of automotive electrical appliances
01/16/2013CN102883546A Thick copper plate solder resistance process
01/16/2013CN102883545A Protection process for inner layer welding point of soft and hard combined plate
01/16/2013CN102883544A Method of preventing via hole from oil dropping in lead-free HASL process of circuit board
01/16/2013CN102883543A Method for manufacturing conducting circuit by additive process
01/16/2013CN102883542A Production method of substrate surface circuit diagraph
01/16/2013CN102883541A Plasma sandwiched film removing method
01/16/2013CN102883540A Non-vacuum film pressing bubble removing method of variable-thickness soft-hard combined plate
01/16/2013CN102883539A Manufacturing process improvement method for pluggable flexible printed circuit (FPC)
01/16/2013CN102883538A Automatic forming machine of flexible printed circuit board (FPC)
01/16/2013CN102883537A Automatic forming machine of flexible printed circuit board (FPC)
01/16/2013CN102883536A Processing method of through holes of printed circuit board (PCB) and through hole structure
01/16/2013CN102883535A Method for manufacturing circuit board by masking holes by wet films
01/16/2013CN102883534A Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board
01/16/2013CN102883533A Method for manufacturing ultrathin copper-clad laminate
01/16/2013CN102883532A Full-automatic flexible plate bending material-taking machine
01/16/2013CN102883531A Jig for pasting rubber belt
01/16/2013CN102883530A Positioning mold for circuit board
01/16/2013CN102883529A Packaging structure two-pin element
01/16/2013CN102883527A Flexible circuit board for LED and manufacturing method of flexible circuit board
01/16/2013CN102883524A Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method
01/16/2013CN102883522A Printed circuit board, method and device for drilling printed circuit board
01/16/2013CN102883521A Carrier member and method for manufacturing same and method for manufacture of printed circuit board using same
01/16/2013CN102883519A Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof
01/16/2013CN102881405A Combined structure of transformer and inductance element and forming method for combined structure
01/16/2013CN102877098A Multi-waveband output pulse plating method
01/16/2013CN102876277A Adhesive composition, circuit connecting material using same, method for connecting circuit members, and circuit connection structure
01/16/2013CN102248244B Fully-automatic tin soldering machine
01/16/2013CN102227158B Stitching clamp of FPC golden finger
01/16/2013CN102223769B Anti-floating and anti-tilt tool in circuit board wave soldering process
01/16/2013CN102137549B Electronic component layout method of circuit board with adhesive surfaces on both sides
01/16/2013CN102111956B Base material for printed circuit board
01/16/2013CN102056413B Method for manufacturing printed circuit board
01/16/2013CN102045967B Manufacturing method of multilayer printed wiring board
01/16/2013CN102045941B Embedded type circuit board structure and manufacturing method thereof
01/16/2013CN102026492B Method and device for spraying printing ink on circuit board
01/16/2013CN102006735B Method for manufacturing multilayer printed circuit board
01/16/2013CN101998774B Component wave-peak welding clamp for high-power circuit board
01/16/2013CN101982024B Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
01/16/2013CN101981230B Copper foil for printed circuit board and copper clad laminate plate for printed circuit board
01/16/2013CN101971719B Method for manufacturing multi-piece substrate, and multi-piece substrate
01/16/2013CN101654605B Modified epoxy resin adhesive and preparation method thereof
01/16/2013CN101535895B Photosensitive resin composition, and flexible print circuit board using the same
01/15/2013US8354596 Multilayer wiring board and method for manufacturing the same
01/15/2013US8354594 Wire-printed circuit board or card comprising conductors with a rectangular or square cross section
01/15/2013US8353103 Manufacturing method of multilayer printed wiring board
01/15/2013US8353102 Wiring board connection method
01/15/2013US8353101 Method of making substrate package with through holes for high speed I/O flex cable
01/15/2013CA2529899C Parts for passive electronic components and method for production thereof
01/10/2013WO2013006103A1 An electrical unit
01/10/2013WO2013005847A1 Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board
01/10/2013WO2013005656A1 Printed board
01/10/2013WO2013005631A1 Etching liquid for copper or compound having copper as primary component
01/10/2013WO2013005576A1 Wiring board
01/10/2013WO2013005549A1 Flexible multilayer substrate
01/10/2013WO2013005451A1 Multi-layer wiring board and method for producing multi-layer wiring board
01/10/2013WO2013005067A1 Sensor unit and bearing assembly comprising such a sensor unit
01/10/2013WO2013004624A1 Method for providing organic resist adhesion to a copper or copper alloy surface
01/10/2013WO2013004550A1 Screen-printing system for a photovoltaic cell, and related methods
01/10/2013WO2013004483A1 Circuit board having contacts
01/10/2013WO2013004439A1 Device and method for plasma treatment of surfaces
01/10/2013WO2012144855A3 Flux for solder paste, solder paste and solder bump, and preparation methods thereof
01/10/2013US20130012000 Substrate dividing method
01/10/2013US20130011682 Resin composition, and prepeg and laminate prepared using the same
01/10/2013US20130011576 Display device and light sensing system
01/10/2013US20130010996 Welding type condenser microphone using curling and method of assemblying the same
01/10/2013US20130010440 Power Module and Method for Manufacturing the Same
01/10/2013US20130010432 Printed board assembly interface structures
01/10/2013US20130010406 Device having snaps with soldered snap members
01/10/2013US20130009825 Micropatterning of conductive graphite particles using microcontact printing
01/10/2013US20130009727 Surface mountable multi-layer ceramic filter
01/10/2013US20130009284 Substrate dividing method