| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/20/2013 | CN102939803A Multilayer wiring substrate, and manufacturing method for multilayer wiring substrate |
| 02/20/2013 | CN102939802A Method of manufacturing conductive structures |
| 02/20/2013 | CN102939801A Method of manufacture of flexible printed circuits |
| 02/20/2013 | CN102939768A Substrate with electro-acoustic conversion element mounted thereon, microphone unit, and manufacturing methods therefor |
| 02/20/2013 | CN102939645A Method of manufacturing connection structure |
| 02/20/2013 | CN102939610A Method, system and apparatus for making short run radio frequency identification tags and labels |
| 02/20/2013 | CN102939565A Method and apparatus for performing pattern alignment |
| 02/20/2013 | CN102939407A Etchant for metal wiring and method for manufacturing metal wiring using the same |
| 02/20/2013 | CN102939396A Method for recycling of obsolete printed circuit boards |
| 02/20/2013 | CN102938985A Method for coarsening and copper deposition of full-board cover film flexible-rigid combination board |
| 02/20/2013 | CN102938984A Vertical element pin structure for being welded to PCB (Printed Circuit Board) |
| 02/20/2013 | CN102938983A Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
| 02/20/2013 | CN102938982A Processing method of printed wiring board with ultra-small solder mask intervals |
| 02/20/2013 | CN102938981A Vacuum defoaming processing method of thick copper soldering-resistance plate |
| 02/20/2013 | CN102938980A Flexible-rigid combination board solder mask washing method |
| 02/20/2013 | CN102938979A Bending device of flexible circuit board |
| 02/20/2013 | CN102938978A Thick-ceramic-base printed circuit board processing method |
| 02/20/2013 | CN102938977A Defective take-out unit of defective take-out machine module |
| 02/20/2013 | CN102938976A Pressure printing unit of PCB (printed circuit board) nondefective automatic pressure printer module |
| 02/20/2013 | CN102938975A Horizontal conveying mechanism of defective take-out machine module |
| 02/20/2013 | CN102938974A Main body device of defective take-out machine module |
| 02/20/2013 | CN102938973A Fully-automatic flexible detection production line for PCBs (Printed Circuit Boards) |
| 02/20/2013 | CN102938972A Good product automatic presser module of fully-automatic flexible detection production line for PCBs (Printed Circuit Boards) |
| 02/20/2013 | CN102938971A Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
| 02/20/2013 | CN102938970A Composite heat conduction type printed circuit board (PCB) and manufacture method thereof |
| 02/20/2013 | CN101998778B Method of manufacturing flexible printed circuit board |
| 02/20/2013 | CN101990355B Soft-hard circuit board and process thereof |
| 02/20/2013 | CN101754587B Protection technology for flexibile window of flex-rigid multiple-layer printed board |
| 02/20/2013 | CN101533325B Double-sided touch sensitive panel and flex circuit bonding |
| 02/19/2013 | US8380326 Insulated implantable electrical circuit |
| 02/19/2013 | US8380080 Optical transceiver |
| 02/19/2013 | US8378239 Hermetic feed-through with hybrid seal structure |
| 02/19/2013 | US8378229 Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 02/19/2013 | US8378222 Method of reducing solder wicking on a substrate |
| 02/19/2013 | US8378116 Phenylnaphthylimidazole compound and usage of the same |
| 02/19/2013 | US8377585 Low cost electrical terminals manufactured from conductive loaded resin-based materials |
| 02/19/2013 | US8375576 Method for manufacturing wafer scale heat slug system |
| 02/19/2013 | US8375575 Method of fabricating a lightweight audio system housing assembly |
| 02/14/2013 | WO2013023101A1 Multiple layer z-axis interconnect apparatus and method of use |
| 02/14/2013 | WO2013022137A1 Method for manufacturing photosensitive inkjet ink for a semiconductor capable of forming an ultrahigh-density microcircuit pattern |
| 02/14/2013 | WO2013022136A1 Method for manufacturing photosensitive inkjet ink for an electrode capable of forming an ultrahigh-density microcircuit pattern |
| 02/14/2013 | WO2013022068A1 Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist |
| 02/14/2013 | WO2013021893A1 Laminated body production device and laminated body production method |
| 02/14/2013 | WO2013021770A1 Solder printing system |
| 02/14/2013 | WO2013021769A1 Solder printing system |
| 02/14/2013 | WO2013021734A1 Resin composition for resists |
| 02/14/2013 | WO2013021477A1 Circuit substrate manufacturing method |
| 02/14/2013 | WO2013021400A1 Panel lamination apparatus and method |
| 02/14/2013 | WO2013020765A1 Electrically conductive heat-activated adhesive compound |
| 02/14/2013 | WO2013020543A1 Method for producing a low-induction busbar |
| 02/14/2013 | WO2013020377A1 Rubberizing nose and rubberizing paper device applying same |
| 02/14/2013 | WO2013020309A1 Electronic component embedded circuit board and manufacturing method thereof |
| 02/14/2013 | WO2012167937A3 Method for producing circuit boards and complete circuit board panels |
| 02/14/2013 | US20130040154 Formation of Solid Layers on Substrates |
| 02/14/2013 | US20130040153 Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate |
| 02/14/2013 | US20130039380 Sensor device |
| 02/14/2013 | US20130039065 Semiconductor light-emitting element mounting module, semiconductor light-emitting element module, manufacturing method of semiconductor light-emitting element mounting module, and manufacturing method of semiconductor light-emitting element module |
| 02/14/2013 | US20130039041 Lighting device for direct and indirect lighting |
| 02/14/2013 | US20130039020 Passenger service unit |
| 02/14/2013 | US20130039018 Three-Dimensionally Molded Electronic Substrate |
| 02/14/2013 | US20130038970 Surge protected devices and methods for treatment of water with electromagnetic fields |
| 02/14/2013 | US20130037513 Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board |
| 02/14/2013 | US20130037309 Terminal-integrated metal base package module and terminal-integrated metal base packaging method |
| 02/14/2013 | DE102008032979B4 Elektromagnetische Bandgap-Struktur, diese umfassende Leiterplatte und Herstellungsverfahren Electromagnetic bandgap structure, this comprehensive PCB and manufacturing processes |
| 02/13/2013 | EP2557906A1 Method of forming microstructures, laser irradiation device, and substrate |
| 02/13/2013 | EP2557904A1 Three-dimensionally molded electronic substrate |
| 02/13/2013 | EP2557633A1 Press fit terminal and semiconductor device |
| 02/13/2013 | EP2557204A1 Copper foil for printed circuit |
| 02/13/2013 | EP2556732A1 A pre-lamination core and method for making a pre-lamination core for electronic cards and tags |
| 02/13/2013 | EP2556731A2 Process for producing electric circuits on a given surface |
| 02/13/2013 | EP2556730A1 Selective patterning for low cost through vias |
| 02/13/2013 | EP2556299A2 Flat lighting elements, array of flat lighting elements and method for producing flat lighting elements |
| 02/13/2013 | EP2556126A2 Two-component, polyaspartic coating compositions |
| 02/13/2013 | EP2138021B1 Electrical connection of components |
| 02/13/2013 | CN202738278U Automatic PIN pressing machine |
| 02/13/2013 | CN202738277U SMT preprocessing device for POP package |
| 02/13/2013 | CN202738276U Electronic component installation system |
| 02/13/2013 | CN202738275U Wave soldering jig capable of preventing solder bridge |
| 02/13/2013 | CN202738274U Automatic chip mounter |
| 02/13/2013 | CN202738273U Dotting fixture |
| 02/13/2013 | CN202738272U Delta jig for straight line-type IC molding |
| 02/13/2013 | CN202738271U PCB board re-washing cylinder |
| 02/13/2013 | CN202738270U Plasma processor for PTFE |
| 02/13/2013 | CN202738269U Packaging structure of circuit board |
| 02/13/2013 | CN202738268U Water-saving type developing production line for printed circuit board (PCB) production |
| 02/13/2013 | CN202738267U Auxiliary tool used for ultrathin flexibility printed circuit |
| 02/13/2013 | CN202738266U Pressing jig for reinforcing plate of flexibility printed circuit |
| 02/13/2013 | CN202738265U Simple storehouse plates for PCB baking box |
| 02/13/2013 | CN202738264U Chip positioning fixture and electronic system thereof |
| 02/13/2013 | CN202736643U Flat transformer adhering and fixing device |
| 02/13/2013 | CN202735680U Developing device of circuit board |
| 02/13/2013 | CN202726246U Tin furnace jig |
| 02/13/2013 | CN202726244U Flat cable welding positioning tool |
| 02/13/2013 | CN202726235U Automatic floating machine |
| 02/13/2013 | CN102934532A Method for producing an electrical connection and electrical connection |
| 02/13/2013 | CN102934531A Printed circuit board, antenna, wireless communication device and manufacturing methods thereof |
| 02/13/2013 | CN102934530A Method for manufacturing wiring board |
| 02/13/2013 | CN102934244A Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body and radiation-emitting semiconductor component |
| 02/13/2013 | CN102934224A Microelectronic package and method of manufacturing same |
| 02/13/2013 | CN102934223A Bumpless build-up layer package design with an interposer |