Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/20/1987 | US4637853 Hollow cathode enhanced plasma for high rate reactive ion etching and deposition |
01/20/1987 | US4637541 Circuit board soldering device |
01/20/1987 | US4637135 Method for mounting a connector to a substrate |
01/20/1987 | US4637118 Machine tool for drilling printed circuit boards |
01/20/1987 | EP0126742A4 Inking system for producing circuit patterns. |
01/17/1987 | CN85101878A 电路板 Circuit board |
01/15/1987 | WO1987000391A1 Process for conditioning the surface of plastic substrates prior to metal plating |
01/15/1987 | WO1987000390A1 Method of manufacturing printed circuit boards |
01/15/1987 | WO1987000212A1 Treatment for copper foil |
01/15/1987 | WO1987000209A1 Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing |
01/15/1987 | DE3524832A1 Fabrication of thin-film circuits |
01/15/1987 | DE3524807A1 Fabrication of thin-film circuits |
01/14/1987 | EP0208492A2 Assembly of surface mounted components |
01/14/1987 | EP0208177A2 Ultrathin copper foil and process for producing such foil |
01/14/1987 | EP0208087A2 Plastic element with conductive tracks |
01/14/1987 | EP0208023A1 Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections |
01/14/1987 | EP0208012A1 Method of manufacturing holes free from shavings |
01/14/1987 | EP0128899B1 Method and apparatus for mounting multilead components on a circuit board |
01/13/1987 | US4636813 Thermal print head |
01/13/1987 | US4636534 Etch resistant ink |
01/13/1987 | US4636453 Photopolymer films containing microencapsulated sensitometric adjuvants |
01/13/1987 | US4636441 Crown or crypt compound, high adhesive strength |
01/13/1987 | US4636406 Method and apparatus for dispensing solder paste |
01/13/1987 | US4636403 Method of repairing a defective photomask |
01/13/1987 | US4636257 Silk screen printing paste with lead glass which is to be fired in a non-oxidizing atmosphere |
01/13/1987 | US4636018 Elastomeric electrical connector |
01/13/1987 | US4636016 Accessory connector |
01/13/1987 | US4635666 Batch cleaning apparatus |
01/13/1987 | US4635584 Apparatus for tinning printed-circuit boards |
01/13/1987 | US4635368 Apparatus for making electronic circuit boards |
01/13/1987 | US4635358 Method for forming electrically conductive paths through a dielectric layer |
01/13/1987 | US4635356 Encapsulating electrical elements in resin, but leaving terminal for connection |
01/13/1987 | US4635354 Low cost electronic apparatus construction method |
01/13/1987 | US4635346 Method for producing hybrid integrated circuit |
01/13/1987 | CA1216680A1 Composite product having patterned metal layer and process |
01/13/1987 | CA1216630A1 Method and apparatus for testing of electrical interconnection networks |
01/08/1987 | DE3622223A1 Method for producing an electronic network module |
01/08/1987 | DE3524138A1 Device for contacting opto-electronic components on printed-circuit boards |
01/08/1987 | DE3523440A1 Display device with an electro-optical cell |
01/08/1987 | DE3522852A1 Process for fabricating an intermediate carrier for semiconductor bodies |
01/08/1987 | DE3522703A1 Circuit board with ceramic chip carrier material |
01/08/1987 | DE3522647A1 Circuit module motherboard |
01/07/1987 | EP0207893A2 Image-forming process |
01/07/1987 | EP0207853A1 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card |
01/07/1987 | EP0207852A1 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card |
01/07/1987 | EP0207732A1 Plating bath and method for electroplating tin and/or lead |
01/07/1987 | EP0207587A1 High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards |
01/07/1987 | EP0207586A1 Sodium permanganate etch baths and their use in cleaning, desmearing and/or etching resinous substrates |
01/07/1987 | EP0207495A2 Process for producing novel photosensitive resins |
01/07/1987 | EP0207484A2 Copper stainproofing technique |
01/07/1987 | EP0207466A2 Circuit substrate |
01/07/1987 | EP0207188A2 Resin composition for solder resist ink |
01/07/1987 | CN85105318A Printed resister, its fabrication and use |
01/06/1987 | US4635289 Method and apparatus for inspecting printed wiring boards |
01/06/1987 | US4635093 Electrical connection |
01/06/1987 | US4634826 Method for producing electric circuits in a thin layer, the tool to implement the method, and products obtained therefrom |
01/06/1987 | US4634655 Water-soluble polymer and ammonium dichromate |
01/06/1987 | US4634644 Printing plates, printed circuits |
01/06/1987 | US4634631 Flexible circuit laminate and method of making the same |
01/06/1987 | US4634619 Process for electroless metal deposition |
01/06/1987 | US4634603 Simultaneous, of printed circuits |
01/06/1987 | US4634503 Printed circuits |
01/06/1987 | US4634468 Catalytic metal of reduced particle size |
01/06/1987 | US4634207 Apparatus and method for protection of a substrate |
01/06/1987 | US4634039 Nonionic surfactant polyol, kaolin or talc |
01/06/1987 | US4633584 Accurate positioning of solid components for a robotic pickup |
01/06/1987 | CA1216219A1 Automatic laminator |
01/06/1987 | CA1216178A1 Thick film silver metallization composition |
01/06/1987 | CA1216177A1 Thick film gold metallization composition |
01/02/1987 | DE3617497A1 Method and device for determining the total area of the conductor tracks of a printed circuit board |
01/02/1987 | DE3522091A1 Hybrid circuit with envelope |
12/31/1986 | WO1986007663A1 Surface mount compatible connector system with mechanical integrity |
12/31/1986 | WO1986007568A1 Method for producing enhanced bonds between surfaces and articles produced by the method |
12/30/1986 | US4633239 Integrated circuit package holder |
12/30/1986 | US4633050 Nickel/indium alloy for use in the manufacture of electrical contact areas electrical devices |
12/30/1986 | US4633035 Copper and aluminum laminate; anodizing, electroplating, etching |
12/30/1986 | US4632900 Process for the production of images after electrodeposition of positive photoresist on electrically conductive surface |
12/30/1986 | US4632897 Photopolymerizable recording material suitable for the production of photoresist layers |
12/30/1986 | US4632857 Electrolessly plated product having a polymetallic catalytic film underlayer |
12/30/1986 | US4632852 Process for electroless copper plating |
12/30/1986 | US4632845 Electronic switching elements or circuits |
12/30/1986 | US4632727 Nitric acid, polymer surfactant, alkane sulfonic acid |
12/30/1986 | US4632295 Reduction atmosphere workpiece joining |
12/30/1986 | US4631820 Mounting assembly and mounting method for an electronic component |
12/30/1986 | US4631819 Low stress, tolerance free method for mounting power devices |
12/30/1986 | EP0207012A2 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method |
12/30/1986 | EP0206712A2 Misregistration/distortion correction scheme |
12/30/1986 | EP0206709A2 Automatic optical inspection of printed circuit boards |
12/30/1986 | EP0206620A2 Self-heating, self-soldering bus bar |
12/30/1986 | EP0206619A2 Self-soldering, flexible circuit connector |
12/30/1986 | EP0206584A1 Surface mountable electronic device |
12/30/1986 | EP0206337A2 Multilayer wiring substrate with engineering change pads |
12/30/1986 | EP0206261A2 Process for producing a photosensitive layer on a support |
12/30/1986 | EP0206231A2 A method and device for soldering electronic components on printed circuit boards |
12/30/1986 | EP0206179A2 Molded product having printed circuit board |
12/30/1986 | EP0206133A1 Use of polypyrrole to deposit metallic copper onto non-electroconductive materials |
12/30/1986 | EP0206063A2 Method and apparatus for correcting printed circuit boards |
12/30/1986 | EP0206030A2 Photocurable composition |
12/30/1986 | EP0205947A1 Method of smoothing the surface of a ceramic substrate |
12/30/1986 | EP0205490A1 Fine line printed conductors fabrication process |