Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1987
02/19/1987DE3528572A1 Method and circuit arrangement for automatic assembly of printed circuit boards with integrated components
02/19/1987DE3528291A1 Arrangement for cooling electronic components
02/17/1987US4644446 Electrolytic capacitor
02/17/1987US4644445 Resin mounting structure for an integrated circuit
02/17/1987US4644335 Apparatus and method for monitoring drill bit condition and depth of drilling
02/17/1987US4644130 Method for creating blind holes in a laminated structure
02/17/1987US4644096 Surface mounting package
02/17/1987US4643936 Backup material for small bore drilling
02/17/1987US4643912 Method for forming a metal layer with pattern on a substrate
02/17/1987US4643798 Composite and circuit board having conductive layer on resin layer and method of manufacturing
02/17/1987US4643793 With mixture of copper compound, complexing agent, reducing agent, and ph adjuster in presence of nitrogen heterocycle compound
02/17/1987US4643569 Dual beam laser inspection apparatus
02/17/1987US4643498 Anisotropic electric conductive rubber connector
02/17/1987US4643129 System for the treatment of edge supported substrates
02/17/1987US4642890 Method for routing circuit boards
02/17/1987US4642889 Compliant interconnection and method therefor
02/17/1987US4642872 Terminal feeding and insertion device
02/17/1987CA1218140A1 Support for a warning light on a printed circuit board
02/17/1987CA1217985A1 Hot-tackifying adhesive tape
02/12/1987WO1987001007A1 Electric switchgear
02/12/1987WO1987000938A1 Method for manufacture of printed circuit boards
02/12/1987DE3528814A1 Hard mask for printed-circuit board exposure, method for producing said mask, and appliance for implementing the method
02/12/1987DE3528077A1 Electrical capacitor, specially of chip construction
02/12/1987DE3527332A1 Film having conductor tracks printed on both sides
02/10/1987US4642670 Chip carrier package
02/10/1987US4642560 Device for controlling continuity of printed circuits
02/10/1987US4642421 Adhesive electrical interconnecting means
02/10/1987US4642321 Heat activatable adhesive for wire scribed circuits
02/10/1987US4642163 Method of making adhesive metal layers on substrates of synthetic material and device produced thereby
02/10/1987US4642161 Method of bonding copper and resin
02/10/1987US4642160 Electrolessly depositing metal foil, etching
02/10/1987US4642148 Reduced residual carbon
02/10/1987US4641773 Ultrasonic stylus position stabilizer
02/10/1987US4641426 Surface mount compatible connector system with mechanical integrity
02/10/1987CA1217875A Method of fabricating a substrate which includes one or more apertures therethrough
02/10/1987CA1217686A Metallization of ceramics
02/05/1987DE3527969A1 Method for fabricating printed-circuit boards
02/05/1987DE3527967A1 Method for the fabrication of printed-circuit boards
02/05/1987DE3526534A1 Wave-soldering device
02/04/1987EP0210858A2 Reactive ion etching deposition apparatus and method of using it
02/04/1987EP0210851A2 Mixtures of polyamideimides, containing 3,4'-diaminodiphenylether as diamine component, and of a plasticizer.
02/04/1987EP0210775A1 Photoconductive polyimide-electron donor charge transfer complexes
02/04/1987EP0210560A2 Process of soldering an integrated circuit in a circuit board
02/04/1987EP0210520A2 Apparatus for making scribed circuit boards and circuit board modifications
02/04/1987EP0210502A1 Method for removal of carbonaceous residues from ceramic structure having internal metallurgy
02/04/1987EP0210437A1 Process for the electroless plating of a poorly electrically conducting inorganic substrate
02/04/1987EP0210436A1 Process for metallizing ceramic materials
02/04/1987EP0210380A1 Electronic circuit interconnection system
02/04/1987CN86104935A Method puching holes in the ueneer sheet using for electric appliance
02/03/1987US4641222 Mounting system for stress relief in surface mounted components
02/03/1987US4641112 Delay line device and method of making same
02/03/1987US4640981 Electrical interconnection means
02/03/1987US4640866 Multilayer composite of solid, sintered and porous, expanded polytetrafluoroethylene and metal
02/03/1987US4640747 Zinc-nickel alloy
02/03/1987US4640746 Preferentially plating metal, not nonconductive substrate
02/03/1987US4640739 Coating with copper paste, calcining, masking with photoresist, reinforced with copper
02/03/1987US4640719 Method for printed circuit board and/or printed wiring board cleaning
02/03/1987US4640581 Flexible printed circuit board for a display device
02/03/1987US4640499 Hermetic chip carrier compliant soldering pads
02/03/1987US4640010 Method of making a package utilizing a self-aligning photoexposure process
02/03/1987CA1217569A1 Print transfer article
01/1987
01/31/1987CN85101736A Dissolution of metals utilizing tungsten-diol complexes 2
01/29/1987WO1987000721A1 Electrical circuit fabrication apparatus and method
01/29/1987WO1987000686A1 Connection terminals between substrates and method of producing the same
01/29/1987WO1987000486A1 Printed wiring board for ic cards
01/29/1987DE3525537A1 Tensioning device for flow soldering of large format printed circuit boards
01/28/1987EP0209974A2 Connector for PCB mounting
01/28/1987EP0209936A1 Electrical contact pin for printed circuit board
01/28/1987EP0209816A1 Method for the production of plane electric circuits
01/28/1987EP0209748A1 Process for chemically treating ceramic work pieces for subsequent metallization
01/28/1987EP0209717A1 Battery compartment for an electronic watch
01/28/1987EP0209650A2 Method and apparatus for placing and electrically connecting components on a printed circuit board
01/28/1987EP0108116B1 High density printed wiring board
01/28/1987CN85107808A Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor
01/28/1987CN85105842A Multilayer printed circuit board
01/28/1987CN85105651A Weldable thick polymeric coatings
01/27/1987US4639830 Packaged electronic device
01/27/1987US4639818 Vent hole assembly
01/27/1987US4639693 Strip line cable comprised of conductor pairs which are surrounded by porous dielectric
01/27/1987US4639632 Piezoelectric resonator mountings
01/27/1987US4639572 Laser cutting of composite materials
01/27/1987US4639380 Process for preparing a substrate for subsequent electroless deposition of a metal
01/27/1987US4639378 Auto-selective metal deposition on dielectric surfaces
01/27/1987US4639290 Methods for selectively removing adhesives from polyimide substrates
01/27/1987US4639285 Heat-resistant flexible laminate for substrate of printed circuit board and a method for the preparation thereof
01/27/1987US4639062 Circuit board connection
01/27/1987US4638985 Sheet holding apparatus
01/27/1987US4638938 Vapor phase bonding for RF microstrip line circuits
01/27/1987CA1217046A1 Coating apparatus
01/22/1987DE3525353A1 Device for producing an electrical connection between a coaxial cable, especially a broadband communications cable, and an electronics board
01/21/1987EP0209422A1 Automatic digitalisation methods and apparatuses for scenes comprising discrete significant elements
01/21/1987EP0209390A2 Apparatus for continuous processing in directions of x- and y- Co-Ordinates
01/21/1987EP0209252A2 Fine flaw detector for PC boards
01/21/1987EP0209135A2 Electronic part insertion apparatus
01/21/1987EP0208956A1 Process for metallizing a poorly electrically conducting inorganic material
01/21/1987EP0208893A1 Apparatus for the treatment of ceramic bodies in a molten alkalihydroxide bath
01/21/1987CN85105715A Method of producing multilayer circuit boards, a fixed layered structure produced by this method, ard the use of this layered structure in this production method
01/20/1987US4638406 Discrete component mounting assembly
01/20/1987US4638116 Masking of holes in circuit patterns on circuit boards prior to flow soldering
01/20/1987US4637862 Wire-glass composite and method of making same