Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1991
03/20/1991EP0417880A1 Process for treating surface of copper foil
03/20/1991EP0417750A2 Process for direct metallization of circuit boards
03/20/1991EP0417749A2 Thick film resistor/integrated circuit substrate and method of manufacture
03/20/1991EP0417294A1 Method and device for making integrated circuits
03/20/1991EP0417239A1 Method of forming contact bumps in contact pads
03/20/1991EP0417211A1 Conversion of manganate to permanganate.
03/20/1991EP0417074A1 Electronic device fabrication by selective doping of a non-conductive polymer
03/20/1991EP0377635A4 Method and solution for the prevention of smear in the manufacture of printed circuit boards
03/20/1991CN1012083B Method for guiding plate-like articles, apparatus therefor
03/19/1991US5001606 Circuit board programmer
03/19/1991US5001605 Multilayer printed wiring board with single layer vias
03/19/1991US5001604 Embedded testing circuit and method for fabricating same
03/19/1991US5001542 Epoxy resin adhesives, particles with a coating of curing agent with a film, pressure deformable electroconductive particles
03/19/1991US5001308 Membrane switch
03/19/1991US5001302 Connecting structure for an electronic part
03/19/1991US5001168 Adhesive for surface mounting devices
03/19/1991US5001038 Process for photoimaging a three dimensional printed circuit substrate
03/19/1991US5000988 Method of applying a coating of viscous materials
03/19/1991US5000827 Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
03/19/1991US5000819 Metal surface cleaning processes
03/19/1991US5000816 Thin film peeling apparatus
03/19/1991US5000814 Film peeling apparatus having fluid injection device
03/19/1991US5000692 I/O relay interface module
03/19/1991US5000691 Pin fastened to a printed circuit board by soldering
03/19/1991US5000547 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
03/19/1991US5000388 Spray manifolds
03/14/1991DE4012879A1 Adhesive droplet applicator - has dosing control as function of adhesive temp.
03/14/1991DE3930225A1 Offset twist drill for plastic printed circuit board mfr. - with curved front edge and cutting surface divided in two specified areas
03/14/1991DE3928849A1 Continuous prodn. from strip of laminated plates for circuit boards - comprising heating laminate before entry to continuous press to advance resin cure and prevent lateral flow
03/14/1991DE3928527A1 Flat bed screen printing machine for PCB(s) - has two cameras with endoscopes slidable between PCB in load position and screen
03/14/1991DE3928525A1 Flat bed screen printing machine - has integral automatic cleaning device for screen covering PCB e.g. with solder paste
03/13/1991EP0417037A2 Process for coating plastic articles
03/13/1991EP0416775A1 Apparatus and method for single side spray processing of printed circuit boards
03/13/1991EP0416763A1 Methods and compositions for cleaning articles
03/13/1991EP0416568A2 Method of designing three dimensional electrical circuits
03/13/1991EP0416518A2 Process for producing printed circuit boards
03/13/1991EP0416506A1 Conductive material and process for producing the same
03/13/1991EP0359775A4 Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
03/13/1991EP0198038B1 Bath and process for plating tin/lead alloys on composite substrates
03/13/1991CN1049862A Cleaning composition of dibasic ester and hydrocarbon solvent
03/12/1991US4999741 Package in the heat dissipation of Electronic devices
03/12/1991US4999740 Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof
03/12/1991US4999700 Package to board variable pitch tab
03/12/1991US4999699 Solder interconnection structure and process for making
03/12/1991US4999656 Interchangeable lens with double-sided printed circuit board
03/12/1991US4999577 Method for contactless testing of conducting paths in a substrate using photon-assisted tunneling
03/12/1991US4999460 Conductive connecting structure
03/12/1991US4999251 Method for treating polyetherimide substrates and articles obtained therefrom
03/12/1991US4999248 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
03/12/1991US4999136 Electroconductive adhesive, acrylated epoxy resin and urethane
03/12/1991US4999079 Process and apparatus for treating articles and preventing their wrap around a roller
03/12/1991US4998885 Elastomeric area array interposer
03/12/1991US4998342 Method of attaching electronic components
03/12/1991CA1281436C Tape intended as circuits for electronic modules
03/12/1991CA1281435C Outer lead tape automated bonding system
03/07/1991DE3937810C1 Carrier plate with soft-soldered circuit substrate - has spacing wires of approximately same coefft. of thermal expansion as solder to limit loading of substrate
03/07/1991DE3928589A1 Computerised symbolic reconfiguration of PCB(s) - using interactive work-station to position cursor with and using actual conductor coordinates
03/07/1991CA2024688A1 Process for producing printed circuit boards and printed circuit boards obtained thereby
03/06/1991EP0415806A1 Method for the depositing of an insulating layer on a conductive layer of a multilayer net-printed circuit board with a high density pattern and such board
03/06/1991EP0415692A2 Bonding of articles
03/06/1991EP0415663A1 Tape assembly
03/06/1991EP0415659A2 Process for making a two-layer film carrier
03/06/1991EP0415544A2 Demountable tape-automated bonding system
03/06/1991EP0415527A2 Printed circuit board fixture
03/06/1991EP0415336A2 Method for manufacturing thick film circuit substrate
03/06/1991EP0415261A1 Improved solder paste formulation containing stannous fluoride
03/06/1991EP0415131A2 Forming a pattern on a substrate
03/06/1991EP0415085A2 Method for fabricating structures on a substrate
03/06/1991EP0415052A1 An electrical connector
03/06/1991EP0414872A1 Electrically conductive feedthrough and process for manufacturing it.
03/06/1991EP0414804A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane, methanol and nitromethane.
03/06/1991CA2024589A1 Cleaning compositions and applications thereof
03/06/1991CA2014648A1 Apparatus and method for single side spray processing of printed circuit boards
03/05/1991US4998180 Bus device with closely spaced double sided daughter board
03/05/1991US4998159 Ceramic laminated circuit substrate
03/05/1991US4997863 Thermosetting resin composition useful for forming insulating layer of multilayer printed wiring board
03/05/1991US4997746 Method of forming conductive lines and studs
03/05/1991US4997724 With inorganic filler
03/05/1991US4997722 Whiskered surface of copper oxide, sodium hydrosulfate and polymer reaction product; printed circuits
03/05/1991US4997680 Polymeric conditioner for pretreating nonmetallic surfaces for chemical metallization
03/05/1991US4997674 Conductive metallization of substrates via developing agents
03/05/1991US4997517 Metal foil
03/05/1991US4997516 Method for improving adherence of copper foil to resinous substrates
03/05/1991US4997390 Shunt connector
03/05/1991US4997389 Planar connector system with zero insertion force and distributed clamping
03/05/1991US4997379 Electrical contacts
03/05/1991US4997377 Adaptor for computers
03/05/1991US4997364 Furnace assembly for reflowing solder on printed circuit boards
03/05/1991US4997319 Apparatus for drilling a hole in a printed circuit board
03/05/1991US4997122 Solder shaping process
03/05/1991US4996939 Apparatus for drying printed circuit boards
03/05/1991US4996763 Method of locating work in automatic exposing apparatus
03/05/1991CA1281142C Method for producing circuit board with deposited metal patterns and circuit boards produced thereby
03/05/1991CA1280876C Optical component mounting
03/02/1991CA2024308A1 Process for coating plastics articles
03/01/1991WO1991003920A2 Plated-through printed circuit board with resist and process for producing it
03/01/1991WO1991003325A1 Apparatus for cleaning mechanical devices using terpene compounds
03/01/1991CA2065326A1 Apparatus for cleaning mechanical devices using terpene compounds
02/1991
02/28/1991DE3928434A1 Direct metallisation of non-conductive polymer substrate - by electroplating onto reduced or thermally decomposed metal cpd. layer
02/28/1991DE3927440A1 Direct metallisation of non-conductive substrates - by using alkaline copper bath after acid activation of substrate