Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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02/12/1991 | US4991285 Method of fabricating multi-layer board |
02/12/1991 | US4991284 Method for manufacturing thick film circuit board device |
02/12/1991 | CA1280084C Sintering of metal interlayers within organic polymeric films |
02/08/1991 | CA2022626A1 Cleaning composition of dibasic ester and hydrocarbon solvent |
02/08/1991 | CA2022625A1 Cleaning composition of dibasic ester, hydrocarbon solvent, compatibilizing surfactant and water |
02/08/1991 | CA2022624A1 Cleaning composition of dibasic ester, hydrocarbon solvent and compatibilizing component |
02/07/1991 | WO1991001618A1 Process for attenuating perturbing radiation in printed circuit boards |
02/07/1991 | DE4024612A1 Multilayer ceramic substrate useful for electronic circuits - comprising alternate ceramic and conductive layers and prepd. by firing assembled layers |
02/07/1991 | DE3925814A1 Soldering system for circuit board surface mounted devices - has solder frame for simultaneous soldering of circuit-mounted devices and edge connector contact tongues |
02/06/1991 | EP0411985A1 Process of making a multilayer network of a connection board for at least one very large scale integrated circuit |
02/06/1991 | EP0411778A1 Ternary azeotropic compositions of 2,3-dichloro-1,1,1,3,3-pentafluoropropane with trans-1,2-dichloroethylene and methanol |
02/06/1991 | EP0411599A1 Apparatus for rinsing electroplated articles |
02/06/1991 | EP0411551A2 Multilayer interconnects |
02/06/1991 | EP0411499A1 Process and device for coating a substrate |
02/06/1991 | EP0411270A1 Procedure for applying a solder layer |
02/06/1991 | EP0411165A1 Method of forming of an integrated circuit chip packaging structure |
02/06/1991 | EP0411142A1 Outer layer material of multilayer printed wiring board and production thereof |
02/06/1991 | EP0411015A1 Pre-formed chip carrier cavity package |
02/06/1991 | CN1048992A Method and device for cleaning article |
02/06/1991 | CN1011497B Laser marking of pigmented systems |
02/05/1991 | US4991115 Method of mapping geometric entities from a continuous plane to a discrete plane |
02/05/1991 | US4991060 Printed circuit board having conductors interconnected by foamed electroconductive paste |
02/05/1991 | US4991059 Mounted on a surface of a printed circuit board |
02/05/1991 | US4990880 Transformer clip |
02/05/1991 | US4990817 Chip type electronic part |
02/05/1991 | US4990727 Horn switch |
02/05/1991 | US4990724 Method and apparatus for electrically interconnecting opposite sides of a flex circuit |
02/05/1991 | US4990720 Circuit assembly and method with direct bonded terminal pin |
02/05/1991 | US4990395 Electrically conductive copper layers and process for preparing same |
02/05/1991 | US4990393 Printed circuit board |
02/05/1991 | US4990363 Method of producing very adhesive metallic structures on fluorine polymers and thermoplastic synthetic materials |
02/05/1991 | US4990108 Connector device for connecting electronic components |
02/05/1991 | US4990107 Integrated circuit module connector assembly |
02/05/1991 | US4990080 Punch press for piercing green sheet with liner |
02/05/1991 | US4990035 Cutting tool |
02/05/1991 | US4989756 Dispensing apparatus |
02/05/1991 | US4989318 Process of assembling terminal structure |
02/05/1991 | US4989317 Method for making tab circuit electrical connector supporting multiple components thereon |
02/05/1991 | CA1279794C Printing |
02/05/1991 | CA1279753C Screenable paste for use as a barrier layer on a substrate during maskless cladding |
02/04/1991 | CA2020942A1 Ternary azeotropic compositions of 2,3-dichloro-1,1,1,3,3-pentafluoropropane with trans-1,2-dichloroethylene and methanol |
02/03/1991 | CA2022427A1 Process and apparatus for coating a substrate |
02/02/1991 | CA2022474A1 Multilayer interconnects |
01/31/1991 | DE4022165A1 Resist exposure esp. on circuit board substrate - with via exposed using beam angling or reflector plate |
01/30/1991 | EP0410702A2 Printing ink composition |
01/30/1991 | EP0410623A1 Method and apparatus for soldering articles |
01/30/1991 | EP0410427A1 Plug-in connection for circuit boards |
01/30/1991 | EP0410426A1 Device for strain relief |
01/30/1991 | EP0410374A2 Superconductive multilayer circuit and its manufacturing method |
01/30/1991 | EP0410334A1 Azeotrope-like and azeotrope compositions of trichlorotrifluoroethane, trans-1,2-dichloroethylene and one alkanol |
01/30/1991 | EP0410333A1 Cleaning compositions of dichlorotrifluoroethanes and alkanols |
01/30/1991 | EP0410274A2 Method of forming fine patterns |
01/30/1991 | EP0410165A2 Method and apparatus for treating an object provided with perforations by products present in a high frequency plasma |
01/30/1991 | CN1048898A Binary azeotropic compositions |
01/29/1991 | US4989069 Semiconductor package having leads that break-away from supports |
01/29/1991 | US4989066 Semiconductor package |
01/29/1991 | US4988605 Light-sensitive resin composition and light-sensitive element |
01/29/1991 | US4988426 Holding apparatus for articles to be electroplated |
01/29/1991 | US4988412 Selective electrolytic desposition on conductive and non-conductive substrates |
01/29/1991 | US4988306 Low-loss electrical interconnects |
01/29/1991 | US4987677 Heat treatment; copper with specific surface roughness |
01/29/1991 | CA1279732C Electron beam direct drawing device |
01/24/1991 | WO1991001078A1 Electrical connectors |
01/24/1991 | WO1991001051A1 Electrical connectors |
01/24/1991 | DE3937183A1 Verfahren zu stoerstrahlungsdaempfung an leiterplatten Method to stoerstrahlungsdaempfung on pcb |
01/24/1991 | DE3936955C1 Plasma treating conductor plates for electronic elements - with process gas e.g. oxygen, hydrogen, fluoro-(chloro)-hydrocarbon, etc. before soldering |
01/24/1991 | DE3923491A1 Low sintering temp. glass-ceramic material - useful for substrates and multilayer housings in microelectronics |
01/24/1991 | DE3919564A1 Flexible printed circuits prodn. - by holding polyimide film taut, screen printing resinate paste conductors on it, and drying at high temp. |
01/23/1991 | EP0409668A2 Mixed circuit boards and a method for manufacture thereof |
01/23/1991 | EP0409623A1 Adhesive composition |
01/23/1991 | EP0409590A2 A board-surface mounting electric connector |
01/23/1991 | EP0409543A2 A method for forming a resist pattern |
01/23/1991 | EP0409523A2 Binary azeotropic compositions of 2,2-dichloro-1,2-difluoroethane with methanol, ethanol, or trans-1,2-dichloroethylene |
01/23/1991 | EP0409466A2 Process for the preparation of a polyimide film |
01/23/1991 | EP0409169A2 Exposing method |
01/23/1991 | EP0409003A2 Derivatives of compounds containing a carbonyl group conjugated to an aromatic moiety and electrophilic methods of fabrication thereof |
01/23/1991 | EP0409002A2 Process for nucleophilic derivatization of materials having an imide group conjugated to an aromatic moiety |
01/23/1991 | EP0408935A2 Method and device for separating short circuit zones and conducting paths |
01/23/1991 | EP0408913A1 Method for forming a conductive film on a surface of a conductive body caoted with an insulating film |
01/23/1991 | EP0408904A2 Surface mounting semiconductor device and method |
01/23/1991 | EP0408773A1 Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts |
01/23/1991 | EP0408646A1 Apparatus for processing planar printed circuit boards |
01/23/1991 | EP0408629A1 Coating compositions |
01/22/1991 | US4987278 Push-button switch |
01/22/1991 | US4987230 Photopolymerization sensitizers active at longer wavelengths |
01/22/1991 | US4987214 Imide type prepolymer composition comprising unsaturated bis imide, diamine, and a tertiary butyl hydroquinone polymerization inhibitor |
01/22/1991 | US4987009 Producing method of thick film complex component |
01/22/1991 | US4987006 Pressure bonding layer of noble metal to base metal substrate |
01/22/1991 | US4986888 Electroplating apparatus for plate-shaped workpieces |
01/22/1991 | US4986880 Process for etching polyimide substrate in formation of unsupported electrically conductive leads |
01/22/1991 | US4986873 Thin-film coating apparatus |
01/22/1991 | US4986870 Apparatus for laminating multilayered printed circuit boards having both rigid and flexible portions |
01/22/1991 | US4986869 Method employing input and output staging chamber devices for reduced pressure lamination |
01/22/1991 | US4986848 Aqueous alkaline solution of alkylamine, palladium compound and aminopyridine |
01/22/1991 | US4986462 Method for cleaning and/or fluxing circuit card assemblies |
01/22/1991 | US4986124 Screened inductance sensors, especially sensors for level measurement |
01/22/1991 | US4985990 Method of forming conductors within an insulating substrate |
01/22/1991 | US4985982 Process and apparatus for cutting and trimming printed circuit board workpieces |
01/22/1991 | CA1279408C System for configuring, automating and controlling the test and repairof printed circuit boards |
01/21/1991 | CA2021536A1 Method for forming a resist pattern |