| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/01/1991 | US4981715 Complexing polymer and noble metal compound |
| 01/01/1991 | US4981564 Additives for electroplating compositions and methods for their use |
| 01/01/1991 | US4981560 Electrolysis, sodium diethylenetriaminepentaacetate |
| 01/01/1991 | US4981336 Reversible high density optical fiber connector apparatus |
| 01/01/1991 | US4981248 Electronically controlled wave solder mask shield |
| 01/01/1991 | US4981074 Method and apparatus for screen printing |
| 12/31/1990 | CA2019437A1 Header device |
| 12/27/1990 | WO1990016141A1 Printed circuit board and method of mounting circuit parts |
| 12/27/1990 | WO1990015709A1 Process and equipment for embedding the inside of an electric apparatus in resin, such as a proximity detector, the related electric apparatus and containers for said apparatus |
| 12/27/1990 | WO1990015682A1 Bonding additives for refractory metallization inks |
| 12/27/1990 | WO1990014184A3 Continuous furnace |
| 12/27/1990 | WO1990012482A3 Printed circuit boards |
| 12/27/1990 | EP0404277A1 Method of inserting a chip carrier contact into a housing |
| 12/27/1990 | EP0404177A2 Transfer sheet for making printed-wiring board by injection molding and method for producing same |
| 12/27/1990 | EP0404049A2 Process for etching polyimide resin |
| 12/27/1990 | EP0403975A2 Circuit structure formed by insert molding of electric and/or optical transmission medium and method for manufacturing such a circuit structure. |
| 12/27/1990 | EP0403851A2 Excimer induced topography of flexible interconnect structures |
| 12/27/1990 | EP0403617A1 Graded composition primer layer |
| 12/27/1990 | CA1278188C Marking plate device |
| 12/25/1990 | US4980798 Cuffed tape wrap and fill wound capacitor |
| 12/25/1990 | US4980555 Spinning photosensitive polyamide on a metal layer of substrate, baking, exposing, developing, masking and demasking |
| 12/25/1990 | US4980410 Acrylic copolymer composition and adhesive coatings therefrom |
| 12/25/1990 | US4980270 Printer circuit and a process for preparing same |
| 12/25/1990 | US4980239 Having sufficient adhesion strength |
| 12/25/1990 | US4980219 Sprocket holes at predetermined intervals in side edge areas |
| 12/25/1990 | US4980217 Printed circuit board fabrication |
| 12/25/1990 | US4980197 Method of producing metallic structures on inorganic non-conductors |
| 12/25/1990 | US4980034 Alternating dielectric and metal |
| 12/25/1990 | US4980016 Simultaneous molding of an insulating substrate and formation of a circuit pattern |
| 12/25/1990 | US4979994 Method and apparatus for cleaning by ultrasonic wave energy |
| 12/25/1990 | US4979903 Surface mountable contact element and assembly |
| 12/25/1990 | US4979862 Automatic loading mechanism |
| 12/25/1990 | US4979787 Optical-electronic interface module |
| 12/25/1990 | US4979664 Method for manufacturing a soldered article |
| 12/25/1990 | US4979663 Outer lead tape automated bonding system |
| 12/25/1990 | US4979662 Desoldering vat |
| 12/25/1990 | US4979290 Method for soldering electronic component |
| 12/20/1990 | DE3919273A1 Circuit board system with main and orthogonal extra boards - has extra board clamps, each as integral snap-action hook with outwards protrusion |
| 12/20/1990 | DE3919249A1 Two-layer tape-automated-bonding film carrier prodn. - without use of environmentally polluting solvents |
| 12/20/1990 | DE3744917C2 Solder tunnel with bottom opening |
| 12/19/1990 | EP0403335A2 Method of fabrication of a case for electronic circuits and such a case, especially for motor vehicles, obtained by this method |
| 12/19/1990 | EP0403170A2 Photoimageable compositions |
| 12/19/1990 | EP0402966A2 Method for treating copper circuit pattern of interlayer circuit board |
| 12/19/1990 | EP0402942A2 Method of printing fine patterns |
| 12/19/1990 | EP0402896A2 Method of stabilising an organic additive in an acid copper electroplating solution |
| 12/19/1990 | EP0402894A2 Photoresist |
| 12/19/1990 | EP0402811A2 Method of manufacturing printed circuit boards |
| 12/19/1990 | EP0402750A1 Process for surface treatment of polyamide articles and the articles obtained |
| 12/19/1990 | EP0402613A2 Connector assembly with movable carriage |
| 12/19/1990 | EP0402546A2 Printed circuit board |
| 12/19/1990 | EP0402381A1 New through-hole plated printed circuit board and process for manufacturing same. |
| 12/19/1990 | EP0236493B1 Microelectronic package |
| 12/18/1990 | US4979090 Power converter circuit board |
| 12/18/1990 | US4979076 Hybrid integrated circuit apparatus |
| 12/18/1990 | US4979074 Printed circuit board heat sink |
| 12/18/1990 | US4978914 Laminated board for testing electronic components |
| 12/18/1990 | US4978836 Continuous oven |
| 12/18/1990 | US4978814 Electrical device including an electrical connector |
| 12/18/1990 | US4978569 Process for preparing selectively metallized articles |
| 12/18/1990 | US4978423 Pumice scrubbing and roughening of copper exposed by preferential stripping of photoresist which protects remaining solder |
| 12/18/1990 | US4978422 Method for improving insulation resistance of printed circuits |
| 12/18/1990 | US4977668 Method of making socket connector |
| 12/18/1990 | CA1277948C Treatment for copper foil |
| 12/18/1990 | CA1277947C Continuous process for fabricating metallic patterns on a thin film substrate |
| 12/16/1990 | CA2019097A1 Process for handling individual articles in a single-pass machine, as well as an apparatus for carrying out this process |
| 12/13/1990 | WO1990015519A1 Method for cutting printed boards for examination of the plating result on the walls in holes arranged in the board |
| 12/13/1990 | WO1990014947A1 Metal and metal alloys with improved solderability shelf life and method of preparing the same |
| 12/13/1990 | DE3919160A1 Solder bath dipping process for circuit boards - using pressurised flexible diaphragms to retain solder during removal from bath |
| 12/13/1990 | DE3918423A1 Double layer through-hole coupled rigid and flexible circuits - have support boards coupled together using adhesive bond to secure flexible unit in slot |
| 12/12/1990 | EP0402315A2 A method of making a metallic pattern on a substrate |
| 12/12/1990 | EP0402050A2 Triplate centre conductors |
| 12/12/1990 | EP0402028A2 Process for producing boards for precision fine-line circuits |
| 12/12/1990 | EP0401926A1 Processing method, neural network structure and computer for simulating said neural network structure |
| 12/12/1990 | EP0401703A1 Film guide device for a film bonding apparatus |
| 12/12/1990 | EP0401702A2 A method of separating a bonded film from a circuit board |
| 12/12/1990 | EP0401701A1 Thin film bonding apparatus having adjustable film cutoff unit |
| 12/12/1990 | EP0401679A2 Process and apparatus for electrostatically applying a liquid layer on a substrate and for drying the liquid layer on the substrate |
| 12/12/1990 | EP0401601A1 Electrochemical graining of aluminum or aluminum alloy surfaces |
| 12/12/1990 | EP0401513A2 Thin film bonding method and apparatus having structure for removing wetting agents |
| 12/12/1990 | EP0302901A4 Solderable lead |
| 12/12/1990 | CN1047779A Method of rapid etch for printed circuits bord |
| 12/12/1990 | CN1047639A Copper doped low melt solder for component assembly and rework |
| 12/11/1990 | US4977297 Cladding for optical fibers; protective coatings |
| 12/11/1990 | US4977042 Rechargeable type small electric appliance |
| 12/11/1990 | US4977026 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole |
| 12/11/1990 | US4977025 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole |
| 12/11/1990 | US4977012 Ceramic wiring substrate blank material and process for production thereof |
| 12/11/1990 | US4977008 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole |
| 12/11/1990 | US4976990 Process for metallizing non-conductive substrates |
| 12/11/1990 | US4976840 Electroplating apparatus for plate-shaped workpieces |
| 12/11/1990 | US4976817 Wet lamination process and apparatus |
| 12/11/1990 | US4976813 Mixture of polyhydroxyether, formaldehyde and melamine |
| 12/11/1990 | US4976808 Dissolving resin with hydrazine hydrate solution, then dissolving residual film with solution containing ammonium or halogen ions |
| 12/11/1990 | US4976629 Zero insertion force dual in-line LCD connector |
| 12/11/1990 | US4976626 Contact pin |
| 12/11/1990 | US4976573 Apparatus for chamfering planar plate |
| 12/11/1990 | US4976198 Grain structure for lithographic printing plate supports |
| 12/11/1990 | CA1277781C Electrical interconnection comprising anisotropically conductive medium |
| 12/11/1990 | CA1277776C Soldering pins into printed circuit boards |
| 12/11/1990 | CA1277775C Circuit element mounting system |