Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/1991
04/09/1991US5006295 Method for making a plurality of like printed circuit board test pieces and arranging them relative to one another cutting along a hole row center plane
04/09/1991US5006200 Printed circuit boards, formation of cupric oxide layer, reduction to cuprous oxide, heating, pressing, modifying morphology
04/09/1991US5006182 Method for fabricating multilayer circuits
04/09/1991US5006073 Snap fit contact assembly
04/09/1991US5005978 Apparatus and method for the noncontact measurement of drill diameter, runout, and tip position
04/09/1991US5005766 Device for providing a flux layer on a printed board
04/09/1991US5005455 Method and apparatus for manufacturing preform panels with preforms for repairing interconnects
04/09/1991US5005283 Method of manufacturing an E/M shielded RF circuit board
04/09/1991CA1282870C2 Method of making metal printed circuit panels wherein circuitry thereon is connected to signal ground by means of mesas
04/09/1991CA1282854C Flat display panel
04/09/1991CA1282847C Electrical connector with pin retention feature
04/09/1991CA1282845C Contact means
04/09/1991CA1282835C2 Metal printed circuit panels including mesas for coupling circuitry thereon to signal ground
04/06/1991CA2026865A1 Stabilized azeotrope-like compositions of 1,1-dichloro-2,2,2-trifluoroethane and 1,1-dichloro-1-fluoroethane
04/05/1991CA2026487A1 Ternary azeotropic compositions of 1,1-dichloro-1,2-difluoroethane and trans-1,2-dichloroethylene with methanol, ethanol or isopropanol
04/04/1991WO1991005306A1 Electro-active cradle circuits for the detection of access or penetration
04/04/1991WO1991004650A1 Via-forming ceramics composition
04/04/1991DE3932213A1 Verbundanordnung mit leiterplatte Interconnected arrangement of circuit board
04/04/1991DE3931551A1 Copper and ceramic multilayer substrate prodn. - involving slitting of ceramic layers to avoid thermal stress damage
04/04/1991CA2067331A1 Electro-active cradle circuits for the detection of access or penetration
04/04/1991CA2026684A1 Surface treating agents for metal work
04/04/1991CA2026260A1 Preparation of oxidation resistant metal powder
04/03/1991EP0420690A2 Electric inspection unit using anisotropically electroconductive sheet and process for producing the anisotropically electroconductive sheet
04/03/1991EP0420640A1 Process for electroplating and apparatus therefor
04/03/1991EP0420614A2 Methods of coating stereolithographic parts
04/03/1991EP0420604A1 Selectively conductive adhesive device for simultaneous electrical and mechanical coupling
04/03/1991EP0420526A2 Improved contact printing process
04/03/1991EP0420361A1 Circuit board for electronic or electromechanic devices
04/03/1991EP0420318A1 Multilayer material for the preparation of full flat background masks for graphic industry and for the production of printed circuits
04/03/1991EP0420208A2 Allyl ester resin composition and laminated sheet using the same
04/03/1991EP0420051A2 Process and apparatus for dry-blowing workpieces or strips
04/03/1991EP0420050A2 Method of soldering of components on circuit boards
04/03/1991EP0420002A2 Electrophotographic recording material
04/03/1991EP0419996A2 Soldering device for soldering components onto printed circuit boards
04/03/1991EP0419995A2 Soldering device for soldering components onto printed circuit boards
04/03/1991EP0419851A1 Holder for articles to be electroplated
04/03/1991EP0419845A2 Method for preparing metallized polyimide composites
04/03/1991EP0419804A2 Multilayer structures of different electroactive materials and methods of fabrication thereof
04/03/1991EP0419577A1 Film-based structural components with controlled coefficient of thermal expansion
04/03/1991CN1050448A Photosensitive semi-aqueous developable gold conductor composition
04/03/1991CN1050447A Photosensitive aqueous developable copper conductor composition
04/03/1991CA2020410A1 Producing metal patterns on a plastic surface
04/02/1991US5005105 Stress-relieving flexible circuit board holder plate
04/02/1991US5005070 Soldering interconnect method and apparatus for semiconductor packages
04/02/1991US5004974 Electric current sensing device
04/02/1991US5004887 Soldering
04/02/1991US5004672 Electrophoretic method for applying photoresist to three dimensional circuit board substrate
04/02/1991US5004658 Mask comprising patterns; offset o capacitor plate metallized areas on substrate
04/02/1991US5004640 Heat treatment, reduction, firing
04/02/1991US5004639 Rigid flex printed circuit configuration
04/02/1991US5004525 Copper electroplating composition
04/02/1991US5004521 Etchant effective on thin metal film but not on protective coating over it
04/02/1991US5003870 Antistretch screen printing arrangement
04/02/1991US5003693 Manufacture of electrical circuits
04/02/1991CA1282520C Adhesive composition useful for connecting two electrically conductive members
04/02/1991CA1282469C Solderable lead
04/02/1991CA1282367C Glow discharge metal deposition on non-conductor from organometallic compound
04/02/1991CA1282272C Photocurable composition
03/1991
03/31/1991CA2026517A1 Method of processing board-like objects, for example, printed circuit boards
03/30/1991CA2026199A1 Allyl ester resin composition and laminated sheet using the same
03/28/1991DE3931003A1 Direct metallisation of circuits boards
03/28/1991DE3930863A1 Printed circuit board with superimposed components - has terminal leads fitted directly and via conductive plugs in respective circuit board holes
03/28/1991CA2026091A1 Electrophotographic copying material
03/27/1991EP0419232A2 Field programmable printed circuit board
03/27/1991EP0419089A1 Cleaning compositions and applications thereof
03/27/1991EP0419065A2 Process for attaching electronic components
03/27/1991EP0418733A2 Radiation-curable composition and method of producing a solder mask
03/27/1991EP0418508A1 Electrical connector
03/27/1991EP0418427A2 Exposure process
03/27/1991EP0418345A1 Process for producing a flat connection
03/27/1991EP0418313A1 Circuit writer
03/27/1991EP0418228A1 Amorphous copolymers or perfluoro-2,2-dimethyl-1,3-dioxole
03/27/1991EP0139662B1 Improved socket terminal positioning method and construction
03/27/1991CN1050268A Photosensitive semi-aqueous developable copper conductor composition
03/27/1991CN1050151A Improved solder paste formulation containing stannous fluoride
03/27/1991CN1050149A Process for soldering allowing low ionic contamination without cleaning operation
03/27/1991CN1012253B Manufacturing multilayer circuit and its elements by receiver with catalyst
03/26/1991US5003222 Connector for electroluminescent display panel
03/26/1991US5003037 Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3, 5-diamino-t-butylbenzene
03/26/1991US5002977 Active energy ray-curable unsaturated resin composition
03/26/1991US5002858 Process for the formation of an image
03/26/1991US5002627 Spray etching apparatus with automatic individually controllable etching jets
03/26/1991US5002616 Process and apparatus for fliud treatment of articles
03/26/1991US5002507 Circuit board contact element and compliant section thereof
03/26/1991US5002492 Lamp-holder terminal board for domestic electrical appliances
03/26/1991US5002441 Drilling unit
03/26/1991US5002367 Multi-level circuits, methods for their fabrication, and display devices incorporating such circuits
03/26/1991US5001829 Method for connecting a leadless chip carrier to a substrate
03/21/1991WO1991003817A1 Conductive pattern forming composition and method of producing the same
03/21/1991WO1991003770A1 Resists
03/21/1991WO1991003375A1 Manufacture of printed circuit boards
03/21/1991WO1991003350A1 Soldering apparatus comprising a spout cleaning member
03/21/1991WO1991003329A1 Process and apparatus for fluid treatment of articles
03/21/1991WO1990015478A3 Improved three-dimensional circuit component assembly and method corresponding thereto
03/21/1991DE3930538A1 Electric switch for motor vehicle - has holder integrated with baseplate through circuit board
03/21/1991DE3928832A1 Durchkontaktierte leiterplatte mit resist sowie verfahren zur herstellung derselben Plated-through circuit board with resist and process for making same
03/20/1991EP0418148A1 Method of making a polymethylpentene based metallized support
03/20/1991EP0418119A1 Sealed electronic module with reduced space requirement
03/20/1991EP0417992A2 A stackable multilayer substrate for mounting integrated circuits
03/20/1991EP0417887A2 IC card