Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/1991
01/21/1991CA2021474A1 Exposure process
01/21/1991CA2021463A1 Binary azeotropic compositions of 2,2-dichloro-1,2-difluoroethane with methanol, ethanol, or trans-1,2-dichloroethylene
01/20/1991CA2021483A1 Adhesive composition
01/18/1991US5025116 Printed wiring board having electromagnetic wave shielding layer
01/18/1991CA2021293A1 Polyimide film and preparation process of the film
01/17/1991DE3922478A1 Excimer laser structuring or etching process - for plastics-coated copper-clad base materials
01/17/1991DE3922233A1 Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beam
01/17/1991DE3922121A1 Flexible circuit board for electrical connections - has strip formed conductors with contacts to provide interconnections
01/16/1991EP0408401A1 A keyboard for an electronic apparatus
01/16/1991EP0408205A1 Polyimide substrate having a textured surface metallizing such a substrate
01/16/1991EP0407957A1 Heat sink device for components of the SMD type mounted on a printed curcuit board
01/16/1991EP0407951A2 Method for applying a photoresist to a 3-D conductive substrate
01/16/1991EP0407940A1 Method for joining together associated metal conductors of a layer structure with an insulating layer provided therebetween
01/16/1991CN1048645A Preparation of strip shaped electric poles for matrix displayer
01/16/1991CN1011206B Method punching holes in the ueneer sheet for electric appliances
01/15/1991US4985807 Encoding device particularly for integrated circuit cards
01/15/1991US4985747 Terminal structure and process of fabricating the same
01/15/1991US4985675 Multi-layer tolerance checker
01/15/1991US4985663 Display device
01/15/1991US4985601 Reflowable
01/15/1991US4985600 Printed circuit board having an injection molded substrate
01/15/1991US4985597 Optical semiconductor device
01/15/1991US4985509 Heat curable resin composition
01/15/1991US4985474 Hardenable resin composition
01/15/1991US4985376 Conductive paste compositions and ceramic substrates
01/15/1991US4985321 Toner fluids, dispersion of charged colloidal metallic particles
01/15/1991US4985310 Multilayered metallurgical structure for an electronic component
01/15/1991US4985308 Tetrafluoroethylene
01/15/1991US4985294 Copper foil laminated to insulating layer of blend of epoxy resin and acrylonitrile-butadiene rubber
01/15/1991US4985273 Method of producing fine inorganic particles
01/15/1991US4985116 Three dimensional plating or etching process and masks therefor
01/15/1991US4985112 Oscillation
01/15/1991US4985111 Process and apparatus for intermittent fluid application
01/15/1991US4985107 Component location device and method for surface-mount printed circuit boards
01/15/1991US4985098 Method of manufacturing ceramic laminate
01/15/1991US4985097 Joined metal composite and method for production thereof
01/15/1991US4985076 Autocatalytic electroless gold plating composition
01/15/1991US4985071 Process for producing a base metal thin film and an electronic device using the same
01/15/1991CA1278912C Overprint copper composition
01/11/1991CA2019155A1 Polyimide substrate having a textured surface and metallizing such a substrate
01/10/1991WO1990013990A3 Circuit boards with recessed traces
01/10/1991DE3921651A1 Six-sided electronic module for printed circuit - has contact surfaces at opposing edges spaced by parallel perpendicular insulating surfaces
01/10/1991DE3921361A1 Mfg. PCB accepting mounted components - forming double-sided plates by screen printing and etching
01/09/1991EP0407324A2 A method of inhibiting corrosion in an electronic package
01/09/1991EP0407156A2 Circuit module
01/09/1991EP0407129A2 Process for producing molding for precision fine line-circuit
01/09/1991EP0407108A1 Improved method of assembly and apparatus for a small electrical device
01/09/1991EP0407072A1 A method of shielding a printed circuit board, or a part of it, from disturbances caused by electromagnetic interference, and a shielding housing to be used in the method
01/09/1991EP0407025A2 Azeotropes of hydrogen containing halocarbons with pentanes
01/09/1991EP0406678A1 Swelling agent for the pre-treatment of polymers to be plated by electrolysis
01/09/1991EP0406534A2 Device for treating plate-shaped articles
01/09/1991EP0406376A1 Improved method for making printed circuits
01/09/1991EP0406344A1 Process and installation for etching copper-containing work pieces
01/09/1991EP0397663A4 A method, bath and cell for the electrodeposition of tin-bismuth alloys
01/09/1991EP0253833B1 Multilayer printed circuit board
01/09/1991EP0177042B1 Electronic circuit device and method of producing the same
01/08/1991US4984132 Multilayer wiring substrate
01/08/1991US4984130 Surface mounting
01/08/1991US4984064 Semiconductor device
01/08/1991US4983827 Linescan apparatus for detecting salient pattern of a product
01/08/1991US4983804 Localized soldering by inductive heating
01/08/1991US4983252 Process for producing printed circuit board
01/08/1991US4983250 Method of laser patterning an electrical interconnect
01/08/1991US4983248 Thin-film coating method and apparatus therefor
01/08/1991US4983246 Hot stamping decal resist
01/08/1991US4983224 Terpenes and/or terpenols and polar aprotic solvent
01/08/1991US4982892 Solder interconnects for selective line coupling
01/08/1991US4982890 Soldering means having at least one stirrup electrode and two soldering webs lying opposite one another or four soldering webs lying opposite one another in pairs
01/08/1991US4982831 Printed circuit board adapter supplying apparatus and method for use in printed circuit board drilling apparatus
01/08/1991US4982495 Polyimide film on copper foil, integrated circuits
01/08/1991CA1278878C Cooling method and apparatus for an integrated circuit casing
01/08/1991CA1278877C Resist inactivation method for manufacture of printed circuit boards
01/08/1991CA1278876C Adhesive mounted electronic circuit element
01/08/1991CA1278809C Heater for use as either primary or auxiliary heat source and improvedcircuitry for controlling the heater
01/07/1991CA2020624A1 Swelling agent for pretreatment of a synthetic resin prior to electroless metallization and improved method of making a circuit board using same
01/05/1991CA2019221A1 Apparatus for treating plate-shaped articles
01/03/1991DE3921467A1 Metallising plastic conductor plates coated with conductive layer - by applying electric charge between soln. and plates to enable shorter process time
01/03/1991DE3920232A1 Pluggable wiring foil with conductive tracks - has several, loosely stacked foil circuits, with specified raster of soldering eyelets
01/03/1991CA2019978A1 Process for producing molding for precision fine-line circuit
01/02/1991EP0405947A2 Method of manufacturing thick-film devices
01/02/1991EP0405865A2 Method of connecting opposed pairs of contacts of detector and readout microchips in a hybrid detector array assembly
01/02/1991EP0405838A2 Header device
01/02/1991EP0405828A1 Solder assembly of components
01/02/1991EP0405765A2 Configurable electronic circuit board, adapter therefor , and designing method of electronic circuit using the same board
01/02/1991EP0405652A2 Reduced cycle process for production of printed circuits and composition for processing
01/02/1991EP0405482A1 Improved wire scribed circuit boards and methods of their manufacture
01/02/1991EP0405408A2 Method and apparatus of making contact to a semiconductor component by use as a laser beam, and resulting device
01/02/1991EP0405369A2 Process for producing copperclad laminate
01/02/1991EP0405334A2 Coaxial connector half connectable with a printed circuit board or heavy current contact
01/02/1991EP0405089A2 Method for the preparation of a covering film for flexible printed circuit board
01/02/1991EP0404891A1 Process for the manufacture of electrically conductive structures.
01/02/1991CN2068746U Electronic component carrier
01/02/1991CA1278625C Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
01/02/1991CA1278471C Multilayer printed wiring boards
01/01/1991US4982376 Method of mounting electrical and/or electronic components on a single-sided printed board
01/01/1991US4982265 Semiconductor integrated circuit device and method of manufacturing the same
01/01/1991US4982177 Arrangement for monitoring the temperature in flow soldering of flat modules
01/01/1991US4982056 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxide
01/01/1991US4981765 Photosensitive polymer
01/01/1991US4981725 Process and composition for sensitizing articles for metallization