| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/27/1991 | EP0414594A1 Method of repairing a device comprising integrated circuits on a carrier substrate |
| 02/27/1991 | EP0414546A2 Backpanel having multiple logic family signal layers |
| 02/27/1991 | EP0414393A1 Improvements relating to electrical connectors |
| 02/27/1991 | EP0414363A2 Method for applying a conductive trace pattern to a substance |
| 02/27/1991 | EP0414362A2 Method for forming conductive traces on a substrate |
| 02/27/1991 | EP0414240A2 Process for soldering allowing low ionic contamination without cleaning operation |
| 02/27/1991 | EP0414204A2 Multilayer interconnection substrate and semiconductor integrated circuit device using the same |
| 02/27/1991 | EP0414188A1 A busbar interconnecting structure |
| 02/27/1991 | EP0414169A2 Photosensitive semi-aqueous developable gold conductor composition |
| 02/27/1991 | EP0414168A2 Photosensitive semi-aqueous developable copper conductor composition |
| 02/27/1991 | EP0414167A2 Photosensitive aqueous developable copper conductor composition |
| 02/27/1991 | EP0414166A2 Photosensitive aqueous developable gold conductor composition |
| 02/27/1991 | EP0414140A2 Light transmission paste and metallic copper deposition method using same |
| 02/27/1991 | EP0414097A2 Method of direct metallization of a non-conductive substrate |
| 02/27/1991 | EP0413961A1 Contact element for printed circuit board |
| 02/27/1991 | EP0413848A1 Adaptor plate for electric coils |
| 02/27/1991 | EP0413808A1 Control arrangement for a seat heater. |
| 02/27/1991 | EP0413703A1 Ceramic-ceramic compounds, suitable for electrical applications |
| 02/27/1991 | EP0413689A1 Wavesoldering device. |
| 02/27/1991 | EP0204767B1 Method for fabricating modules comprising stacked circuit-carrying layers |
| 02/26/1991 | US4996629 Circuit board with self-supporting connection between sides |
| 02/26/1991 | US4996584 Thin-film electrical connections for integrated circuits |
| 02/26/1991 | US4996391 Printed circuit board having an injection molded substrate |
| 02/26/1991 | US4996160 Method and apparatus for quantitative measurement of ionic and organic contaminants remaining on cleaned surfaces |
| 02/26/1991 | US4996116 A substrate, a eutectic/substrate-wetting enhancement layer and a metal-metal compound eutectic layer |
| 02/26/1991 | US4996111 Ceramic surfaces with two or more thin layers of titanium, molybdenum, tungsten, nickel, copper or silver; hardness, adhesion, hermetic sealing |
| 02/26/1991 | US4996106 Used as dust-proof cover during exposure of photomask or reticle |
| 02/26/1991 | US4996097 High capacitance laminates |
| 02/26/1991 | US4996005 Conductive composition and method for manufacturing printed circuit substrate |
| 02/26/1991 | US4995941 Method of manufacture interconnect device |
| 02/26/1991 | US4995818 Bus bar interlayer connector structure in junction box |
| 02/26/1991 | US4995551 Bonding electrical leads to pads on electrical components |
| 02/26/1991 | US4995411 Mass soldering system providing an improved fluid blast |
| 02/26/1991 | US4995156 Method for assembling components upon printed circuit boards |
| 02/25/1991 | CA2023949A1 Solder paste formulation containing stannous fluoride |
| 02/25/1991 | CA2023928A1 Process for soldering allowing low ionic contamination without cleaning operation |
| 02/25/1991 | CA2023846A1 Process for the direct metallization of a non-conducting substrate |
| 02/24/1991 | WO1991003081A1 Rotation lock and wipe connector |
| 02/24/1991 | WO1991002647A1 Capacitor laminate for printed circuit board |
| 02/23/1991 | WO1991003144A1 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 02/23/1991 | CA2011933A1 Backpanel having multiple logic family signal layers |
| 02/22/1991 | CA2023629A1 Photosensitive aqueous developable gold conductor composition |
| 02/22/1991 | CA2023628A1 Photosensitive aqueous developable copper conductor composition |
| 02/22/1991 | CA2023602A1 Photosensitive semi-aqueous developable gold conductor composition |
| 02/22/1991 | CA2023601A1 Photosensitive semi-aqueous developable copper conductor composition |
| 02/22/1991 | CA2014649A1 Method for forming conductive traces on a substrate |
| 02/21/1991 | WO1991002298A1 Use of a liquid electrophotographic toner with an overcoat permanent master in electrostatic transfer |
| 02/21/1991 | WO1991002295A1 Illumination device for illuminating a metal-clad base material |
| 02/21/1991 | WO1991002110A1 Treatment to reduce solder plating whisker formation |
| 02/21/1991 | WO1991001894A1 Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
| 02/21/1991 | CA2014793A1 Method for applying a conductive trace pattern to a substrate |
| 02/20/1991 | EP0413639A1 Assembly of parts forming a mutual angle and method for producing this assembly |
| 02/20/1991 | EP0413614A2 Electrical connections and a method for making the same |
| 02/20/1991 | EP0413540A2 Manufacture of printed circuit board assemblies |
| 02/20/1991 | EP0413335A2 Method of mutually connecting electrode terminals |
| 02/20/1991 | EP0413261A2 Process for removing tin and tin-lead alloy from copper substrates |
| 02/20/1991 | EP0413161A1 Conductive connecting structure |
| 02/20/1991 | EP0413109A2 Fabrication of printed circuit boards using conducting polymer |
| 02/20/1991 | EP0413098A2 Method for the treatment of pieces in a pass-through plant and device for carrying out this method |
| 02/20/1991 | EP0413045A1 Electrical circuit board |
| 02/19/1991 | USRE33541 Surface-mounted power resistors |
| 02/19/1991 | US4994938 Mounting of high density components on substrate |
| 02/19/1991 | US4994895 Hybrid integrated circuit package structure |
| 02/19/1991 | US4994783 Doping metal-free polymer |
| 02/19/1991 | US4994771 Micro-connector to microstrip controlled impedance interconnection assembly |
| 02/19/1991 | US4994352 Optical memory media |
| 02/19/1991 | US4994349 Selectively plating, masking, radiating, removal and development |
| 02/19/1991 | US4994329 Article having nickel plated film comprising a varying content of phosphorus |
| 02/19/1991 | US4994326 Solder powders coated with fluorine compounds, and solder pastes |
| 02/19/1991 | US4994302 Multilayer ceramics; firing green tape |
| 02/19/1991 | US4994215 Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
| 02/19/1991 | US4994202 Solvent cleaning; refrigerants, aersol propellants, blowing agents for polymers |
| 02/19/1991 | US4994154 Filling voids by plating metals from solutions; controlling voltage to prevent overheating |
| 02/19/1991 | US4994153 Removing carbon black from tooling holes with aqueous solution containing alkanolamine, anionic and nonionic surfactants, metal hydroxide |
| 02/19/1991 | US4994133 Impregnating substrate with unsaturated polyester; curing |
| 02/19/1991 | US4994119 Water soluble soldering flux |
| 02/19/1991 | US4993965 Support for floated header/connector |
| 02/19/1991 | US4993958 High density planar interconnect |
| 02/19/1991 | US4993957 Contact pin |
| 02/19/1991 | US4993148 Method of manufacturing a circuit board |
| 02/19/1991 | US4993097 Circuit board deburring system |
| 02/19/1991 | US4993096 Circuit board deburring system |
| 02/19/1991 | CA1280516C Apparatus and method for temporarily sealing holes in printed circuit boards |
| 02/19/1991 | CA1280477C High density flex connector system |
| 02/19/1991 | CA1280476C Connector with compliant retainer |
| 02/14/1991 | DE3925455A1 Belichtungsvorrichtung zum belichten eines metallkaschierten basismaterials An exposure apparatus for exposing a metal-clad base material |
| 02/13/1991 | EP0412475A2 Cleaning composition of dibasic ester and hydrocarbon solvent, and cleaning process |
| 02/13/1991 | CN1049191A Ternary azeotropic composition of 2,3-dichloro-1,1,1,3,3-pentafluoropropane with trans-1,2-dichloroethylene and methanol |
| 02/13/1991 | CN1011629B Xeroprinting with photopolymer master |
| 02/12/1991 | US4992527 Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene |
| 02/12/1991 | US4992399 Ceramic, circuit substrate and electronic circuit substrate by use thereof and process for producing ceramic |
| 02/12/1991 | US4992354 Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
| 02/12/1991 | US4992144 Hydrophilizing surface, electroless deposition of nickel or cobalt, forming microcracks, heating to volatalize components, electrolytic coating of copper |
| 02/12/1991 | US4992139 Second layer with pattern on a first later, etching first later not residing under second; low resistance, rugged |
| 02/12/1991 | US4992053 Electrical connectors |
| 02/12/1991 | US4991666 Terminal pad for fixing a clawed pin to the edge of a hybrid circuit substrate and a connection formed thereby |
| 02/12/1991 | US4991359 Method of abrading a hardened resin |
| 02/12/1991 | US4991290 Flexible electrical interconnect and method of making |
| 02/12/1991 | US4991287 Method for fabricating printed circuit boards |
| 02/12/1991 | US4991286 Method for replacing defective electronic components |