Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1990
12/11/1990CA1277713C2 Portable radio transceiver housing structurally supported by a battery
12/11/1990CA1277534C Process for the production of printed circuit boards
12/07/1990CA2018404A1 Pin-holding device for use in connecting a pin
12/07/1990CA2018249A1 Method of making a metallic pattern on a substrate
12/06/1990DE3917867A1 Electroless gold plating - of tungsten or molybdenum metallisations esp. on electronic ceramic components
12/06/1990DE3917704A1 Computerised reorganisation of PCB(s) using VDU work station - having raster pattern points set by mouse repositioned automatically
12/06/1990DE3917429A1 Computerised conductor layout design procedure for PCB(s) - taking account of electrical boundary conditions and selecting best path from stored complete catalogue of possibilities
12/06/1990CA2017230A1 Process for producing board for precision fine-line circuit
12/05/1990EP0400885A1 Printed circuit having twisted conductor lines printed thereon
12/05/1990EP0400881A2 A technique for object orientation detection using a feed-forward neural network
12/05/1990EP0400873A1 Method and apparatus for cleaning object
12/05/1990EP0400566A2 Adhesive tapes and semiconductor devices
12/05/1990EP0400539A2 Plug contact for a circuit card
12/05/1990EP0400363A1 Copper doped low melt solder for component assembly and network
12/05/1990EP0400332A2 Thin film multilayer laminate interconnection board assembly method
12/05/1990EP0400175A1 Surface-mountable optical element
12/05/1990EP0400071A1 Laminar polymeric sheet
12/05/1990EP0400070A1 Laser-machining polymers
12/05/1990EP0222878B1 Aqueous alkaline developable, uv curable urethane acrylate compounds and compositions useful for forming solder mask coatings
12/05/1990CN1047603A Making method of printed-wiring board
12/05/1990CN1010719B Connection constitution of flat cable
12/05/1990CA2018202A1 Configurable electronic circuit board, adapter therefor, and designing method of electronic circuit using the same board
12/05/1990CA2018180A1 Electrochemical graining of aluminum of aluminum alloy surfaces
12/04/1990US4975854 Method of improving a placement in layout design
12/04/1990US4975763 Edge-mounted, surface-mount package for semiconductor integrated circuit devices
12/04/1990US4975521 Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3,5-diamino-t-butylbenzene
12/04/1990US4975505 Fluoropolymers; high glass transition temperature
12/04/1990US4975484 Terpolymer of an alkyl acrylate, acrylonitrile or methacrylo-nitrile and glycidyl acrylate or glycidyl methacrylate
12/04/1990US4975351 Positive-type photosensitive electrodeposition coating composition with o-quinone diazide sulfonyl amide polymer
12/04/1990US4975327 Polyimide substrate having a textured surface and metallizing such a substrate
12/04/1990US4975312 Multiaxially oriented thermotropic polymer substrate for printed wire board
12/04/1990US4975311 Vacuum lamination station
12/04/1990US4975160 Process for wet chemical metallization of a substrate
12/04/1990US4975159 Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit
12/04/1990US4975142 Fabrication method for printed circuit board
12/04/1990US4975068 Flexible cable connector
12/04/1990US4974663 Cross-circulating method and apparatus for autoclave
12/04/1990CA2018223A1 Method of separating a bonded film from a circuit board
12/04/1990CA2018222A1 Thin film bonding apparatus having adjustable film cutoff unit
12/04/1990CA2018221A1 Film guide device for a film bonding apparatus
12/04/1990CA2015516A1 Thin film bonding method and apparatus having structure for removing wetting agents
12/04/1990CA1277430C Resin-coated aluminum separator-release sheets for manufacturing printed circuit boards
12/04/1990CA1277429C Process for the manufacture of substrates to interconnect electronic components
12/04/1990CA1277380C Anisotropic elastomeric interconnecting system
12/01/1990WO1990015455A1 Snap fit contact assembly
11/1990
11/30/1990CA2017152A1 Printed circuit having twisted conductor lines printed thereon
11/29/1990WO1990014750A1 Low-loss electrical interconnects
11/29/1990WO1990014641A1 Remapping database vectors to discrete pixels
11/29/1990WO1990014626A1 Systems with data-token/one-wire-bus
11/29/1990WO1990014368A1 Preparation of cyano-containing perfluoropolymers having iodine curesites
11/29/1990WO1990014367A1 Preparation of bromo-containing perfluoropolymers having iodine curesites
11/29/1990WO1990014184A2 Continuous furnace
11/29/1990DE4016532A1 Integrated circuit unit with metal substrate - is produced as encapsulated module with plug connections at either end
11/29/1990DE3916944A1 Electrical switch unit for motor vehicle - has contact assembly on one plate with pins that project to engage PCB
11/28/1990EP0399768A2 Mehod of manufacturing a surface-mounted wiring board
11/28/1990EP0399654A2 Flexible circuit connection assembly
11/28/1990EP0399372A2 Liquid crystal display
11/28/1990EP0399325A1 Arrangement for treating and/or cleaning of products, especially of printed circuit panels provided with borings
11/28/1990EP0399300A2 Semiconductor device and electronic apparatus using semiconductor device
11/28/1990EP0399265A2 Substrate used for fabrication of thick film circuit
11/28/1990EP0399161A2 Multi-level circuit card structure
11/28/1990CN1047324A Acrylic adhesive compositions containing crosslinking agents and impact modifiers
11/28/1990CN1047236A Process for reflow soldering
11/27/1990US4974121 Wiring module
11/27/1990US4974120 IC card
11/27/1990US4974119 Conforming heat sink assembly
11/27/1990US4973799 Printed circuit board for use with an image forming apparatus
11/27/1990US4973659 Hear resistant films, fibers, composites
11/27/1990US4973634 Preparation of bromo-containing perfluoropolymers having iodine curesites
11/27/1990US4973389 Process for making a high temperature-resistant metal layer on a ceramic surface
11/27/1990US4973380 Process for etching copper base materials
11/27/1990US4973262 Conduct member for electrical conductors
11/27/1990US4973257 Battery terminal
11/27/1990US4973244 Heating system in the manufacture of printed circuit boards, assemblies and the like
11/27/1990US4973243 Heating system in the manufacture of printed circuit boards, assemblies and the like
11/27/1990US4973142 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
11/27/1990US4972990 Apparatus for removal and installing electronic components with respect to a substrate
11/27/1990US4972989 Method of joining components
11/27/1990US4972798 Drawing machine
11/27/1990US4972630 Method of surface grinding of planar member
11/27/1990US4972580 Method for connecting electronic components with dummy patterns
11/27/1990CA1276841C Process for carrying out the soldering of electronic components on a support
11/23/1990CA2017290A1 Apparatus for processing and/or cleaning articles, in particular circuit boards incorporating drilling or drilled holes, with the aid of a liquid that is applied in a surge
11/23/1990CA2017286A1 Apparatus for processing and/or cleaning articles, in particular circuit boards incorporating drillings, or drilled holes, with the aid of a liquid that is applied in a surge
11/22/1990EP0398721A2 Thin copper foil for printed wiring board and method of manufacturing same
11/22/1990EP0398577A1 Acrylic compositions containing crosslinking agents and impact modifiers
11/22/1990EP0398572A1 Method of manufacturing a thick film resistor element
11/22/1990EP0398088A1 A semiconductor device for detecting or emitting a magnetic line of force or light and a mold for molding a package
11/22/1990EP0398019A1 Direct electroplating of through-holes
11/22/1990EP0397988A2 Plasma processing with metal mask integration
11/22/1990EP0397929A1 Printed circuit board with improved soldering qualities
11/22/1990EP0397747A1 Three-dimensional circuit component assembly and method corresponding thereto
11/22/1990EP0397663A1 Electrodeposition of tin-bismuth alloys.
11/22/1990DE3916485A1 Contact strip with spring contacts - is formed by wound wire loops on former moulded into body
11/22/1990DE3916172A1 Etchant contg. sodium used to prepare plastics - for nucleation and plating by electroless technique, esp. preparing polyimide for copper plating
11/21/1990CN1047149A Photohardenable electrostatic element with improved environmental latitude
11/21/1990CN1047049A Protected conductive foil and procedure for protecting electrodeposited metallic coil during further processing
11/21/1990CN1010478B Stamping ink of high fastness with addition of epoxy resin
11/20/1990WO1990015478A2 Improved three-dimensional circuit component assembly and method corresponding thereto
11/20/1990US4972299 Chip type capacitor and manufacturing thereof
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