Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/1991
04/16/1991US5007841 Integrated-circuit chip interconnection system
04/16/1991CA1283241C2 Thermosetting epoxy resin composition and thermosets therefrom
04/16/1991CA1283223C Circuit board and method of soldering
04/14/1991CA2027509A1 Application specific tape automated bonding
04/12/1991CA2027284A1 Electrical circuit component with latching means for mounting to a circuit substrate
04/11/1991DE3933124A1 Elektronisches geraet mit flexiblem leiterplattenbereich Electronic geraet with flexible printed circuit board area
04/10/1991EP0421960A1 Function unit for electronic equipment
04/10/1991EP0421694A1 Electronic package including hermetic feedthrough and method and apparatus for production thereof
04/10/1991EP0421680A1 Aluminium nitride circuit board
04/10/1991EP0421599A2 Integral protective enclosure for TAB device mounted on a flexible printed circuit board
04/10/1991EP0421347A2 Producing metal patterns on a plastic surface
04/10/1991EP0421343A2 Semiconductor element package and semiconductor element package mounting distributing circuit basic plate
04/10/1991EP0421337A1 Polyphenylene oxide/hybrid epoxy resin system for electrical laminates
04/10/1991EP0421179A1 Process for making conductor tracks for hybrid circuits, particularly for power hybrid circuits
04/10/1991EP0421123A1 Pretreatment process for electroless plating of polyimides
04/10/1991EP0421054A2 Method for forming a defect-free surface on a porous ceramic substrate
04/10/1991EP0420938A1 Multiaxially oriented thermotropic polymer substrate for printed wire board
04/10/1991CA2026973A1 Electrical insulation film and condenser
04/09/1991US5006822 Hybrid RF coupling device with integrated capacitors and resistors
04/09/1991US5006673 Fabrication of pad array carriers from a universal interconnect structure
04/09/1991US5006615 Hydantoin or barbituric acid-extended epoxy resin composition
04/09/1991US5006605 Biaxially-stretched film made of poly(arylene sulfide) resin composition and production process thereof
04/09/1991US5006417 Ternary metal matrix composite
04/09/1991US5006412 Substrate of metal-complexed beta-diketone/thermosetting polymer reaction product
04/09/1991US5006397 Printed circuit board
04/09/1991US5006382 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
04/09/1991US5006182 Method for fabricating multilayer circuits
04/09/1991US5006167 Gold powder, copper oxide powder, glass-based, lead-free inorganic powder, and resin
04/09/1991US5005283 Method of manufacturing an E/M shielded RF circuit board
04/09/1991CA1282869C Substrate mounting device
04/09/1991CA1282868C Printed circuit card reset switch
04/09/1991CA1282845C Contact means
04/04/1991WO1991005306A1 Electro-active cradle circuits for the detection of access or penetration
04/04/1991WO1991004650A1 Via-forming ceramics composition
04/04/1991WO1991004562A1 Improved composite dielectric
04/04/1991WO1991004284A1 Hexafluorobutadiene prepolymer, production thereof, polymerizable composition, and laminate
04/04/1991DE3932213A1 Verbundanordnung mit leiterplatte Interconnected arrangement of circuit board
04/04/1991DE3931551A1 Copper and ceramic multilayer substrate prodn. - involving slitting of ceramic layers to avoid thermal stress damage
04/04/1991CA2067331A1 Electro-active cradle circuits for the detection of access or penetration
04/04/1991CA2026260A1 Preparation of oxidation resistant metal powder
04/03/1991WO1991005454A1 A function unit for electronic equipment
04/03/1991EP0420650A2 Meter device
04/03/1991EP0420604A1 Selectively conductive adhesive device for simultaneous electrical and mechanical coupling
04/03/1991EP0420536A2 Energy meters
04/03/1991EP0420208A2 Allyl ester resin composition and laminated sheet using the same
04/03/1991EP0419845A2 Method for preparing metallized polyimide composites
04/03/1991EP0419804A2 Multilayer structures of different electroactive materials and methods of fabrication thereof
04/03/1991EP0419756A2 Printed circuit transformer
04/03/1991EP0419594A1 Method of making laminated ptfe-containing composites and products thereof.
04/03/1991EP0419577A1 Film-based structural components with controlled coefficient of thermal expansion
04/03/1991CN1050448A Photosensitive semi-aqueous developable gold conductor composition
04/03/1991CN1050447A Photosensitive aqueous developable copper conductor composition
04/03/1991CA2020410A1 Producing metal patterns on a plastic surface
04/02/1991US5005105 Stress-relieving flexible circuit board holder plate
04/02/1991US5004974 Electric current sensing device
04/02/1991US5004775 Laminates for electronics industry
04/02/1991US5004672 Electrophoretic method for applying photoresist to three dimensional circuit board substrate
04/02/1991US5004658 Mask comprising patterns; offset o capacitor plate metallized areas on substrate
04/02/1991US5004649 Layer of syndiotactic styrene based polymer having two surfaces. ametal layer disposed on one surface
04/02/1991US5004640 Heat treatment, reduction, firing
04/02/1991US5004639 Rigid flex printed circuit configuration
04/02/1991US5004520 Method of manufacturing film carrier
04/02/1991US5004317 Wire bond connection system with cancellation of mutual coupling
04/02/1991US5003693 Manufacture of electrical circuits
03/1991
03/30/1991CA2026199A1 Allyl ester resin composition and laminated sheet using the same
03/28/1991DE3930863A1 Printed circuit board with superimposed components - has terminal leads fitted directly and via conductive plugs in respective circuit board holes
03/27/1991EP0419232A2 Field programmable printed circuit board
03/27/1991EP0418719A1 Thermoplastic moulding compositions of fibre-reinforced high-temperature-proof thermoplasts
03/27/1991EP0418606A1 Diffusion bonding method for corrosion-resistant materials
03/27/1991EP0418538A1 Improvements in or relating to balun transformers
03/27/1991EP0418508A1 Electrical connector
03/27/1991EP0418313A1 Circuit writer
03/27/1991EP0418228A1 Amorphous copolymers or perfluoro-2,2-dimethyl-1,3-dioxole
03/27/1991EP0345342A4 Low cost, hermetic pin grid array package
03/27/1991CN1050268A Photosensitive semi-aqueous developable copper conductor composition
03/26/1991US5003622 Printed circuit transformer
03/26/1991US5003273 Multilayer printed circuit board with pseudo-coaxial transmission lines
03/26/1991US5003222 Connector for electroluminescent display panel
03/26/1991US5003126 Shielded flat cable
03/26/1991US5003037 Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3, 5-diamino-t-butylbenzene
03/26/1991US5002903 Porcelain enameled metal substrates
03/26/1991US5002637 Composite material reinforced by para-oriented aramide fiber sheet and process for preparing the same
03/26/1991US5002367 Multi-level circuits, methods for their fabrication, and display devices incorporating such circuits
03/26/1991CA2008067A1 Printed circuit transformer
03/26/1991CA1282185C Substrate mounting device
03/26/1991CA1282184C Substrate mounting device
03/26/1991CA1282183C Substrate connector guide
03/26/1991CA1282182C Substrate connector guide
03/21/1991WO1991003817A1 Conductive pattern forming composition and method of producing the same
03/21/1991WO1991003375A1 Manufacture of printed circuit boards
03/21/1991WO1990015478A3 Improved three-dimensional circuit component assembly and method corresponding thereto
03/20/1991EP0418148A1 Method of making a polymethylpentene based metallized support
03/20/1991EP0418119A1 Sealed electronic module with reduced space requirement
03/20/1991EP0418000A2 Electronic equipment assembly
03/20/1991EP0417946A2 Polymeric film
03/20/1991EP0417837A1 Chemically linked interpenetrating network
03/20/1991EP0417778A1 Polyimide compositions containing polyorganosiloxane for improving atomic oxygen resistance
03/20/1991EP0417749A2 Thick film resistor/integrated circuit substrate and method of manufacture
03/19/1991US5001605 Multilayer printed wiring board with single layer vias
03/19/1991US5001604 Embedded testing circuit and method for fabricating same
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