| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/02/1991 | EP0425316A2 Electric connector |
| 05/02/1991 | EP0425294A2 Two-color molded article for use in circuit formation |
| 05/02/1991 | EP0425148A2 Method of forming multilayer thick film circuits |
| 05/02/1991 | EP0425073A1 Copper paste composition |
| 05/02/1991 | EP0424796A2 Injection molded printed circuits |
| 05/02/1991 | EP0424696A2 Structure for testing the operability of a completed printed circuit board, process for fabricating same and process for testing same. |
| 05/02/1991 | EP0424505A1 Apparatus and method for fabricating printed circuit boards |
| 05/02/1991 | DE4009462A1 Miniature timing relay - has circuitry on disc interconnected by flexible sections that allow folding within housing |
| 05/02/1991 | DE3935792A1 Encapsulated electronic circuit on substrate - has ceramic green sheet foil, forming wall(s) encapsulating housing |
| 05/02/1991 | DE3935680A1 Metal core circuit plate - has copper plate with through hole contacts sandwiched between insulating plates |
| 05/01/1991 | CN1051037A Imide prepolymers and cured products thereof |
| 04/30/1991 | US5012502 Method for determining degree of interconnection of solder joints using X-ray inspection |
| 04/30/1991 | US5012390 Mounting and connection system for electrical communications equipment |
| 04/30/1991 | US5012389 Board wiring pattern for a high density memory module |
| 04/30/1991 | US5012388 Electrode structure of a chip type electronic component |
| 04/30/1991 | US5012387 Printed circuit board with heat dissipating device |
| 04/30/1991 | US5012047 Multilayer wiring substrate |
| 04/30/1991 | US5011872 For heat exchanging adhesives for printed circuits; stability, workability |
| 04/30/1991 | US5011786 Method of manufacturing a hybrid circuit element |
| 04/30/1991 | US5011761 Coating with photosensitive lacquer, masking, exposure, development, removal |
| 04/30/1991 | US5011732 Glass ceramic substrate having electrically conductive film |
| 04/30/1991 | US5011730 Norbornene-type Monomers Processed By Reaction Injection Molding |
| 04/30/1991 | US5011725 Pores back-filled with another metal; glass-free |
| 04/30/1991 | US5011627 Screen-printable paste for manufacturing electrically conductive coatings |
| 04/30/1991 | US5011530 Copper oxide, copper mixture; controlled particle sizes |
| 04/30/1991 | US5011066 Enhanced collapse solder interconnection |
| 04/30/1991 | US5010757 Method of forming dimples in a conductive substrate |
| 04/30/1991 | US5010641 Method of making multilayer printed circuit board |
| 04/28/1991 | CA2027939A1 Printed circuit board, a method of its fabrication and a method of attaching electronic parts thereto |
| 04/27/1991 | CA2025952A1 Embedded testing circuit and method for fabricating same |
| 04/26/1991 | WO1991007073A1 Method of manufacturing a multilayered circuit board |
| 04/26/1991 | CA2066024A1 Method of manufacturing a multilayered circuit board |
| 04/24/1991 | EP0424263A1 Chip card system with offset, portable electronic unit |
| 04/24/1991 | EP0424262A1 Portable electronics with connectable components |
| 04/24/1991 | EP0424135A1 Imide prepolymers and cured products thereof |
| 04/24/1991 | EP0423947A2 Process for electroplating electroactive polymers and articles derived therefrom |
| 04/24/1991 | EP0423821A2 Surface-mount network device |
| 04/24/1991 | EP0423752A2 Dielectric compositions |
| 04/24/1991 | EP0423751A2 Crystallizable, low dielectric constant, low dielectric loss composition |
| 04/24/1991 | EP0423689A2 Organosilicon materials |
| 04/24/1991 | EP0423688A2 Organosilicon materials |
| 04/24/1991 | EP0423651A1 Method for manufacturing a circuit configuration, and circuit configuration on a carrier foil |
| 04/24/1991 | EP0423545A1 Electrical insulation film and condenser |
| 04/24/1991 | CN1050886A 苯乙烯聚合物组合物 Styrene polymer composition |
| 04/24/1991 | CA2023713A1 Gaseous isostatic lamination process |
| 04/23/1991 | US5010450 Front-rear modular unit |
| 04/23/1991 | US5010449 Multi-layer printed circuit board and a method for assuring assembly in a selected order |
| 04/23/1991 | US5010448 Printed circuit board |
| 04/23/1991 | US5010447 Divided capacitor mounting pads |
| 04/23/1991 | US5010446 Multi-edge extender board |
| 04/23/1991 | US5010389 Integrated circuit substrate with contacts thereon for a packaging structure |
| 04/23/1991 | US5010388 Connection structure between components for semiconductor apparatus |
| 04/23/1991 | US5010252 X-ray imaging |
| 04/23/1991 | US5010246 Optical head apparatus applicable to optical disc apparatus |
| 04/23/1991 | US5010233 Self regulating temperature heater as an integral part of a printed circuit board |
| 04/23/1991 | US5010232 Method of and apparatus for perforating printed circuit board |
| 04/23/1991 | US5009965 Coating a nonconductor, dielectric |
| 04/23/1991 | US5009949 Resin composition and electrical laminate obtained therefrom |
| 04/23/1991 | US5009744 Method of manufacturing laminated ceramic electronic component |
| 04/23/1991 | US5009708 Printing paste and method of applying said paste |
| 04/23/1991 | US5009607 Flexible circuit connector |
| 04/23/1991 | US5008998 Method of mounting flat coil |
| 04/23/1991 | CA1283465C Lamp socket assembly |
| 04/20/1991 | CA2027900A1 Dielectric compositions |
| 04/20/1991 | CA2027899A1 Crystallizable, low dielectric constant, low dielectric loss composition |
| 04/19/1991 | CA2027811A1 Imide prepolymers and cured products thereof |
| 04/18/1991 | WO1991005455A1 Compound arrangement with printed circuit board |
| 04/18/1991 | WO1991005452A1 Electronic device with flexible printed circuit board region |
| 04/18/1991 | WO1991005354A1 Solderable conductive polymer composition |
| 04/18/1991 | WO1991005337A1 Coil arrangement for a focussing or track control circuit |
| 04/18/1991 | WO1991005292A1 Control device |
| 04/18/1991 | WO1991005015A1 Resin composition for electrical laminates |
| 04/18/1991 | WO1991005002A1 Polyimide resin laminates |
| 04/18/1991 | WO1991004999A1 Two-pack curable epoxy resin composition |
| 04/18/1991 | DE3934453A1 Hollowed circuit board for surface-mounted components - permits component replacement by mounting new component over defective component without peripheral damage |
| 04/17/1991 | EP0422828A1 Improved film carrier |
| 04/17/1991 | EP0422754A2 Method and apparatus for controlling circuit expansion for consumer electronic systems |
| 04/17/1991 | EP0422558A2 Ceramic substrate used for fabricating electric or electronic circuit |
| 04/17/1991 | EP0422554A1 Cascade assembly of transistors in parallel realised in hybrid circuit technology |
| 04/17/1991 | EP0422495A1 Styrene polymer composition |
| 04/17/1991 | EP0422379A2 Thermosetting resin composition, resin sheet, prepreg and laminated sheet |
| 04/17/1991 | EP0422213A1 Adhesion promotor for thermoplastic substrates |
| 04/17/1991 | EP0422211A1 Transfer fixture and process for printed circuit boards |
| 04/17/1991 | EP0422127A1 Thick film dielectric compositions |
| 04/17/1991 | EP0229159B1 Method for producing enhanced bonds between surfaces and articles produced by the method |
| 04/17/1991 | CN1050806A 功能单元 Functional unit |
| 04/17/1991 | CN1050786A Coil arrangement |
| 04/17/1991 | CN1050730A Polyphenylene oxide/hybrid epoxy resin system for electrical laminates |
| 04/17/1991 | CA2027696A1 Organosilicon materials |
| 04/16/1991 | US5008777 Auxiliary board spacer arrangement |
| 04/16/1991 | US5008770 Filter pin integrated circuit socket kit |
| 04/16/1991 | US5008689 Plastic substrate for thermal ink jet printer |
| 04/16/1991 | US5008656 Flexible cable assembly |
| 04/16/1991 | US5008638 Installation structure of a microwave oscillation circuit unit |
| 04/16/1991 | US5008619 Multilevel circuit board precision positioning |
| 04/16/1991 | US5008554 Multi-plate optical signal processing apparatus with inter-plate optical communication |
| 04/16/1991 | US5008496 Three-dimensional printed circuit board |
| 04/16/1991 | US5008360 Organosilicon materials |
| 04/16/1991 | US5008151 Electronic circuit boards, heat resistant labels; adhesive layer with higher thermal decomposition initiation temperature |
| 04/16/1991 | US5007843 High-density contact area electrical connectors |