| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/19/1991 | US5001302 Connecting structure for an electronic part |
| 03/19/1991 | US5001038 Process for photoimaging a three dimensional printed circuit substrate |
| 03/19/1991 | US5001010 Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom |
| 03/19/1991 | US5000692 I/O relay interface module |
| 03/19/1991 | US5000662 Flat resistance for blower control unit of automobile air conditioner |
| 03/19/1991 | US5000547 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole |
| 03/16/1991 | CA2025401A1 Polyimide compositions containing polyorganosiloxane for improving atomic oxygen resistance |
| 03/16/1991 | CA2025391A1 Chemically linked interpenetrating network |
| 03/14/1991 | WO1991004358A1 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
| 03/14/1991 | DE3928849A1 Continuous prodn. from strip of laminated plates for circuit boards - comprising heating laminate before entry to continuous press to advance resin cure and prevent lateral flow |
| 03/14/1991 | CA2041665A1 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
| 03/13/1991 | EP0417037A2 Process for coating plastic articles |
| 03/13/1991 | EP0416898A2 Thick film substrate with highly thermally conductive metal base |
| 03/13/1991 | EP0416568A2 Method of designing three dimensional electrical circuits |
| 03/13/1991 | EP0416518A2 Process for producing printed circuit boards |
| 03/13/1991 | EP0416461A2 Material for molding printed circuit board and printed circuit board using said material |
| 03/13/1991 | EP0359775A4 Process for providing an improved electroplated tape automated bonding tape and the product produced thereby |
| 03/13/1991 | EP0225917B1 Non-destructive method for determining the extent of cure of a polymer |
| 03/12/1991 | US4999762 High voltage power source device |
| 03/12/1991 | US4999745 Electrical equipment chassis unit |
| 03/12/1991 | US4999740 Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof |
| 03/12/1991 | US4999656 Interchangeable lens with double-sided printed circuit board |
| 03/12/1991 | US4999248 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole |
| 03/12/1991 | US4999136 Electroconductive adhesive, acrylated epoxy resin and urethane |
| 03/12/1991 | US4998885 Elastomeric area array interposer |
| 03/12/1991 | CA1281436C Tape intended as circuits for electronic modules |
| 03/12/1991 | CA1281389C Laminated-print coil structure |
| 03/07/1991 | DE4027245A1 Digital regulator for servomotor with interchangeable circuit board - contains additional printed circuit board for transmission of angle data from commutation sub-assembly to positioning module |
| 03/07/1991 | DE4027244A1 Digital regulator for servomotor equipped with resolver restoration - contains additional circuit board for transmission of angle data from sine commutation sub-assembly to positioning module |
| 03/07/1991 | DE3937810C1 Carrier plate with soft-soldered circuit substrate - has spacing wires of approximately same coefft. of thermal expansion as solder to limit loading of substrate |
| 03/07/1991 | CA2024688A1 Process for producing printed circuit boards and printed circuit boards obtained thereby |
| 03/06/1991 | EP0415692A2 Bonding of articles |
| 03/06/1991 | EP0415663A1 Tape assembly |
| 03/06/1991 | EP0415659A2 Process for making a two-layer film carrier |
| 03/06/1991 | EP0415571A2 Layered thick film resistors and method for producing same |
| 03/06/1991 | EP0415336A2 Method for manufacturing thick film circuit substrate |
| 03/06/1991 | EP0415085A2 Method for fabricating structures on a substrate |
| 03/06/1991 | EP0415052A1 An electrical connector |
| 03/06/1991 | EP0414872A1 Electrically conductive feedthrough and process for manufacturing it. |
| 03/05/1991 | US4998180 Bus device with closely spaced double sided daughter board |
| 03/05/1991 | US4998159 Ceramic laminated circuit substrate |
| 03/05/1991 | US4997996 Printed wiring board mounted electronic component |
| 03/05/1991 | US4997863 Thermosetting resin composition useful for forming insulating layer of multilayer printed wiring board |
| 03/05/1991 | US4997795 Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide |
| 03/05/1991 | US4997724 With inorganic filler |
| 03/05/1991 | US4997702 Printed circuits, epoxy impregnated nonwoven web, heat resistance |
| 03/05/1991 | US4997698 Multilayer element for electronics formed by applying a coating of a glass/ceramic and polymer with heat treatment to remove the binder and sinter the glass |
| 03/05/1991 | US4997377 Adaptor for computers |
| 03/05/1991 | CA1281142C Method for producing circuit board with deposited metal patterns and circuit boards produced thereby |
| 03/02/1991 | CA2024452A1 Thermosetting resin composition, resin sheet, prepreg and laminated sheet |
| 03/02/1991 | CA2024308A1 Process for coating plastics articles |
| 02/27/1991 | EP0414594A1 Method of repairing a device comprising integrated circuits on a carrier substrate |
| 02/27/1991 | EP0414546A2 Backpanel having multiple logic family signal layers |
| 02/27/1991 | EP0414393A1 Improvements relating to electrical connectors |
| 02/27/1991 | EP0414169A2 Photosensitive semi-aqueous developable gold conductor composition |
| 02/27/1991 | EP0414168A2 Photosensitive semi-aqueous developable copper conductor composition |
| 02/27/1991 | EP0414167A2 Photosensitive aqueous developable copper conductor composition |
| 02/27/1991 | EP0414166A2 Photosensitive aqueous developable gold conductor composition |
| 02/27/1991 | EP0413848A1 Adaptor plate for electric coils |
| 02/27/1991 | EP0413808A1 Control arrangement for a seat heater. |
| 02/26/1991 | US4996629 Circuit board with self-supporting connection between sides |
| 02/26/1991 | US4996585 Electronic package |
| 02/26/1991 | US4996584 Thin-film electrical connections for integrated circuits |
| 02/26/1991 | US4996583 Stack type semiconductor package |
| 02/26/1991 | US4996391 Printed circuit board having an injection molded substrate |
| 02/26/1991 | US4996116 A substrate, a eutectic/substrate-wetting enhancement layer and a metal-metal compound eutectic layer |
| 02/26/1991 | US4996115 High electrical and thermal conductivity copper/INVAR" copper laminate, prevent high temperature failure in electronic devices |
| 02/26/1991 | US4996111 Ceramic surfaces with two or more thin layers of titanium, molybdenum, tungsten, nickel, copper or silver; hardness, adhesion, hermetic sealing |
| 02/26/1991 | US4996097 High capacitance laminates |
| 02/26/1991 | US4996005 Conductive composition and method for manufacturing printed circuit substrate |
| 02/26/1991 | US4995156 Method for assembling components upon printed circuit boards |
| 02/24/1991 | WO1991002647A1 Capacitor laminate for printed circuit board |
| 02/23/1991 | WO1991003144A1 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 02/23/1991 | CA2011933A1 Backpanel having multiple logic family signal layers |
| 02/22/1991 | CA2023629A1 Photosensitive aqueous developable gold conductor composition |
| 02/22/1991 | CA2023628A1 Photosensitive aqueous developable copper conductor composition |
| 02/22/1991 | CA2023602A1 Photosensitive semi-aqueous developable gold conductor composition |
| 02/22/1991 | CA2023601A1 Photosensitive semi-aqueous developable copper conductor composition |
| 02/21/1991 | WO1991002363A1 Porous dielectric compositions |
| 02/20/1991 | EP0413564A2 Formation of polymeric metal oxide materials |
| 02/20/1991 | EP0413542A2 Direct mount semiconductor package |
| 02/20/1991 | EP0413386A1 Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| 02/20/1991 | EP0413045A1 Electrical circuit board |
| 02/19/1991 | US4994938 Mounting of high density components on substrate |
| 02/19/1991 | US4994903 Circuit substrate and circuit using the substrate |
| 02/19/1991 | US4994896 Semiconductor device |
| 02/19/1991 | US4994771 Micro-connector to microstrip controlled impedance interconnection assembly |
| 02/19/1991 | US4994739 Magnetic sensor including sensing element having support terminals soldered to printed conductors |
| 02/19/1991 | US4994734 Register circuit board for electronic energy meter |
| 02/19/1991 | US4994316 Dielectric article comprises a layer of syntactic film; lightweight, stiffness |
| 02/19/1991 | US4994302 Multilayer ceramics; firing green tape |
| 02/19/1991 | US4994215 Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
| 02/19/1991 | US4994133 Impregnating substrate with unsaturated polyester; curing |
| 02/19/1991 | US4993148 Method of manufacturing a circuit board |
| 02/19/1991 | CA1280540C Thermoset polymers of styrene terminated tetrakis phenols |
| 02/19/1991 | CA1280477C High density flex connector system |
| 02/19/1991 | CA1280476C Connector with compliant retainer |
| 02/16/1991 | CA2023150A1 Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| 02/13/1991 | EP0412284A1 Circuit board with at least two different electronic subassemblies |
| 02/13/1991 | EP0412154A1 Improved polyimide and fluoropolymer containing films and laminates. |