Patents for H05K 1 - Printed circuits (98,583)
11/1995
11/30/1995CA2163627A1 Processing low dielectric constant materials for high speed electronics
11/29/1995EP0684756A2 Socket having an auxiliary electrical component mounted thereon
11/29/1995EP0684648A2 Method for producing semiconductor device
11/29/1995EP0684647A1 Electronic parts having airbridge interconnection and method of manufacturing such electronic parts
11/29/1995EP0684616A1 Low profile surface mounted magnetic devices and components therefor
11/29/1995EP0573595A4 Integral solid state embedded power supply
11/29/1995CN1112803A A multiple layer printed circuit board
11/29/1995CN1112796A Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly
11/29/1995CN1112623A Lanminate base stock
11/28/1995US5471368 Module having vertical peripheral edge connection
11/28/1995US5471163 Tab circuit fusible links for disconnection or encoding information
11/28/1995US5471151 Electrical interconnect using particle enhanced joining of metal surfaces
11/28/1995US5471091 Techniques for via formation and filling
11/28/1995US5471090 Electronic structures having a joining geometry providing reduced capacitive loading
11/28/1995US5471016 Apparatus having at least one battery secured to a printed circuit board
11/28/1995US5471010 Spatially separated uninsulated twisted wire pair
11/28/1995US5470936 Process for preparing high-adhesion and high-solubility poly (amide-imide-ester)
11/28/1995US5470796 Electronic package with lead wire connections and method of making same
11/28/1995US5470649 Composite with through the thickness reinforcement
11/28/1995US5470644 Apparatus and method for fabrication of printed circuit boards
11/28/1995US5470643 Multilayer element with conductive metal particles, nonmetal particles and thermoplastic phenoxy resins
11/28/1995US5470607 Coating and heat sealing for connectors
11/28/1995US5470412 Process for producing a circuit substrate
11/28/1995US5470244 Electrical connector having reduced cross-talk
11/28/1995US5469981 Electrically blowable fuse structure manufacturing for organic insulators
11/28/1995US5469615 Method for electrical interconnection of metallic patterns
11/25/1995CA2149972A1 Adhesive composition
11/23/1995WO1995031886A1 Multilayer printed wiring board and its manufacture, and transferring plate and its manufacture
11/23/1995WO1995031884A1 Method for forming conductive circuit on surface of molded product, and component having conduction circuit
11/23/1995WO1995031883A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products
11/23/1995DE4431754C1 Carrier element for ic module of chip card
11/23/1995DE4416403A1 Cooling system for printed circuit board
11/22/1995EP0683519A2 A hybrid IC
11/22/1995EP0683516A2 Multilayer circuit board and multichip module substrate
11/22/1995EP0683513A1 Electronic package with multilevel connections
11/22/1995EP0683450A2 Card type semiconductor device and method of manufacturing it
11/22/1995EP0683007A1 Machining device
11/22/1995EP0682852A1 A circuit board arrangement including shielding grids, and constructing thereof
11/22/1995CN2213412Y Restraint type damping structure printed circuit plate
11/22/1995CN1112354A Junction box and PCB assembly therefor
11/22/1995CN1112351A Printed circuit board circuit control device
11/22/1995CN1030292C Jig for detecting height of wavy solder surface, method of controlling height of solder surface
11/21/1995US5469526 Optical fiber support for printed circuit boards
11/21/1995US5469334 Plastic quad-packaged switched-mode integrated circuit with integrated transformer windings and mouldings for transformer core pieces
11/21/1995US5469330 Heat sink header assembly
11/21/1995US5469324 Integrated decoupling capacitive core for a printed circuit board and method of making same
11/21/1995US5469131 Hybrid integrated circuit device
11/21/1995US5469012 Electronic component
11/21/1995US5468996 Electronic package assembly and connector for use therewith
11/21/1995US5468920 Printed circuit board having raised conductor pads
11/21/1995US5468919 Printed circuit board device with surface-mounted bar-like connectors
11/21/1995US5468918 Conductive member for electric circuit and electric circuit body, and method for fabricating them
11/21/1995US5468917 Circuitized structure including flexible circuit with elastomeric member bonded thereto
11/21/1995US5468909 Insulating part with improved heat transfer element
11/21/1995US5468694 Composition for producing low temperature co-fired substrate
11/21/1995US5468445 Firing metals to form oxides from conductive metals
11/21/1995US5468409 Aqueous cupric chloride saline solution; accuracy; printed circuits; radar
11/21/1995US5468345 Method of making a high-definition printed circuit
11/21/1995US5468159 Portable external flexible cable and package using same
11/16/1995DE4429983C1 Automobile electrical or electronic device
11/16/1995DE4416882A1 Mutual alignment of film and circuit board for printing
11/15/1995EP0682368A2 Metallization for polymer-dielectric multichip modules
11/15/1995EP0682366A2 Mounting of integrated circuit devices
11/15/1995EP0682365A1 Three-dimensional interconnection of electronic component housings using printed circuits
11/15/1995EP0682347A2 Telephone resistor
11/15/1995EP0626124A4 High density conductive networks and method and apparatus for making same.
11/15/1995EP0558738A4 System for electrically interconnecting a plurality of daughter boards.
11/15/1995CN1111899A Shield element and production of same
11/15/1995CN1111685A Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board
11/15/1995CN1030271C Composite electric part of stacked multi-layer structure
11/14/1995US5467456 High speed bus branches with compact physical spacing
11/14/1995US5467251 Printed circuit boards and heat sink structures
11/14/1995US5466972 Multilayer integrated circuits, titanium-palladium alloy, improved adhesion
11/14/1995US5466893 Printed circuit board having enhanced EMI suppression
11/14/1995US5466892 For mounting electrical components
11/14/1995US5466728 Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
11/14/1995US5466535 Polyester material on surface with crosslinked adherent layer of acrylic resin and phthalate ester
11/14/1995US5466512 Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
11/14/1995US5466161 Compliant stacking connector for printed circuit boards
11/14/1995US5465898 Process for producing a metal-ceramic substrate
11/14/1995CA2058414C High temperature baking paste
11/14/1995CA2055473C Copper alloy compositions
11/14/1995CA1337545C Copper powder for electroconductive paints and electroconductive paint compositions
11/09/1995WO1995030178A1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
11/09/1995DE4416146A1 Catch attachment to retain SIM block on circuit board
11/09/1995DE19514646A1 Re-configurable personal computer CPU board with bridging switches
11/08/1995EP0681422A2 A printed wire board assembly
11/08/1995EP0681416A2 Printed circuit board and method of connecting electronic parts
11/08/1995EP0681322A2 Bonded ceramic metal composite substrates and circuit boards constructed therewith
11/08/1995EP0680999A1 Styrene resin composition
11/08/1995EP0680660A1 Conductive lacquer contact surface.
11/08/1995EP0680523A1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition
11/08/1995CN1111440A 接收机 Receiver
11/08/1995CN1111439A Electric units for surface fastening
11/07/1995US5465229 Single in-line memory module
11/07/1995US5464950 Aluminum nitride circuit board and method of producing same
11/07/1995US5464682 Minimal capture pads applied to ceramic vias in ceramic substrates
11/07/1995US5464662 Fabrication method of printed wiring board
11/07/1995US5464658 System of electronic laminates with improved registration properties
11/07/1995US5464652 Green ceramic via metallization technique