| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/21/1996 | US5519176 Substrate and ceramic package |
| 05/21/1996 | US5518964 Microelectronic mounting with multiple lead deformation and bonding |
| 05/21/1996 | US5518936 Forming metal layer on dielectric substrate, doping surface of metal, then oxidizing surface of metal yields new dielectric layer having greater surface resistance |
| 05/21/1996 | US5518817 Resin laminate containing syndiotactic styrene-based polymer |
| 05/21/1996 | US5518663 Thick film conductor compositions with improved adhesion |
| 05/21/1996 | US5518165 Soldering techniques employing a snap bar |
| 05/21/1996 | US5517758 Plating method and method for producing a multi-layered printed wiring board using the same |
| 05/21/1996 | US5517756 Method of making substrate member having electrical lines and apertured insulating film |
| 05/21/1996 | US5517751 Multilayer microelectronic wiring module and method for forming the same |
| 05/21/1996 | US5517747 Method and apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits |
| 05/17/1996 | WO1996014660A1 Method for fabricating a self-limiting silicon based interconnect for testing bare semiconductor dice |
| 05/17/1996 | WO1996014619A1 Hierarchical crossbar switch |
| 05/15/1996 | EP0712266A2 Packaging electrical components |
| 05/15/1996 | EP0712160A2 Improvements in or relating to semiconductor devices |
| 05/15/1996 | EP0712157A2 Semiconductor chip package with enhanced thermal conductivity |
| 05/15/1996 | EP0712142A2 Electronic thick film component multiple terminal and method of making the same |
| 05/15/1996 | EP0711802A2 Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| 05/15/1996 | EP0711801A2 Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| 05/15/1996 | EP0672333A4 Compliant stacking connector for printed circuit boards. |
| 05/15/1996 | EP0555407B1 Stacked configuration for integrated circuit devices |
| 05/15/1996 | CN1122509A Cadmium-free and lead-free thick film conductor composition |
| 05/14/1996 | US5517434 Data capture system with communicating and recharging docking apparatus and hand-held data terminal means cooperable therewith |
| 05/14/1996 | US5517208 Liquid crystal apparatus |
| 05/14/1996 | US5517162 Dielectric resonator including a plurality of solder bumps and method of mounting dielectric resonator |
| 05/14/1996 | US5516989 Structure of the flexing section of a multilayer flexible circuit board |
| 05/14/1996 | US5516874 Used between layers in electronic packaging with polyimides and copper |
| 05/09/1996 | WO1996013966A1 Current supply module for mounting on a component-carrying printed circuit board |
| 05/09/1996 | WO1996013965A1 Method of surface mounting radio frequency components and the components |
| 05/09/1996 | WO1996013866A1 Led holder |
| 05/09/1996 | WO1996013837A1 An audio recording device |
| 05/09/1996 | WO1996013208A1 Low noise optical probe |
| 05/09/1996 | DE4439239A1 Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications |
| 05/09/1996 | CA2204029A1 An audio recording device |
| 05/08/1996 | EP0711107A2 Control circuit arrangement |
| 05/08/1996 | EP0711102A1 Method for forming conductive circuit on surface of molded product, and component having conduction circuit |
| 05/08/1996 | EP0711003A1 Brushless rotary connector |
| 05/08/1996 | EP0710861A1 Optical module circuit board having flexible structure |
| 05/08/1996 | EP0710699A1 Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant |
| 05/08/1996 | EP0710690A2 Polyimide film |
| 05/08/1996 | EP0710433A1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprising same |
| 05/08/1996 | EP0710432A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products |
| 05/08/1996 | EP0710431A1 Space-saving memory module |
| 05/08/1996 | EP0710430A1 Processing low dielectric constant materials for high speed electronics |
| 05/08/1996 | EP0710177A1 Circuit board material with barrier layer |
| 05/08/1996 | CN1122170A Improved high frequency electrical connector |
| 05/08/1996 | CN1122099A FPC harness device and FPC used therefor |
| 05/08/1996 | CN1122078A Signal transmitting device, circuit block and integrated circuit suited to fast signal transmission |
| 05/07/1996 | US5515241 Space-saving assemblies for connecting integrated circuits to circuit boards |
| 05/07/1996 | US5515021 Switching battery charger for reducing electromagnetic emussions having separately-mounted circuit boards |
| 05/07/1996 | US5514907 Apparatus for stacking semiconductor chips |
| 05/07/1996 | US5514839 Weldable flexible circuit termination for high temperature applications |
| 05/07/1996 | US5514729 Conductive polyepoxide for traces (wires) on circuit board |
| 05/07/1996 | US5514475 Heat-resistant electrical insulating layer |
| 05/07/1996 | US5514451 Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 05/07/1996 | US5514326 Ceramic sheets and copper pastes to form films for multilayer elements |
| 05/07/1996 | US5513905 Valve control device |
| 05/03/1996 | CA2161915A1 Optical module circuit board having flexible structure |
| 05/02/1996 | WO1996013041A1 Electrically conducting ink with metal grains of different melting points |
| 05/02/1996 | WO1996012752A2 Curable epoxy resin accelerated by boric acid and its analogs |
| 05/02/1996 | WO1996012751A2 Low voc laminating formulations |
| 05/02/1996 | WO1995024729A3 Modular architecture for high bandwidth computers |
| 05/01/1996 | EP0710066A1 Drawer for electronic cards and its support |
| 05/01/1996 | EP0710065A1 Drawer for electronic cards |
| 05/01/1996 | EP0710062A1 Multilayer printed wiring board and its manufacture, and transferring plate and its manufacture |
| 05/01/1996 | EP0710060A1 Process for fabrication of plastic supports, device for fabrication of such a support and application of the process for production of integrated circuit cards |
| 05/01/1996 | EP0710058A2 Inhibiting short-circuits between electrically conductive paths |
| 05/01/1996 | EP0709930A2 Capacitive trace coupling for reduction of crosstalk |
| 05/01/1996 | EP0709883A1 Semiconductor package fabricated by using tape automated bonding |
| 05/01/1996 | EP0709866A2 Manufacturing method and manufacturing apparatus for ceramic electronic components |
| 05/01/1996 | EP0709804A1 Process of fabricating contactless cards |
| 05/01/1996 | EP0708795A1 Heat-resistant polyimide blends and laminates |
| 04/30/1996 | US5513077 Power distribution center for motor vehicle, provided with printed circuit boards, printed circuit webs and intermediate insulations arranged in layers |
| 04/30/1996 | US5513076 Multi-level assemblies for interconnecting integrated circuits |
| 04/30/1996 | US5513073 Optical device heat spreader and thermal isolation apparatus |
| 04/30/1996 | US5513072 Power module using IMS as heat spreader |
| 04/30/1996 | US5513070 Dissipation of heat through keyboard using a heat pipe |
| 04/30/1996 | US5512781 Semiconductor package device for super high-frequency band |
| 04/30/1996 | US5512712 Printed wiring board having indications thereon covered by insulation |
| 04/30/1996 | US5512711 Multilayer ceramic substrates |
| 04/30/1996 | US5512376 Nonpolar polymers comprising antiplasticizers |
| 04/30/1996 | US5512360 PTFE reinforced compliant adhesive and method of fabricating same |
| 04/30/1996 | US5512353 Conductive layers of copper or an alloy containing copper; ceramic layers comprise a complex oxide or an oxide solid solution containing copper |
| 04/30/1996 | US5512224 Methods for making circuit boards by vacuum impregnation |
| 04/30/1996 | US5511306 Masking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder process |
| 04/28/1996 | CA2161485A1 Electronic card tray |
| 04/28/1996 | CA2161483A1 Electronic card tray and support for said |
| 04/25/1996 | WO1996012391A1 Three-dimensional interconnect having modules with vertical top and bottom connectors |
| 04/25/1996 | DE19529645A1 Alignment precision measuring mark for e.g. MOS transistor |
| 04/24/1996 | EP0708583A1 Electronic apparatus and its manufacture |
| 04/24/1996 | EP0708582A1 Electrically conductive paste materials and applications |
| 04/24/1996 | EP0708581A2 A process for the electroless deposition of metal on a substrate |
| 04/24/1996 | EP0708484A1 Three-dimensional integrated circuit stacking |
| 04/24/1996 | EP0708459A1 Coaxial vias in an electronic substrate |
| 04/24/1996 | EP0708141A2 Flame retardant thermosettable resin compositions |
| 04/24/1996 | EP0707967A2 Printer head |
| 04/24/1996 | EP0707952A1 Ceramic multilayered composite, process for its preparation and module |
| 04/24/1996 | EP0544915B1 Package structure of semiconductor device and manufacturing method therefor |
| 04/24/1996 | CN1121305A Printed circuit board for connectors |
| 04/24/1996 | CN1121186A A liquid crystal display device having veideo signal driving circuit mounted on one side |
| 04/24/1996 | CN1121090A Method of adhesion to a polymide surface by formation of covalent bonds |