Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
06/1995
06/13/1995US5424918 Universal hybrid mounting system
06/13/1995US5424917 Semiconductor device and method for mounting semiconductor wafer
06/13/1995US5424906 Variable capacitor
06/13/1995US5424896 Semiconductor package electrostatic discharge damage protection
06/13/1995US5424586 Multiplex communication control unit
06/13/1995US5424492 Optimal PCB routing methodology for high I/O density interconnect devices
06/13/1995US5424490 Twisted lead pairs on PCB to improve common mode rejection
06/13/1995US5424093 Dipping ends of substrates into metallic paints to form films yields external electrodes having uniform thickness
06/13/1995US5423930 Method of providing a sintered ceramic body having a concave portion
06/13/1995US5423688 Clip for small outline IC device
06/08/1995WO1995015595A1 High-density interconnect technique
06/08/1995WO1995015266A1 Method of producing transfer sheets
06/07/1995EP0656741A2 Semiconductor package
06/07/1995EP0656171A1 A multiple layer printed circuit board.
06/07/1995EP0500759B1 Coating metal on poly(aryl ether ketone) surfaces
06/06/1995US5423080 Microwave transceiver using the technique of multilayer printed circuits
06/06/1995US5422790 Computer chip mounting hardware for heat dissipation
06/06/1995US5422782 Multiple resonant frequency decoupling capacitor
06/06/1995US5422622 For suppressing electromagnetic radiation in an electronic device
06/06/1995US5422516 Electronic parts loaded module including thermal stress absorbing projecting electrodes
06/06/1995US5422184 Trifunctional cyanate esters, polymers thereof; use and preparation thereof
06/06/1995US5421985 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
06/06/1995US5421943 Pulsed current resistive heating for bonding temperature critical components
06/06/1995US5421926 Printing or patterning transparent conductive ink onto a base board, drying and calcining to form conductive film, overcoating a ultraviolet curing resin, bonding base board to base plate, peeling base board
06/06/1995US5421734 Method and apparatus for evolving bus from five volt to three point three volt operation
06/06/1995US5421083 Method of manufacturing a circuit carrying substrate having coaxial via holes
06/06/1995US5421082 Method of forming a decal having conductive paths thereon
06/06/1995US5421081 Method for producing electronic part mounting structure
06/06/1995CA1335817C Precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
06/06/1995CA1335772C Thick film forming process
06/01/1995WO1995014915A1 A method and an apparatus for controlling leakage from a closed container
06/01/1995WO1995014575A1 Alignment systems
06/01/1995DE4404312C1 Connection device for microwave device unilateral planar line
06/01/1995DE4340583A1 Temperature-stabilised hybrid circuit
06/01/1995DE4340249A1 Apparatus for controlling boring depth in multilayer PCB
06/01/1995DE4340168A1 Mfr. of multilayer circuit boards
06/01/1995CA2176250A1 Alignment systems
05/1995
05/31/1995EP0655183A1 Method of manufacturing a multilayer printed wire board.
05/31/1995EP0638094A4 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content.
05/31/1995EP0509992B1 Electrical connectors
05/31/1995CN1103073A Epoxy acrylates
05/30/1995US5420756 Memory card including stacked semiconductor memory elements located on a printed circuit board having a straight wiring pattern
05/30/1995US5420755 Circuit board with electrical components, in particular surface-mounted devices
05/30/1995US5420754 Stacked board assembly for computing machines, including routing boards
05/30/1995US5420748 Surface mounting type chip capacitor
05/30/1995US5420378 Printed circuit board/chassis grounding apparatus and methods
05/30/1995US5420377 Circuit assembly with vented solder pads
05/30/1995US5420073 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
05/30/1995US5419954 Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
05/30/1995US5419807 Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability
05/30/1995US5419708 Printed circuit card with minor surface I/O pads
05/30/1995US5419038 Method for fabricating thin-film interconnector
05/26/1995WO1995014367A1 Junction panel for control unit
05/26/1995WO1995014330A1 Dual-sided push-pull amplifier
05/26/1995WO1995014314A1 Contact structure for interconnections, interposer, semiconductor assembly and method
05/26/1995WO1995014301A1 Attenuator especially for audio-signals
05/26/1995WO1995014116A1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition
05/26/1995WO1995014057A1 Styrene resin composition
05/26/1995WO1995013901A1 Metallurgically bonded polymer vias
05/26/1995CA2176491A1 Junction panel for control unit
05/24/1995EP0654962A1 Shielding member and manufacturing method of such a member
05/24/1995EP0654959A1 Vibration sensitive isolation for printed circuit boards
05/24/1995EP0654958A1 Tab circuit fusible links for disconnection or encoding information
05/24/1995EP0654821A2 Electronic device having co-planar heatsink and electrical contacts
05/24/1995EP0654818A1 Semiconductor device with solder bump and process for manufacturing the same
05/24/1995EP0654800A1 Method of processing circuit board
05/24/1995EP0654799A1 Chip form of surface mounted electrical resistance and its manufacturing method
05/24/1995EP0654174A1 Sealed conductive active alloy feedthroughs
05/24/1995EP0654170A1 Thermal cut-out and process for activating it.
05/24/1995CN1102838A Epoxy acrylates
05/23/1995US5418690 Multiple wiring and X section printed circuit board technique
05/23/1995US5418689 Printed circuit board or card for direct chip attachment and fabrication thereof
05/23/1995US5418688 Cardlike electronic device
05/23/1995US5418685 Housing for a control device having a printed circuit board with an electrically and thermally conducting lining
05/23/1995US5418504 Transmission line
05/23/1995US5418455 Magnetic position detector having a magnetic sensor element and a circuit board having a selectively changeable wiring pattern
05/23/1995US5418193 Adhesive strength
05/23/1995US5418066 Polyimide composition for polyimide/copper foil laminate
05/23/1995US5418002 Preoxidation
05/23/1995US5417800 Thin film circuit board manufacturing process
05/23/1995US5417784 Method of manufacturing laminated electronic component
05/23/1995US5417745 Silver containing conductive coatings
05/23/1995US5417578 Printed wiring boards having low signal-to-ground ratios
05/23/1995CA2109687A1 Method for the through plating of conductor foils
05/23/1995CA1335625C Inspection of multipattern circuit boards
05/18/1995WO1995013691A1 Printed circuit assembly having component locating features
05/18/1995WO1995013632A1 Passive conductor component for surface mounting on a printed circuit board
05/18/1995WO1995013625A1 Structure and method for mounting semiconductor device and liquid crystal display device
05/17/1995EP0653905A1 Direct chip attach module
05/17/1995EP0653904A2 Via fill compositions for direct attach of devices and methods for applying same
05/17/1995EP0653789A2 Electronic package structure and method of making same
05/17/1995EP0653763A1 Ultraviolet hardenable, solventless conductive polymeric material
05/17/1995EP0653459A1 Polyarylensulfide molding composition
05/16/1995US5416667 Printed wiring board having an electromagnetic wave shielding layer
05/16/1995US5416502 High-density circuit and method of its manufacture
05/16/1995US5416278 Feedthrough via connection
05/16/1995US5416277 Cicuit and process of manufacturing the circuit
05/16/1995US5416276 Printed circuit board having protecting means
05/16/1995US5416274 Circuit board
05/16/1995US5416049 Glassy binder system for ceramic substrates, thick films and the like
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