| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/12/1995 | EP0662019A1 Method for making a ceramic metal composite |
| 07/12/1995 | EP0425677B1 Conductive paste composition and curing thereof |
| 07/12/1995 | EP0389619B1 Method of making a curved plastic body with circuit pattern |
| 07/12/1995 | EP0362404B1 Method of producing laminated ceramic electronic parts |
| 07/12/1995 | CN1105171A Electronic device |
| 07/12/1995 | CN1105135A Hot pluggable motherboard bus connector method |
| 07/11/1995 | US5432677 Multi-chip integrated circuit module |
| 07/11/1995 | US5432626 Liquid crystal display device with shield casing connected to frame holding the display above lower casing holding light source |
| 07/11/1995 | US5432486 Capacitive and inductive coupling connector |
| 07/11/1995 | US5432485 Circuit for crossing strip lines |
| 07/11/1995 | US5432484 Connector for communication systems with cancelled crosstalk |
| 07/11/1995 | US5432303 Polysiloxanes |
| 07/11/1995 | US5432237 Radically polymerizable composition |
| 07/11/1995 | US5432234 Resin, process for preparing the same and compositon comprising the same |
| 07/11/1995 | US5431987 Noise filter |
| 07/11/1995 | US5431955 High frequency conductive material and resonator and method for making |
| 07/11/1995 | US5431803 Electrodeposited copper foil and process for making same |
| 07/11/1995 | US5431718 Silver, binder, aluminum oxide spinel |
| 07/11/1995 | US5431584 Electrical connector with reduced crosstalk |
| 07/11/1995 | US5430933 Method of manufacturing a multiple layer printed circuit board |
| 07/11/1995 | CA2139726A1 Use of aryl phosphates containing functional groups as flameproofing agents for polymers |
| 07/06/1995 | WO1995018522A1 Printed wiring board |
| 07/06/1995 | DE4405228C1 Printed circuit with rigid and flexible regions |
| 07/06/1995 | DE4400160A1 Bus circuit board for electronic system |
| 07/05/1995 | EP0661778A2 Method and apparatus for providing electrical power to electronic devices enclosed in a chip carrier |
| 07/05/1995 | EP0308518B1 Ink receiving flexible sheet for printing a pattern on an object by firing and label comprising said sheet |
| 07/04/1995 | US5430614 Electrical interconnect using particle enhanced joining of metal surfaces |
| 07/04/1995 | US5430326 Semiconductor device for mounting on a printed wiring board |
| 07/04/1995 | US5430258 Copper interconnection structure and method of preparing same |
| 07/04/1995 | US5430247 Twisted-pair planar conductor line off-set structure |
| 07/04/1995 | US5429859 LTCC alignment marks for mechanical parts placement |
| 07/04/1995 | US5429709 Method of manufacturing polyimide multilayer printed wiring boards |
| 07/04/1995 | US5429701 Method of electrically interconnecting conductors |
| 07/04/1995 | US5429670 Gold paste for a ceramic circuit board |
| 07/04/1995 | US5429510 High-density interconnect technique |
| 07/04/1995 | US5428891 Method of making an electrical interconnect device |
| 07/04/1995 | US5428885 Method of making a multilayer hybrid circuit |
| 07/04/1995 | CA2053274C Snap fit contact assembly |
| 06/29/1995 | DE4426841A1 Rapid signal transmission system between digital circuits, e.g. between CPU and memory arrangement, e.g. integrated memory circuit |
| 06/29/1995 | DE4420527A1 Connection system to contact pin terminal components on PCB |
| 06/29/1995 | DE4343843A1 Structured metallisation prodn. on substrate surface |
| 06/28/1995 | EP0660651A1 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate |
| 06/28/1995 | EP0660650A1 Printed circuit board having improved solder drainage pads |
| 06/28/1995 | EP0660649A2 Mounting structure for electronic component |
| 06/28/1995 | EP0660405A2 Surface mount chip package |
| 06/28/1995 | EP0660400A1 Thermoconductive element, utilized in electronics as a printed circuit support or as a component and its method of fabrication |
| 06/28/1995 | EP0660399A2 Ball-grid-array integrated circuit package with thermal conductivity |
| 06/28/1995 | EP0660382A2 Hybrid circuits and a method of manufacture |
| 06/28/1995 | EP0659553A1 Coextruded multi-layer aromatic polyimide film and preparation thereof |
| 06/28/1995 | CN1104405A Method and apparatus for aligning and attaching a surface mount component |
| 06/28/1995 | CN1104404A Circuit elements and manufacture of same |
| 06/28/1995 | CN1104373A Interconnection structure for crosstalk reduction toimprove off-chip selectivity |
| 06/27/1995 | USRE34982 Thick film copper via fill inks |
| 06/27/1995 | US5428750 Bi-directional buffers for mounting a plurality of integrated circuit devices |
| 06/27/1995 | US5428513 Covered vanity mirror and flexible circuit |
| 06/27/1995 | US5428506 Circuit board EMI suppressor including a lossy dielectric layer |
| 06/27/1995 | US5428505 Printed circuit board |
| 06/27/1995 | US5428499 Printed circuit board having integrated decoupling capacitive core with discrete elements |
| 06/27/1995 | US5428288 Microelectric monitoring device |
| 06/27/1995 | US5428190 Rigid-flex board with anisotropic interconnect and method of manufacture |
| 06/27/1995 | US5427983 Depositing adhesion metal layer over etched molybdenum mask, overlays a metallic cushion layer and uppermost gold protective layer spreads over edges to cover exposed edges |
| 06/27/1995 | US5427848 Two polyimide layers with different coefficients of thermal expansion and a conductive layer bonded to stainless steel substrate |
| 06/27/1995 | US5427841 Printed circuit having patterned polymeric layer with both electroconductive (having electrodeposited metal layer) and nonconductive areas |
| 06/27/1995 | US5427825 Localized surface glazing of ceramic articles |
| 06/27/1995 | US5427641 Method of forming a mounting structure on a tape carrier |
| 06/27/1995 | US5427537 Device with external interface |
| 06/27/1995 | US5426849 Method of producing a polyimide multilayer wiring board |
| 06/22/1995 | WO1995016814A1 Powder coating method for producing a composite web |
| 06/21/1995 | EP0659032A1 Electronic component |
| 06/21/1995 | EP0658960A2 Cavity and bump interconnection structure for electronic packages |
| 06/21/1995 | EP0658932A2 Ceramic substrate for semiconductor device |
| 06/21/1995 | EP0658786A2 Optical information transmitting device and method of manufacturing same |
| 06/21/1995 | EP0658463A2 Valve control device |
| 06/21/1995 | EP0658436A1 Diffusion patterning process and screen therefor |
| 06/21/1995 | EP0658300A1 Structured printed circuit boards and films and process for producing them |
| 06/21/1995 | EP0658293A1 Method and apparatus for crosstalk cancellation in data connectors |
| 06/21/1995 | EP0642412A4 Printed circuit substrates. |
| 06/21/1995 | EP0635150A4 Universal bus motherboard using a universal-to-specific bus translator card. |
| 06/21/1995 | CN1104014A Composite substrates for preparation of printed circuits |
| 06/21/1995 | CN1103903A Electrodeposited copper foil and process for makin gasame using electrolyte solutions having controlled additions of chloride ions and organic additives |
| 06/20/1995 | US5426738 Apparatus for flexibly routing signals between pins of electronic devices |
| 06/20/1995 | US5426568 Launch-protected electronic assembly |
| 06/20/1995 | US5426563 Three-dimensional multichip module |
| 06/20/1995 | US5426405 Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects |
| 06/20/1995 | US5426399 Film carrier signal transmission line having separating grooves |
| 06/20/1995 | US5426263 Electronic assembly having a double-sided leadless component |
| 06/20/1995 | US5425647 Split conductive pad for mounting components to a circuit board |
| 06/14/1995 | EP0658077A1 Package, socket and connector for integrated circuit |
| 06/14/1995 | EP0658074A1 Assembly of a printed circuit board and at least one component, and method of fastening a component to a printed circuit board |
| 06/14/1995 | EP0657932A2 Terminal electrode for a chip package, assembly and method of production |
| 06/14/1995 | EP0657797A2 Clock distribution system for synchronous circuit assemblies |
| 06/14/1995 | EP0657744A2 Determination of surface, insulation resistnace of printed circuit boards |
| 06/14/1995 | EP0657309A1 Method of producing transfer sheets |
| 06/14/1995 | EP0474795B1 Printed circuit board for a power electronic circuit |
| 06/14/1995 | EP0412154B1 Improved polyimide and fluoropolymer containing films and laminates |
| 06/14/1995 | DE4443410A1 Gedruckte Kunststoffschaltkreise und Kontakte und Verfahren zur Herstellung dieser Plastic printed circuits and contacts and method for producing these |
| 06/14/1995 | DE4342258A1 Conductive region prodn. on or in ceramic |
| 06/14/1995 | CN1103617A Ink jet recording head, ink jet recording head cartridge and recording apparatus using same and method of manufacturing the head |
| 06/14/1995 | CA2135953A1 Circuit board manufacture |
| 06/13/1995 | US5424921 Electronic assembly incorporating a three-dimensional circuit board |