Patents for H05K 1 - Printed circuits (98,583) |
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02/28/1996 | CN1117442A Transfer manufacture |
02/28/1996 | CN1117441A Diffusion patterning process and screen therefor |
02/27/1996 | US5495397 Three dimensional package and architecture for high performance computer |
02/27/1996 | US5495395 Face-mounting type module substrate attached to base substrate face to face |
02/27/1996 | US5495223 Hybrid integrated circuit device |
02/27/1996 | US5495076 Flexible geometry circuit board |
02/27/1996 | US5494991 Polyimides and processes for preparing the same |
02/27/1996 | US5494780 Accurately forming circuit patterns of electroconductive materials on three-dimensiuonal molded substrates |
02/27/1996 | US5494180 Hybrid resistance cards and methods for manufacturing same |
02/27/1996 | US5493769 Method of manufacturing electronic component and measuring characteristics of same |
02/24/1996 | CA2130742A1 Hearing instrument hybrids incorporating edge metallization |
02/22/1996 | WO1996005713A1 Solder pad for printed circuit boards |
02/22/1996 | WO1996005640A1 Electric power distribution system |
02/22/1996 | WO1996005635A1 Low cross-talk network connector |
02/22/1996 | DE4429569A1 Thermal fuse mfr. for resistive tracks on insulated surface |
02/22/1996 | DE4429514A1 Holder for light-guides or conductors fixed to PCB |
02/21/1996 | EP0697804A1 Printed circuit board for plug connector |
02/21/1996 | EP0697725A2 Ceramic composition for circuit substrat and its fabrication |
02/21/1996 | EP0697724A1 Process for the production of a base board for printed wiring boards |
02/21/1996 | EP0697278A1 Liquid crystal polymer-metal laminate and a method of producing such a laminate |
02/21/1996 | EP0654170B1 Thermal cut-out and process for activating it |
02/21/1996 | CN1117257A Spacer for light emitting deode |
02/21/1996 | CN1117211A Structure and process for electro/mechanical joint formation |
02/20/1996 | US5493594 Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging |
02/20/1996 | US5493476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends |
02/20/1996 | US5493263 Microstrip which is able to supply DC bias current |
02/20/1996 | US5493262 Dielectric ceramic composition containing ZnO-B2 O3 -SiO2 glass, method of preparing the same, and resonator and filter using the dielectric ceramic composition |
02/20/1996 | US5493259 High voltage, low pass filtering connector with multiple ground planes |
02/20/1996 | US5493096 Thin substrate micro-via interconnect |
02/20/1996 | US5493077 Printed wiring board having a blind via |
02/20/1996 | US5493076 Structure for repairing semiconductor substrates |
02/20/1996 | US5493074 Flexible printed circuit board comprising conductive circuits, an adhesive layer and cured films |
02/20/1996 | US5492762 Having on surface transparent conductive coating containing conductive particles of specified diameter and particle size distribution in matrix of silica polymer with specified degree of polymerization |
02/20/1996 | US5492653 Aqueous silver composition |
02/20/1996 | US5492482 Compact thermocouple connector |
02/20/1996 | US5492478 Communications system |
02/20/1996 | US5492477 Miniature lamp holder |
02/15/1996 | WO1996004773A1 Rigid flex printed circuit board |
02/15/1996 | WO1996004772A1 Internally damped circuit articles |
02/15/1996 | WO1996004672A1 A gas discharge display having printed circuit board members and method of making same |
02/15/1996 | WO1996004343A1 Aqueous fluoropolymer dispersion |
02/15/1996 | WO1996004327A1 Phosphorus-modified epoxide resins, process for producing the same and their use |
02/15/1996 | WO1995035585A3 Surface mountable substrate edge terminal |
02/15/1996 | WO1995024730A3 Apparatus having inner layers supporting surface-mount components |
02/15/1996 | CA2194980A1 Internally damped circuit articles |
02/14/1996 | EP0696880A2 Plastic housing having a vibration damped mounting of a bondable element |
02/14/1996 | EP0696614A1 Material for the preparation of electrically conductive compounds in thermoplastic molded bodies |
02/14/1996 | EP0504314B1 Polymeric compositions crosslinked with bistriazene compounds |
02/14/1996 | EP0504265B1 Crosslinkable fluorinated polymer compositions |
02/14/1996 | CN1116772A Design of high density structures with laser etch stop |
02/13/1996 | US5491651 Flexible wearable computer |
02/13/1996 | US5491614 Control device and method of making the same |
02/13/1996 | US5491449 Dual-sided push-pull amplifier |
02/13/1996 | US5491364 Reduced stress terminal pattern for integrated circuit devices and packages |
02/13/1996 | US5491301 Shielding method and circuit board employing the same |
02/13/1996 | US5490965 Method for closing holes in ceramic substrates |
02/13/1996 | US5490895 Coating board with adhesive mixture of polybutadiene, epoxy novolak resin, and alumina, placing aluminum sheet in contact with the surface, curing |
02/13/1996 | US5490325 Guarded printed circuit board islands |
02/08/1996 | WO1996003851A1 Microridge abrasion for selective metalization |
02/08/1996 | DE4427456A1 Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung und ihre Verwendung Phosphorus-modified epoxy resins, process for their preparation and their use |
02/08/1996 | DE19527595A1 Electronic card with printed circuits e.g. for vehicle instrument panel |
02/07/1996 | EP0696078A1 Microwave oscillator and its manufacturing method |
02/07/1996 | EP0696074A1 Terminal collector for contracting a battery for power supply to electronic circuitery, electronic circuitery and remote control transmitter incorporating the same |
02/07/1996 | EP0695724A1 Cadmium-free and lead-free thick film conductor composition |
02/07/1996 | EP0502953B1 Quaternary ammonium polyarylamides |
02/07/1996 | CN1116400A Cooling structure of unit |
02/07/1996 | CN1116253A Method of coating a copper film on a ceramic substrate |
02/06/1996 | US5490040 Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array |
02/06/1996 | US5489803 Solder-bonded structure |
02/06/1996 | US5489752 Process for dissipating heat from a semiconductor package |
02/06/1996 | US5489750 Method of mounting an electronic part with bumps on a circuit board |
02/06/1996 | US5489749 Semiconductor connection components and method with releasable lead support |
02/06/1996 | US5489669 Polyimide and process for producing the same |
02/06/1996 | US5489500 Flexible strip structure for a parallel processor and method of fabricating the flexible strip |
02/06/1996 | US5488765 Method of measuring characteristics of a multilayer electronic component |
02/01/1996 | WO1996002959A1 Electrical connections with deformable contacts |
02/01/1996 | WO1996002958A1 Assembly of shielded connectors and a board having plated holes |
02/01/1996 | WO1996002955A1 Process for producing an electrically conductive connection |
02/01/1996 | WO1996002922A2 Variable voltage protection structures and methods for making same |
02/01/1996 | WO1996002848A1 Three axis packaging |
02/01/1996 | WO1996002692A1 Glass fabric produced with zero-twist yarn |
02/01/1996 | DE4427112A1 Circuit board arrangement with aluminium base for power electronics |
02/01/1996 | DE4426955A1 Clamp device for fixing the screening of control lines, bus lines and signal lines |
02/01/1996 | DE4426908A1 Electrical isolation of two signal circuits for SMD on PCB |
02/01/1996 | DE4426350A1 Integrated switch system with injection-moulded plastic body for vehicle internal light |
02/01/1996 | CA2194968A1 Variable voltage protection structures and methods for making same |
01/31/1996 | EP0695117A1 Control device for motor vehicle |
01/31/1996 | EP0695116A1 Fluoropolymer composites containing two or more ceramic fillers to achieve independent control of dielectric constant and dimensional stability |
01/31/1996 | EP0694996A1 Selectively metallized plastic hold-down connector |
01/31/1996 | EP0694968A2 Multi-chip module semiconductor device |
01/31/1996 | EP0694927A1 Flat cable with conductor ends connectable to connector |
01/31/1996 | CN1115899A Semiconductor equipment with multi-layered coductor configuration |
01/30/1996 | US5488542 MCM manufactured by using thin film multilevel interconnection technique |
01/30/1996 | US5488540 Printed circuit board for reducing noise |
01/30/1996 | US5488539 Protecting cot packaged ICs during wave solder operations |
01/30/1996 | US5488394 Print head and method of making same |
01/30/1996 | US5488313 Test probe and circuit board arrangement for the circuit under test for microstrip circuitry |
01/30/1996 | US5488256 Semiconductor device with interconnect substrates |
01/30/1996 | US5488201 Low crosstalk electrical signal transmission medium |
01/30/1996 | US5488144 Bifunctional aromatic cyanates, prepolymers and electrical laminates made therefrom |