Patents for H05K 1 - Printed circuits (98,583)
02/1996
02/28/1996CN1117442A Transfer manufacture
02/28/1996CN1117441A Diffusion patterning process and screen therefor
02/27/1996US5495397 Three dimensional package and architecture for high performance computer
02/27/1996US5495395 Face-mounting type module substrate attached to base substrate face to face
02/27/1996US5495223 Hybrid integrated circuit device
02/27/1996US5495076 Flexible geometry circuit board
02/27/1996US5494991 Polyimides and processes for preparing the same
02/27/1996US5494780 Accurately forming circuit patterns of electroconductive materials on three-dimensiuonal molded substrates
02/27/1996US5494180 Hybrid resistance cards and methods for manufacturing same
02/27/1996US5493769 Method of manufacturing electronic component and measuring characteristics of same
02/24/1996CA2130742A1 Hearing instrument hybrids incorporating edge metallization
02/22/1996WO1996005713A1 Solder pad for printed circuit boards
02/22/1996WO1996005640A1 Electric power distribution system
02/22/1996WO1996005635A1 Low cross-talk network connector
02/22/1996DE4429569A1 Thermal fuse mfr. for resistive tracks on insulated surface
02/22/1996DE4429514A1 Holder for light-guides or conductors fixed to PCB
02/21/1996EP0697804A1 Printed circuit board for plug connector
02/21/1996EP0697725A2 Ceramic composition for circuit substrat and its fabrication
02/21/1996EP0697724A1 Process for the production of a base board for printed wiring boards
02/21/1996EP0697278A1 Liquid crystal polymer-metal laminate and a method of producing such a laminate
02/21/1996EP0654170B1 Thermal cut-out and process for activating it
02/21/1996CN1117257A Spacer for light emitting deode
02/21/1996CN1117211A Structure and process for electro/mechanical joint formation
02/20/1996US5493594 Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging
02/20/1996US5493476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends
02/20/1996US5493263 Microstrip which is able to supply DC bias current
02/20/1996US5493262 Dielectric ceramic composition containing ZnO-B2 O3 -SiO2 glass, method of preparing the same, and resonator and filter using the dielectric ceramic composition
02/20/1996US5493259 High voltage, low pass filtering connector with multiple ground planes
02/20/1996US5493096 Thin substrate micro-via interconnect
02/20/1996US5493077 Printed wiring board having a blind via
02/20/1996US5493076 Structure for repairing semiconductor substrates
02/20/1996US5493074 Flexible printed circuit board comprising conductive circuits, an adhesive layer and cured films
02/20/1996US5492762 Having on surface transparent conductive coating containing conductive particles of specified diameter and particle size distribution in matrix of silica polymer with specified degree of polymerization
02/20/1996US5492653 Aqueous silver composition
02/20/1996US5492482 Compact thermocouple connector
02/20/1996US5492478 Communications system
02/20/1996US5492477 Miniature lamp holder
02/15/1996WO1996004773A1 Rigid flex printed circuit board
02/15/1996WO1996004772A1 Internally damped circuit articles
02/15/1996WO1996004672A1 A gas discharge display having printed circuit board members and method of making same
02/15/1996WO1996004343A1 Aqueous fluoropolymer dispersion
02/15/1996WO1996004327A1 Phosphorus-modified epoxide resins, process for producing the same and their use
02/15/1996WO1995035585A3 Surface mountable substrate edge terminal
02/15/1996WO1995024730A3 Apparatus having inner layers supporting surface-mount components
02/15/1996CA2194980A1 Internally damped circuit articles
02/14/1996EP0696880A2 Plastic housing having a vibration damped mounting of a bondable element
02/14/1996EP0696614A1 Material for the preparation of electrically conductive compounds in thermoplastic molded bodies
02/14/1996EP0504314B1 Polymeric compositions crosslinked with bistriazene compounds
02/14/1996EP0504265B1 Crosslinkable fluorinated polymer compositions
02/14/1996CN1116772A Design of high density structures with laser etch stop
02/13/1996US5491651 Flexible wearable computer
02/13/1996US5491614 Control device and method of making the same
02/13/1996US5491449 Dual-sided push-pull amplifier
02/13/1996US5491364 Reduced stress terminal pattern for integrated circuit devices and packages
02/13/1996US5491301 Shielding method and circuit board employing the same
02/13/1996US5490965 Method for closing holes in ceramic substrates
02/13/1996US5490895 Coating board with adhesive mixture of polybutadiene, epoxy novolak resin, and alumina, placing aluminum sheet in contact with the surface, curing
02/13/1996US5490325 Guarded printed circuit board islands
02/08/1996WO1996003851A1 Microridge abrasion for selective metalization
02/08/1996DE4427456A1 Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung und ihre Verwendung Phosphorus-modified epoxy resins, process for their preparation and their use
02/08/1996DE19527595A1 Electronic card with printed circuits e.g. for vehicle instrument panel
02/07/1996EP0696078A1 Microwave oscillator and its manufacturing method
02/07/1996EP0696074A1 Terminal collector for contracting a battery for power supply to electronic circuitery, electronic circuitery and remote control transmitter incorporating the same
02/07/1996EP0695724A1 Cadmium-free and lead-free thick film conductor composition
02/07/1996EP0502953B1 Quaternary ammonium polyarylamides
02/07/1996CN1116400A Cooling structure of unit
02/07/1996CN1116253A Method of coating a copper film on a ceramic substrate
02/06/1996US5490040 Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
02/06/1996US5489803 Solder-bonded structure
02/06/1996US5489752 Process for dissipating heat from a semiconductor package
02/06/1996US5489750 Method of mounting an electronic part with bumps on a circuit board
02/06/1996US5489749 Semiconductor connection components and method with releasable lead support
02/06/1996US5489669 Polyimide and process for producing the same
02/06/1996US5489500 Flexible strip structure for a parallel processor and method of fabricating the flexible strip
02/06/1996US5488765 Method of measuring characteristics of a multilayer electronic component
02/01/1996WO1996002959A1 Electrical connections with deformable contacts
02/01/1996WO1996002958A1 Assembly of shielded connectors and a board having plated holes
02/01/1996WO1996002955A1 Process for producing an electrically conductive connection
02/01/1996WO1996002922A2 Variable voltage protection structures and methods for making same
02/01/1996WO1996002848A1 Three axis packaging
02/01/1996WO1996002692A1 Glass fabric produced with zero-twist yarn
02/01/1996DE4427112A1 Circuit board arrangement with aluminium base for power electronics
02/01/1996DE4426955A1 Clamp device for fixing the screening of control lines, bus lines and signal lines
02/01/1996DE4426908A1 Electrical isolation of two signal circuits for SMD on PCB
02/01/1996DE4426350A1 Integrated switch system with injection-moulded plastic body for vehicle internal light
02/01/1996CA2194968A1 Variable voltage protection structures and methods for making same
01/1996
01/31/1996EP0695117A1 Control device for motor vehicle
01/31/1996EP0695116A1 Fluoropolymer composites containing two or more ceramic fillers to achieve independent control of dielectric constant and dimensional stability
01/31/1996EP0694996A1 Selectively metallized plastic hold-down connector
01/31/1996EP0694968A2 Multi-chip module semiconductor device
01/31/1996EP0694927A1 Flat cable with conductor ends connectable to connector
01/31/1996CN1115899A Semiconductor equipment with multi-layered coductor configuration
01/30/1996US5488542 MCM manufactured by using thin film multilevel interconnection technique
01/30/1996US5488540 Printed circuit board for reducing noise
01/30/1996US5488539 Protecting cot packaged ICs during wave solder operations
01/30/1996US5488394 Print head and method of making same
01/30/1996US5488313 Test probe and circuit board arrangement for the circuit under test for microstrip circuitry
01/30/1996US5488256 Semiconductor device with interconnect substrates
01/30/1996US5488201 Low crosstalk electrical signal transmission medium
01/30/1996US5488144 Bifunctional aromatic cyanates, prepolymers and electrical laminates made therefrom