| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/13/1996 | US5546279 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 08/13/1996 | US5545927 Seed layers of chromium and copper |
| 08/13/1996 | US5545924 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 08/13/1996 | US5545697 Urethane modified epoxy resin compositions |
| 08/13/1996 | US5545510 Photodefinable dielectric composition useful in the manufacture of printed circuits |
| 08/13/1996 | US5545485 Injection molding blend of biodegradable polymer and antibiotic |
| 08/13/1996 | US5545475 Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof |
| 08/13/1996 | US5545308 Method of using conductive polymers to manufacture printed circuit boards |
| 08/13/1996 | US5544773 Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
| 08/08/1996 | WO1996024234A1 Upgradeable voltage regulator modules |
| 08/08/1996 | WO1996024175A1 Press-fit connecting pin and electronic device using the same |
| 08/08/1996 | WO1996024171A1 Dielectric resonator, dielectric filter using the resonator, and production method of the dielectric filter |
| 08/08/1996 | DE19503949A1 Multilayer circuit-board for switched mode power supplies |
| 08/08/1996 | DE19503778A1 Housing and mounting system for electronic circuit boards and feed lines |
| 08/08/1996 | CA2169003A1 Apparatus for providing controlled impedance in an electrical contact |
| 08/07/1996 | EP0725440A2 Silicon carbide metal diffusion barrier layer |
| 08/07/1996 | EP0725438A2 Capacitor built-in type substrate |
| 08/07/1996 | EP0725434A2 Microchip module assemblies |
| 08/07/1996 | EP0724946A2 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
| 08/07/1996 | EP0708795A4 Heat-resistant polyimide blends and laminates |
| 08/07/1996 | CN1128608A Edge-connecting printed circuit board |
| 08/07/1996 | CN1128487A Non-annular lands |
| 08/07/1996 | CN1128486A Method for forming solder bump in IC mounted board |
| 08/06/1996 | US5544069 Structure having different levels of programmable integrated circuits interconnected through bus lines for interconnecting electronic components |
| 08/06/1996 | US5544018 Electrical interconnect device with customizeable surface layer and interwoven signal lines |
| 08/06/1996 | US5544017 Multichip module substrate |
| 08/06/1996 | US5544015 Printed circuit board |
| 08/06/1996 | US5543774 Method and a device for protecting a printed circuit board against overcurrents |
| 08/06/1996 | US5543663 Semiconductor device and BGA package |
| 08/06/1996 | US5543659 Package for power semiconductor device with snubber circuit |
| 08/06/1996 | US5543586 Apparatus having inner layers supporting surface-mount components |
| 08/06/1996 | US5543583 Conductive solder pad for bonding an electronic device to a ceramic substrate |
| 08/06/1996 | US5543222 Metallized polyimide film containing a hydrocarbyl tin compound |
| 08/06/1996 | US5542854 Edge card connector with alignment means |
| 08/06/1996 | US5542175 Method of laminating and circuitizing substrates having openings therein |
| 08/01/1996 | WO1996023397A1 Printed circuit board and heat sink arrangement |
| 08/01/1996 | WO1996023321A1 Glass bonding layer for a ceramic circuit board support substrate |
| 08/01/1996 | WO1996023320A1 High performance integrated circuit package |
| 08/01/1996 | WO1996022882A1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 08/01/1996 | WO1996022881A1 Electrical feedthroughs for ceramic circuit board support substrates |
| 08/01/1996 | DE19542043A1 Bleifreie Niedertemperaturlegierung und Verfahren zur Bildung einer mechanisch überlegenen Verbindung unter Verwendung dieser Legierung A lead-free low-temperature alloy and method of forming a mechanically superior compound using this alloy |
| 08/01/1996 | DE19502408A1 Printed circuit board edge connector |
| 07/31/1996 | EP0671041B1 Detection tag |
| 07/31/1996 | EP0527156B1 Highly conductive polymer thick film compositions |
| 07/31/1996 | CN1127980A Fixing end structure of electronic unit |
| 07/31/1996 | CN1127979A Dual pattern microprocessor package footprint |
| 07/30/1996 | US5541812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame |
| 07/30/1996 | US5541788 Magnetic disk drive and flexible printed circuit board |
| 07/30/1996 | US5541567 Coaxial vias in an electronic substrate |
| 07/30/1996 | US5541565 High frequency microelectronic circuit enclosure |
| 07/30/1996 | US5541450 Low-profile ball-grid array semiconductor package |
| 07/30/1996 | US5541369 Printed circuit board having transmission lines with varying thicknesses |
| 07/30/1996 | US5541368 Laminated multi chip module interconnect apparatus |
| 07/30/1996 | US5541367 Printed circuit board having a land with an inwardly facing surface and method for manufacturing same |
| 07/30/1996 | US5541366 Foam printed circuit substrates |
| 07/30/1996 | US5541005 Semiconductor substrate |
| 07/30/1996 | US5540884 Ceramic green sheet from aluminum nitride with aluminum oxide and metal oxide or metal halides, forming patterns of metal pastes, lamination and heat treatment for sintering |
| 07/30/1996 | US5540779 Apparatus for manufacture of multi-layer ceramic interconnect structures |
| 07/30/1996 | US5540742 Method of fabricating thin film cells and printed circuit boards containing thin film cells using a screen printing process |
| 07/30/1996 | US5539976 System for manufacture of hybrid integrated circuit |
| 07/27/1996 | WO1996019537A1 A thermosetting material |
| 07/27/1996 | CA2166945A1 Printed circuit board and heat sink arrangement |
| 07/25/1996 | WO1996022671A1 Electronic circuit structure |
| 07/25/1996 | WO1996022670A1 Production of electrical circuit boards |
| 07/25/1996 | WO1996022597A1 Laminate |
| 07/25/1996 | WO1996002922A3 Variable voltage protection structures and methods for making same |
| 07/25/1996 | DE4345316A1 Outer rotor motor or outer armature motor |
| 07/24/1996 | EP0723388A1 Printed circuit board |
| 07/24/1996 | EP0723317A2 Edge card connector with alignment means |
| 07/24/1996 | EP0722969A1 Aromatic polyimides derived from aromatic dianhydrides and chlorinated aromatic diamines |
| 07/24/1996 | EP0722653A1 Metal-cored printed circuit board for insertion into the casing of an electronic device |
| 07/24/1996 | EP0722652A1 Device with external electrical interface |
| 07/23/1996 | US5539619 Branch joint box |
| 07/23/1996 | US5539618 Electrical device, in particular switching or controlling device for motor vehicle |
| 07/23/1996 | US5539611 Interface connection through an insulating part |
| 07/23/1996 | US5539362 Surface mounted directional coupler |
| 07/23/1996 | US5539360 Differential transmission line including a conductor having breaks therein |
| 07/23/1996 | US5539186 Temperature controlled multi-layer module |
| 07/23/1996 | US5539181 Interconnect structure |
| 07/23/1996 | US5539156 Circuit board |
| 07/23/1996 | US5538789 Adherent layer of thermosetting resin capable of b-stage curing |
| 07/23/1996 | US5538756 High capacitance sheet adhesives and process for making the same |
| 07/23/1996 | US5538616 Process for copper plating a wiring board |
| 07/23/1996 | US5538433 Electrical connector comprising multilayer base board assembly |
| 07/23/1996 | US5538175 Adjustment of a solder wave process in real-time |
| 07/23/1996 | US5537740 Method of making printed circuit board |
| 07/18/1996 | WO1996022008A1 Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board |
| 07/18/1996 | WO1996021693A1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 07/18/1996 | WO1996012752A3 Curable epoxy resin accelerated by boric acid and its analogs |
| 07/17/1996 | EP0722264A2 Circuit board & circuit board assembly |
| 07/17/1996 | EP0722186A2 Laminated electronic part |
| 07/17/1996 | EP0721676A1 Microwave circuit |
| 07/17/1996 | EP0587644B1 Printed wire boards and method of making same |
| 07/17/1996 | EP0521982B1 Method for producing a printed circuit board |
| 07/17/1996 | CN1126940A Semiconductor unit heat discharging device for start of motor |
| 07/17/1996 | CN1032323C Process for preparing strong aromatic polyamide paper of high porosity |
| 07/16/1996 | US5537108 Method and structure for programming fuses |
| 07/16/1996 | US5536981 Circuit card mounting shelf apparatus having automatic identification number setting function |
| 07/16/1996 | US5536909 Semiconductor connection components and methods with releasable lead support |
| 07/16/1996 | US5536907 Semiconductor package |