Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/1995
03/21/1995US5399715 Polyamino oligomers and polymaleimide compounds
03/21/1995US5399536 Silicon nitride sintered body
03/21/1995US5399416 Heat-conductive adhesive films, laminates with heat-conductive adhesive layer and the use thereof
03/21/1995US5399239 Coating with protective layer of chemical resistant polyimide
03/21/1995US5399107 Modular jack with enhanced crosstalk performance
03/21/1995US5399106 High performance electrical connector
03/21/1995US5398399 Galvanically
03/16/1995WO1995007601A1 Device with external electrical interface
03/16/1995WO1995004786A3 Adhesive paste containing polymeric resin
03/16/1995DE4418634A1 Aus bioabbaubarem Harz geformter Artikel Formed of biodegradable resin products
03/16/1995DE4340280A1 Set of structural parts for a housing made of plastic for the accommodation of electric components
03/16/1995DE4330975A1 Method for fitting a power component on a printed circuit board
03/15/1995EP0643550A1 Plastic part e.g. wiring support or plastic casing
03/15/1995EP0643441A2 Electrical connectors
03/15/1995EP0643440A2 Electrical connectors
03/15/1995EP0643396A2 Pastes for coating substrates, process for their manufacture and application
03/15/1995EP0643366A2 Electronic modul for cards and production of such module
03/15/1995EP0642919A1 Laminate and multilayer printed circuit board
03/15/1995EP0642699A1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
03/15/1995EP0642412A1 Printed circuit substrates
03/15/1995EP0511339B1 Elastomeric seating member
03/15/1995CN1027945C Electronic detail mounting module
03/14/1995US5398169 Microelectronic package comprising metal housing grounded to board edge
03/14/1995US5398165 Electronic circuit component and mounting method therefor
03/14/1995US5398163 Flexible printed circuit board
03/14/1995US5398128 Resin coating retains flexibility after cure
03/14/1995US5397863 Dispersion of fluorinated carbon particles in polymer, substrate for electronic devices, low coefficient of expansion
03/14/1995US5397862 Horizontally twisted-pair planar conductor line structure
03/14/1995US5397861 Electrical interconnection board
03/14/1995US5397847 Heat-resistant laminate materials and preparation thereof
03/14/1995US5397741 Polysilsesquioxane overcoating, improved chemical mechanical polishing results
03/14/1995US5397682 Polyimide precursor and photosensitive composition containing the same
03/14/1995US5397599 Metallization of polycarbonate, low and high phosphorus nickel layers
03/14/1995US5397419 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same
03/14/1995US5397383 Organic vehicle for electronic composition
03/14/1995US5397239 Molded hinged connector
03/09/1995WO1995006955A1 A twisted-pair planar conductor line off-set structure
03/09/1995WO1995006946A1 A horizontally twisted-pair planar conductor line structure
03/09/1995WO1995006945A1 A vertically twisted-pair planar conductor line structure
03/09/1995DE4329577A1 Device for simplifying the measurement of thick film resistors
03/08/1995EP0642166A2 On circuit board mounted multichip module
03/08/1995EP0642057A1 Photosensitive resin composition
03/08/1995EP0641671A1 Sheets for formation of patterns and methods for forming and fixing patterns
03/08/1995EP0493414B1 Polyimide resin laminates
03/08/1995EP0389559B1 Foldable radio housing
03/07/1995US5396397 Field control and stability enhancement in multi-layer, 3-dimensional structures
03/07/1995US5396390 Magnetic head assembly for floppy disc drive
03/07/1995US5396102 Semiconductor device
03/07/1995US5395876 Acrylated urethane resin, acrylic resin, acrylate monomer, free radical initiator and silver particles
03/07/1995US5395718 Conformal photolithographic method and mask for manufacturing parts with patterned curved surfaces
03/07/1995US5395268 Modular jack
03/07/1995US5395256 Contact element for SMD printed circuit boards and mounting method
03/07/1995US5395251 Board retainer system for active electrical connector assembly
03/07/1995US5394609 Method and apparatus for manufacture of printed circuit cards
03/07/1995US5394608 Laminated semiconductor device and fabricating method thereof
03/02/1995WO1995006344A1 Cross-connect system
03/02/1995WO1995006092A1 Conductive coating material having good adhesiveness to metal oxide molding
03/02/1995WO1995006075A1 Allyl-epoxy ipn
03/02/1995DE4429922A1 Polarised electronic component for surface mounting
03/02/1995DE4412125A1 Partially galvanised plastics products and a partial galvanisation process therefor
03/02/1995DE4329251A1 Arrangement for protection of components, which are sensitive to overvoltages, on printed circuit boards
03/02/1995CA2170033A1 Allyl-epoxy ipn
03/02/1995CA2169563A1 Cross-connect system
03/01/1995EP0641154A1 Housing for electronic components
03/01/1995EP0641153A1 Method of making subsurface electronic circuits
03/01/1995EP0641152A1 Process for forming a circuit with a laser and component formed thereby
03/01/1995EP0641046A1 Apparatus for modifying an electrical signal
03/01/1995EP0641034A2 Interconnection structure for crosstalk reduction to improve off-chip selectivity
03/01/1995EP0640993A1 Silver containing conductive coatings
03/01/1995EP0640653A2 Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
03/01/1995EP0640490A2 Ink jet recording head and recording apparatus using same
03/01/1995EP0640226A1 Flexible wearable computer
03/01/1995EP0640160A1 Process for preparing strong aromatic polyamide papers of high porosity.
03/01/1995EP0640039A1 Thin film metallization and brazing of aluminum nitride
03/01/1995EP0484370B1 Structured knitted woven fabrics
03/01/1995EP0479986B1 A multi-layer printed circuit board and a method for assuring assembly in a selected order
03/01/1995EP0461269B1 High-frequency heating device
03/01/1995EP0448686B1 High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact
02/1995
02/28/1995US5394301 Arrangement for dissipating heat from power components assembled on a printed-circuit board
02/28/1995US5394300 Thin multilayered IC memory card
02/28/1995US5394298 Semiconductor devices
02/28/1995US5394011 Package structure for semiconductor devices and method of manufacturing the same
02/28/1995US5394010 Semiconductor assembly having laminated semiconductor devices
02/28/1995US5393934 Busbar conductor
02/28/1995US5393929 Electrical insulation and articles thereof
02/28/1995US5393887 Having a brominated or chlorinated phthalimide end group with maleimide as other end group, rendering it fireproof; curable to thermosetting resins; blisterproof
02/28/1995US5393864 Wet-etchable random polyimide copolymer for multichip module applications
02/28/1995US5393715 Aluminum nitride sintered body and method of preparing the same
02/28/1995US5393604 Production of silica "green" tape and co-fired silica substrates therefrom
02/28/1995US5393591 Process for producing copper-clad base materials
02/28/1995US5393568 Metalized coating process
02/28/1995US5393558 Method of bonding a conductor composition including a lithium compound to an aluminum nitride substrate
02/28/1995US5393396 Apparatus for electrodepositing metal
02/28/1995US5393359 Method and apparatus for bonding outer leads of a liquid crystal display to metal leads of a bonding tape
02/28/1995US5393352 Pb/Bi-containing high-dielectric constant oxides using a non-P/Bi-containing perovskite as a buffer layer
02/28/1995US5393001 Core chuck for coil winding
02/28/1995US5392982 Ceramic bonding method
02/23/1995WO1995005726A1 Edge-connecting printed circuit board
02/23/1995WO1995005689A1 Configurable circuit substrate
02/23/1995WO1995005688A1 Configurable circuit substrate
1 ... 854 855 856 857 858 859 860 861 862 863 864 865 866 867 868 869 870 871 872 873 874 ... 986