| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/27/1996 | CN1031446C Making method for multi-layer electronic circuit |
| 03/26/1996 | US5502631 Circuit elements that are ultrasonically welded together |
| 03/26/1996 | US5502621 Mirrored pin assignment for two sided multi-chip layout |
| 03/26/1996 | US5502617 Electronic device having a flat, card-like casing enclosing components for a complete computer system |
| 03/26/1996 | US5501755 Large area multi-electrode radiation detector substrate |
| 03/26/1996 | US5501350 Forming photoresist layer on a copper layer black-oxide treated by alkaline oxidizer and finely surface roughened by acid treatment |
| 03/26/1996 | US5501003 Method of assembling electronic packages for surface mount applications |
| 03/26/1996 | CA2074975C Constant impedance transition between transmission structures of different dimensions |
| 03/26/1996 | CA1338186C Circuit board material and electroplating bath for the production thereof |
| 03/21/1996 | WO1996008945A1 Monolithic lcp polymer microelectronic wiring modules |
| 03/21/1996 | WO1996008525A1 Process for producing photosensitive resin and liquid photosensitive resin composition |
| 03/21/1996 | DE4432966A1 Economical injection moulding of plastics device with metal on pt. of surface |
| 03/20/1996 | EP0702511A2 Packaging electrical components |
| 03/20/1996 | EP0702509A2 Packaging electrical components |
| 03/20/1996 | EP0702404A2 Semiconductor device |
| 03/20/1996 | EP0702402A1 Manufacturing method for integrated circuits and semiconductor wafer so obtained |
| 03/20/1996 | EP0701924A2 Electrical connection box |
| 03/20/1996 | EP0701514A1 Hybrid junction box |
| 03/20/1996 | EP0517725B1 Improved ceramic dielectric composition and method of preparation |
| 03/19/1996 | US5500862 Multi-layer digital circuit board with a test pattern section |
| 03/19/1996 | US5500789 Printed circuit board EMI shielding apparatus and associated methods |
| 03/19/1996 | US5500786 Insulating element having height greater than heights of neighboring components |
| 03/19/1996 | US5500785 Circuit board having improved thermal radiation |
| 03/19/1996 | US5500555 Multi-layer semiconductor package substrate with thermally-conductive prepeg layer |
| 03/19/1996 | US5500523 Optical information transmitting device and method of manufacturing same |
| 03/19/1996 | US5500278 Used for hybrid integrated circuit |
| 03/19/1996 | US5499447 Method for manufacturing a printed circuit board having electrodes on end surface of substrate |
| 03/19/1996 | US5499444 Method of manufacturing a rigid flex printed circuit board |
| 03/19/1996 | US5499442 Delay line device and method of manufacturing the same |
| 03/19/1996 | CA2010128C Printed circuit board with electromagnetic interference prevention |
| 03/14/1996 | WO1996008037A1 Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture |
| 03/14/1996 | WO1996007983A1 Support element |
| 03/14/1996 | WO1996007982A1 Circuit with a chip card module and a coil connected therewith |
| 03/14/1996 | WO1996007686A1 Epoxy resin mixtures for prepregs and composites |
| 03/14/1996 | WO1996007685A1 Epoxy resin mixtures for prepregs and composites |
| 03/14/1996 | WO1996007684A1 Epoxy resin mixtures for prepregs and composites |
| 03/14/1996 | WO1996007683A1 Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound |
| 03/14/1996 | CA2199390A1 Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound |
| 03/13/1996 | EP0701298A2 Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
| 03/13/1996 | EP0700630A1 Foil printed circuit boards and method of producing the same |
| 03/13/1996 | EP0700409A1 Thermally cross-linkable heat-sealing adhesive |
| 03/13/1996 | EP0559863A4 Method for forming solder bump interconnections to a solder-plated circuit trace |
| 03/13/1996 | EP0452506B1 METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's |
| 03/13/1996 | EP0440822B1 Conductive pattern forming composition and method of producing the same |
| 03/13/1996 | CN1118566A Panel assembly structure capable of connecting wiring line with electrode at fine pitch and integrated circuit mounting tape and manufacturing method thereof |
| 03/13/1996 | CN1118382A Process for producing metal-bonded-ceramic material or components, metal-bonded-ceramic material or components produced by that method, and electronic circuit substrates fabricated from said material |
| 03/12/1996 | US5499164 High impact digital crash data recorder |
| 03/12/1996 | US5499161 For a mass storage device |
| 03/12/1996 | US5499131 Liquid crystal display |
| 03/12/1996 | US5498906 Capacitive coupling configuration for an intergrated circuit package |
| 03/12/1996 | US5498905 Layered features for co-fired module integration |
| 03/12/1996 | US5498657 Fluorine-containing polymer composition |
| 03/12/1996 | US5498471 Flame-resistant substrate for flexible circuit boards |
| 03/07/1996 | WO1996007302A1 Device with an electric circuit |
| 03/07/1996 | WO1996007301A1 Long flex circuits |
| 03/07/1996 | WO1996007187A1 Printed circuit board inductor |
| 03/07/1996 | WO1996006737A1 Apparatus for real-time estimation of printing medium properties and method for the use thereof |
| 03/07/1996 | DE4431604A1 Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule Circuit arrangement having a smart card module and an associated coil |
| 03/07/1996 | DE4431520A1 Relay in flat housing e.g. mounted on carrier rails in switch boxes |
| 03/07/1996 | DE4430798A1 Stanzgitter zur Verbindung von elektrischen Bauelementen Stamped grid for connection of electrical components |
| 03/06/1996 | EP0700239A1 Articles including solderable zinc surfaces |
| 03/06/1996 | EP0700237A1 Thin core printed wire boards |
| 03/06/1996 | EP0700084A1 Device to fasten electronic devices to a heatsink and method of mounting to a printed circuit board |
| 03/06/1996 | EP0699670A2 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition |
| 03/06/1996 | EP0699354A1 Planar cable array |
| 03/06/1996 | EP0699353A1 Electrical interconnect assembly |
| 03/06/1996 | EP0699340A1 An electric fuse and protective circuit |
| 03/06/1996 | EP0390891B1 Method of forming holes in ceramic ic packages |
| 03/06/1996 | CN1031236C Mounting structure of electronic elements |
| 03/05/1996 | US5497495 Computer electronic system having a cover for every module |
| 03/05/1996 | US5497291 Power semiconductor device including terminal plates located between two substrates that functions as electrical connectors and mechanical supports |
| 03/05/1996 | US5497037 Method and apparatus for decoupling of unused power supply pins of a printed circuit board capable of operating at a plurality of predetermined voltages |
| 03/05/1996 | US5496971 Circuit arrangement for multilayer printed circuit board |
| 03/05/1996 | US5496970 Planar cable array |
| 03/05/1996 | US5496772 Multilayer element formed with vapor deposition by radiation in nitrogen atmosphere |
| 03/05/1996 | US5496690 Base film having dimensional stability and high transparency, and photographic light-sensitive material comprising same |
| 03/05/1996 | US5496613 Printed wire boards and method of making same |
| 03/05/1996 | US5495665 Process for providing a landless via connection |
| 03/05/1996 | CA2012870C Protective plug for connector banks of telecommunication and data systems |
| 03/01/1996 | CA2157149A1 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition |
| 02/29/1996 | WO1996006459A1 Component stacking in multi-chip semiconductor packages |
| 02/29/1996 | WO1996006389A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
| 02/29/1996 | WO1996006128A1 Aromatic polyamide film, process for producing the same, and magnetic recording medium and solar cell produced by using the same |
| 02/29/1996 | WO1996006125A1 Biaxially oriented, heat-set polyester film having improved thermal shrinkage resistance |
| 02/29/1996 | DE19506664A1 Electric control apparatus for vehicle IC engine electromechanical mechanism |
| 02/29/1996 | CA2190458A1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
| 02/28/1996 | EP0699020A1 Circuit board provided with through-hole connexions |
| 02/28/1996 | EP0699017A2 Electrical or electronic device for a motor vehicle |
| 02/28/1996 | EP0698921A2 Layered features for co-fired module integration |
| 02/28/1996 | EP0698920A2 A method for assembling integrated circuits upon printed circuit boards |
| 02/28/1996 | EP0698895A2 Electrical safety barriers |
| 02/28/1996 | EP0698590A2 Metallization of ceramics through application of an adherent reducible layer |
| 02/28/1996 | EP0698290A1 Power semiconductor device with stress buffer layer |
| 02/28/1996 | EP0698129A1 Method for forming metallic films and use of the same |
| 02/28/1996 | EP0686093A4 Metal on plastic films with adhesion-promoting layer |
| 02/28/1996 | EP0674589A4 Electrical insulation from biaxially oriented penbb film. |
| 02/28/1996 | EP0611389B1 Uses of 1,1,1,3,3,3-hexafluoropropane |
| 02/28/1996 | EP0606216B1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
| 02/28/1996 | EP0556184B1 Circuit board with electrical components, in particular surface-mounted devices |
| 02/28/1996 | CN1117478A Ceramic substrates for hybrid integrated circuits |