| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/23/1995 | WO1995005678A1 Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices, and the resultant devices |
| 02/23/1995 | WO1995005675A1 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 02/23/1995 | CA2167065A1 Edge-connecting printed circuit board |
| 02/22/1995 | EP0639940A1 Control circuit for a motor vehicle |
| 02/22/1995 | EP0576560A4 Low noise optical probe. |
| 02/22/1995 | CN1099191A Thin film electrical component |
| 02/21/1995 | US5391922 Semiconductor element module |
| 02/21/1995 | US5391604 A blends consisting of a metal filler, a volatile liquid as a carriers for dispensing through dies, small thermoplastic resins particle forming a void-free bonding; high bonding strength, thermoplastic resin can be reuseable |
| 02/21/1995 | US5391435 Laminate comprising metal layer and interpenetrating polymer network composed of cyclic polyallyl compound polymerized and crosslinked in presence of free radical initiator, and epoxy resin crosslinked with polyhydric phenol |
| 02/21/1995 | US5391397 Method of adhesion to a polyimide surface by formation of covalent bonds |
| 02/21/1995 | US5391253 Apparatus for forming laminates |
| 02/21/1995 | US5390870 Recording medium cassette and a recording/reproducing apparatus |
| 02/21/1995 | US5390670 Flexible printed circuit sensor assembly for detecting optical pulses |
| 02/21/1995 | US5390412 Method for making printed circuit boards |
| 02/16/1995 | WO1995005061A2 Method for producing a conductive circuit |
| 02/16/1995 | WO1995005005A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 02/16/1995 | WO1995004786A2 Adhesive paste containing polymeric resin |
| 02/16/1995 | DE4425803A1 Printed circuit board |
| 02/16/1995 | CA2168427A1 Adhesive paste containing polymeric resin |
| 02/15/1995 | EP0638931A2 Multi-chip module |
| 02/15/1995 | EP0638911A1 A connection support for ignition coils |
| 02/15/1995 | EP0638225A1 Feedthrough via connection method and apparatus |
| 02/15/1995 | EP0638094A1 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content. |
| 02/15/1995 | EP0375776B1 Motor drive unit |
| 02/15/1995 | CN1098824A Connecting equipment used for signal transmiting apparatus |
| 02/14/1995 | US5390081 Fault-tolerant power distribution system for rack-mounted hardware |
| 02/14/1995 | US5390079 Tape carrier package |
| 02/14/1995 | US5390078 Apparatus for using an active circuit board as a heat sink |
| 02/14/1995 | US5389814 Electrically blowable fuse structure for organic insulators |
| 02/14/1995 | US5389743 Rivet design for enhanced copper thick-film I/O pad adhesion |
| 02/14/1995 | US5389741 Flat cable and connection device and method for the same |
| 02/14/1995 | US5389735 Vertically twisted-pair planar conductor line structure |
| 02/14/1995 | US5389408 Method for curing metal particles into continuous conductors |
| 02/14/1995 | US5389403 Applying aqueous composition of water soluble thermoplastic resin, water insoluble polymer dispersion, glycol drying retarder, conductive particles to substrate, thermally curing |
| 02/14/1995 | US5389191 Mounting apparatus for deploying an electronic component mounts formed on a tape carrier |
| 02/14/1995 | US5389010 Connector for electrical components |
| 02/14/1995 | US5388468 Solder wave parameters analyzer |
| 02/09/1995 | WO1995004286A1 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly |
| 02/09/1995 | WO1995004100A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
| 02/09/1995 | DE4427994A1 Metallbasisplatine und elektronische Einrichtung, die diese verwendet Metal base circuit board, and electronic device that uses this |
| 02/09/1995 | DE4417586A1 Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern Family of removable hybrid arrays of different sizes with microwave bandwidth connectors |
| 02/09/1995 | DE4326506A1 Electrical appliance, in particular a switching device or controller for motor vehicles |
| 02/09/1995 | DE4326104A1 Electrical assembly |
| 02/09/1995 | DE4325980A1 Device for making common electrical contact between a plurality of units, which can be excited (energised) electrically, of internal combustion engines |
| 02/09/1995 | CA2143760A1 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly |
| 02/08/1995 | EP0637828A2 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics of the same |
| 02/08/1995 | EP0637776A1 Photosensitive resin composition and process for forming relief pattern therefrom |
| 02/08/1995 | EP0637638A1 Tungsten metallization of CVD diamond |
| 02/08/1995 | CN1098588A Multilayered metallic printed board and molded module |
| 02/07/1995 | US5388099 Backplane wiring for hub in packet data communications system |
| 02/07/1995 | US5388029 Semiconductor chip carrier capable of stably mounting a semiconductor chip |
| 02/07/1995 | US5387816 Hybrid integrated circuit device |
| 02/07/1995 | US5387814 Integrated circuit with supports for mounting an electrical component |
| 02/07/1995 | US5387762 Resin-packaged electronic component having bent lead terminals |
| 02/07/1995 | US5387560 Glasses for substrates intended for electronics and resultant products |
| 02/07/1995 | US5387495 Coating top surface of substrate with insulating layer of tetrafluoroethylene, depositing conductive seed layer, lines, patterned layer of posts, removing portions of seed layer, depositing liquid fluorinated hydrocarbon dielectric |
| 02/07/1995 | US5387306 Manufacturing integrated circuit cards |
| 02/07/1995 | US5387131 Network conditioning insert |
| 02/07/1995 | US5387126 Configurable circuit substrate |
| 02/07/1995 | US5387111 Circuit board assembly |
| 02/07/1995 | US5386641 Taping alignment tool for printed circuit boards |
| 02/07/1995 | US5386627 Method of fabricating a multi-layer integrated circuit chip interposer |
| 02/07/1995 | CA2001982C Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same |
| 02/03/1995 | CA2117404A1 Method and apparatus for aligning and attaching a surface mount component |
| 02/02/1995 | WO1995003684A1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprising same |
| 02/02/1995 | WO1995003683A1 Space-saving memory module |
| 02/02/1995 | WO1995003168A1 Circuit board material with barrier layer |
| 02/02/1995 | DE4425726A1 Electronic device |
| 02/02/1995 | DE4325499A1 Externally fitted controller |
| 02/02/1995 | CA2167534A1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprinsing same |
| 02/01/1995 | EP0637079A1 Upgradable multi-chip module |
| 02/01/1995 | EP0637032A2 Parallel processor structure and package |
| 02/01/1995 | EP0637031A2 Parallel processor and method of fabrication |
| 02/01/1995 | EP0637030A2 Solder bonded parallel package structure and method of solder bonding |
| 01/31/1995 | US5386430 Excimer laser processing method and apparatus |
| 01/31/1995 | US5386343 Printed circuit board |
| 01/31/1995 | US5386339 Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
| 01/31/1995 | US5386309 Liquid crystal display module with positioning marks on circuit substrate and heat seal |
| 01/31/1995 | US5386087 Printed circuit board having U-shaped solder mask layer separating respective contacts |
| 01/31/1995 | US5386085 Multilayer electrical circuit structure including partially embedded pins for external connection |
| 01/31/1995 | US5385289 Embedded features for registration measurement in electronics manufacturing |
| 01/31/1995 | US5384955 Method for replacing IC chip package interposer |
| 01/31/1995 | US5384953 Structure and a method for repairing electrical lines |
| 01/31/1995 | CA1334132C Manufacture of low expansion composites having high electrical and heat conductivity |
| 01/26/1995 | WO1995002627A1 Heat-resistant polyimide blends and laminates |
| 01/26/1995 | DE4324214A1 Electrical appliance |
| 01/26/1995 | DE4320316C1 Printed circuit board, multilayer printed circuit board inner layer and multilayer printed circuit board as well as a method for producing the same |
| 01/26/1995 | CA2144324A1 Heat-resistant polyimide blends and laminates |
| 01/26/1995 | CA2143685F Pcmcia standard memory card package |
| 01/25/1995 | EP0635995A1 Flexible circuit for connecting printed circuit |
| 01/25/1995 | EP0635871A2 High heat conductive insulated substrate and method of manufacturing the same |
| 01/25/1995 | EP0635585A1 Process for producing a thick and strongly adhering metallic layer on sintered aluminium nitride and metallised product thus obtained |
| 01/25/1995 | EP0635192A1 Circuit board connections |
| 01/25/1995 | EP0635150A1 Universal bus motherboard using a universal-to-specific bus translator card |
| 01/25/1995 | EP0489118B1 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 01/24/1995 | US5384690 Flex laminate package for a parallel processor |
| 01/24/1995 | US5384484 Electronic read-only memory module |
| 01/24/1995 | US5384435 Electronic device |
| 01/24/1995 | US5384433 Printed circuit structure including power, decoupling and signal termination |
| 01/24/1995 | US5384432 Two-layered tape lead wire for magnetic head |