| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/11/1996 | EP0730528A1 Alignment systems |
| 09/11/1996 | CN1130958A 多芯片模块 A multi-chip module |
| 09/11/1996 | CN1130955A Electrical assembly |
| 09/11/1996 | CN1130807A Lead frame and manufacturing method thereof |
| 09/10/1996 | US5555316 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| 09/10/1996 | US5555116 Liquid crystal display having adjacent electrode terminals set equal in length |
| 09/10/1996 | US5554827 Method of and apparatus for determining whether a digitizer coordinate detecting tablet is properly operating and/or writing adjustment data into a memory associated with the tablet |
| 09/10/1996 | US5554825 Flexible cable with a shield and a ground conductor |
| 09/10/1996 | US5554806 Physical-quantity detecting device |
| 09/10/1996 | US5554305 Applying and ablating specified material over a substrate |
| 09/10/1996 | CA2171516A1 Resin composition for electroless metal deposition and method for electroless metal deposition |
| 09/08/1996 | CA2162941A1 Method and apparatus to contact plating bar without exposing contact copper or rework of the contact pad plating |
| 09/06/1996 | WO1996027282A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 09/06/1996 | WO1996027280A1 Thermally and electrically enhanced ball grid package |
| 09/06/1996 | CA2189233A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 09/05/1996 | DE19607974A1 Wiring arrangement switching body with associated circuit board and body |
| 09/04/1996 | EP0730394A1 Thermoformed three dimensional wiring module |
| 09/04/1996 | EP0730275A2 Printed circuit board comprising a plurality of integrated circuits |
| 09/04/1996 | EP0730165A2 Integrated microwave circuit board for millimetric wavelengths |
| 09/04/1996 | EP0730159A2 Electromagnetic radiation measuring apparatus |
| 09/04/1996 | EP0729839A1 Thermal printing head, and clip type terminal lead and cover used for the same |
| 09/04/1996 | EP0729695A1 Junction panel for control unit |
| 09/04/1996 | EP0729669A1 Dual-sided push-pull amplifier |
| 09/04/1996 | EP0729652A1 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/04/1996 | EP0729487A1 Ptfe reinforced compliant adhesive and method of fabricating same |
| 09/04/1996 | EP0729484A1 Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
| 09/04/1996 | EP0640160B1 Process for preparing strong aromatic polyamide papers of high porosity |
| 09/04/1996 | EP0638094B1 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content |
| 09/04/1996 | CN1130441A Integrated circuit device |
| 09/04/1996 | CN1130291A Method for producing rotary print conductor and method for producing raw sheet in laminate |
| 09/04/1996 | CN1032723C 表面安装型片状电容器 Surface-mount chip capacitors |
| 09/04/1996 | CN1032721C Resistance metal layers and method for making same |
| 09/04/1996 | CA2168285A1 Thermoformed three dimensional wiring module |
| 09/03/1996 | US5552965 Control apparatus having a compact and accessible arrangement of printed circuit boards |
| 09/03/1996 | US5552963 Bus communication system for stacked high density integrated circuit packages |
| 09/03/1996 | US5552951 Semiconductor package electrostatic discharge damage protection |
| 09/03/1996 | US5552752 Microwave vertical interconnect through circuit with compressible conductor |
| 09/03/1996 | US5552675 High temperature reaction apparatus |
| 09/03/1996 | US5552638 Semiconductors |
| 09/03/1996 | US5552567 Printed circuit board having a plurality of circuit board patterns |
| 09/03/1996 | US5552459 Highly filled epoxy casting resin compositions |
| 09/03/1996 | US5552249 Method for making a mask useful in the conformal photolithographic manufacture of patterned curved surfaces |
| 09/03/1996 | US5552232 Aluminum nitride body having graded metallurgy |
| 09/03/1996 | US5552210 Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant |
| 09/03/1996 | US5552209 Internally damped circuit articles |
| 09/03/1996 | US5552107 Aluminum nitride body having graded metallurgy |
| 09/03/1996 | US5551626 Providing conductive paste between metal foils containing metal oxide remover |
| 09/03/1996 | CA2056740C Via capacitors within multi-layer 3-dimensional structures/substrates |
| 08/29/1996 | DE19606862A1 Printed circuit board with mfg. method |
| 08/29/1996 | DE19518518C1 Control device for automobile anti-locking braking system |
| 08/29/1996 | CA2170436A1 Surface mount electrical contacts |
| 08/28/1996 | EP0729183A2 Thin packaging of multi-chip modules with enhanced thermal/power management |
| 08/28/1996 | EP0728789A2 Epoxy resin compound for use in laminated sheet |
| 08/28/1996 | EP0728788A1 Process for producing photosensitive resin and liquid photosensitive resin composition |
| 08/28/1996 | EP0728716A1 Dielectric ceramic |
| 08/28/1996 | CN1129993A A horizontally twisted-pair planar conductor line structure |
| 08/28/1996 | CN1129891A Miniature speeching body |
| 08/28/1996 | CN1129843A Manufacturing method and manufacturing apparatus for ceramic electronic components |
| 08/27/1996 | US5550325 Printed-circuit board including circuit pattern having location to be cut if necessary |
| 08/27/1996 | US5550282 Curable composition comprising partially trimerized prepolymer of aromatic dicyanate ester |
| 08/27/1996 | US5550083 Process of wirebond pad repair and reuse |
| 08/27/1996 | US5549808 Covering connectors with protective metal layer before etching |
| 08/27/1996 | CA2051606C Multi-layer wiring board |
| 08/25/1996 | CA2166925A1 Thin packaging of multi-chip modules with enhanced thermal/power management |
| 08/22/1996 | WO1996025838A1 Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 08/22/1996 | WO1996025763A2 Organic chip carriers for wire bond-type chips |
| 08/22/1996 | WO1996025463A1 Polyamide 4.6 composition |
| 08/22/1996 | WO1996025263A2 Process for bonding a flexible substrate to a chip |
| 08/22/1996 | DE19504967A1 Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip A method of connecting a flexible substrate having a chip |
| 08/21/1996 | EP0727931A2 Electronic control module |
| 08/21/1996 | EP0727928A1 Electronic assembly having improved thermal characteristics |
| 08/21/1996 | EP0727926A2 Multilayer printed writing board and method of manufacturing such a board |
| 08/21/1996 | EP0727841A2 Branch junction box |
| 08/21/1996 | EP0727819A2 Stucked arranged semiconductor device and manufacturing method for the same |
| 08/21/1996 | EP0727045A1 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 08/21/1996 | EP0692136A4 High strength conductive polymers |
| 08/21/1996 | EP0663142B1 Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards |
| 08/21/1996 | EP0546133B1 A method for preparing aryl ketones |
| 08/21/1996 | CN1129340A Thick film conductor compositions with improved adhesion |
| 08/21/1996 | CN1129339A Electrically conductive paste materials and applications |
| 08/21/1996 | CN1129170A Single side copper-clad laminate |
| 08/21/1996 | CN1129168A Carbon black-filled foam and process of preparing same |
| 08/20/1996 | US5548734 Equal length symmetric computer bus topology |
| 08/20/1996 | US5548488 Electrical componet mounting system |
| 08/20/1996 | US5548226 Fast transmission line implemented with receiver, driver, terminator and IC arrangements |
| 08/20/1996 | US5548087 Molded plastic packaging of electronic devices |
| 08/20/1996 | US5548034 A blend of fluorine containing cyanate and fluorine containing poly(arylene ether); heat curable |
| 08/20/1996 | US5547758 Insulating material |
| 08/20/1996 | US5547530 Method of manufacturing a ceramic substrate |
| 08/20/1996 | US5546655 Method of applying flex tape protective coating onto a flex product |
| 08/20/1996 | US5546654 Vacuum fixture and method for fabricating electronic assemblies |
| 08/20/1996 | CA2060979C Ceramic composite material and process for producing the same |
| 08/15/1996 | WO1996024943A1 Battery pack having a ruggedized thermal fuse |
| 08/15/1996 | WO1996024938A1 Composite conductive powder, conductive paste, method of producing conductive paste, electric circuit and method of fabricating electric circuit |
| 08/14/1996 | EP0726697A2 Improved printed wiring board and method for preparing the same |
| 08/14/1996 | EP0726620A2 Apparatus for providing controlled impedance in an electrical contact |
| 08/14/1996 | EP0725981A1 Component stacking in multi-chip semiconductor packages |
| 08/14/1996 | DE19504378A1 Multiple layer ceramic substrate for electronic circuit |
| 08/14/1996 | CN1128908A Device for controlling motor vehicle |
| 08/13/1996 | US5546297 Apparatus for modifying an electrical signal |