Patents for H05K 1 - Printed circuits (98,583)
07/1996
07/16/1996US5536579 Design of high density structures with laser etch stop
07/16/1996US5536466 Process for manufacturing transparent conductive film wiring board
07/16/1996US5536362 Wire interconnect structures for connecting an integrated circuit to a substrate
07/11/1996WO1996021245A1 Electrical circuit suspension system
07/11/1996WO1996012751A3 Low voc laminating formulations
07/10/1996EP0720768A1 A horizontally twisted-pair planar conductor line structure
07/10/1996CN1126369A Production of semiconductor units
07/09/1996US5535100 Snap-together/quick-release fastening assembly for supporting a circuit card
07/09/1996US5535098 Electrical device, particularly switching and control device for motor vehicles
07/09/1996US5534727 Semiconductor device
07/09/1996US5534667 Printed circuit board having zig-zag contact arrangement
07/09/1996US5534666 Multi-layer wiring board having a base block and a stacking block connected by an adhesive layer
07/09/1996US5534356 Anodized aluminum substrate having increased breakdown voltage
07/09/1996US5534331 Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant
07/09/1996US5534209 Method for manufacturing a liquid crystal polymer film and a liquid crystal polymer film made thereby
07/09/1996US5534128 Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board
07/09/1996US5533904 For an inkjet printer
07/09/1996US5533901 Electrical connector with contact alignment member
07/09/1996US5533889 Apparatus for in-situ green sheet slitting
07/09/1996US5533665 Method of making a printed circuit board with adaptor pins
07/09/1996US5533663 Solder wave measurement device
07/09/1996CA2042823C Multilayer interconnection substrate
07/09/1996CA1338436C Dielectric ceramic composition
07/04/1996WO1996020242A1 Curable resin compositions
07/04/1996DE4438449A1 Direct contacting method for component to carrier
07/03/1996EP0720419A1 A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same
07/03/1996EP0720232A1 Multi-chip module
07/03/1996EP0720123A2 Non-contact type IC card and method and apparatus for manufacturing the same
07/03/1996EP0719825A2 Phosphorus-modified stabilized epoxy resins and their use
07/03/1996EP0719442A1 Electrical assembly comprising a ptc resistive element
07/03/1996EP0719353A1 Glass fabric produced with zero-twist yarn
07/03/1996EP0719299A1 Adhesive paste containing polymeric resin
07/02/1996US5532954 Single in-line memory module
07/02/1996US5532910 Hybrid integrated circuit and process for producing same
07/02/1996US5532907 Computer system with improved power bus
07/02/1996US5532906 Wiring substrate
07/02/1996US5532705 Wrist-mounted-type antenna device and apparatus having the antenna device
07/02/1996US5532667 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
07/02/1996US5532658 Mounting structure for electronic component
07/02/1996US5532517 Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas
07/02/1996US5532516 Semiconductor device
07/02/1996US5532105 Having good adhesion to plated copper
07/02/1996US5531945 Process for the production of base board for printed wiring
07/02/1996US5531601 Fabric battery pouch
07/02/1996US5531390 Method of winding a coil on a chuck having guide pins
07/02/1996US5531020 Method of making subsurface electronic circuits
07/02/1996CA2073911C Stepped multilayer interconnection apparatus and method of making the same
07/02/1996CA2055413C Printed circuit board having electromagnetic wave shield layer and self-contained printed resistor
07/02/1996CA2047621C Resin composition for image formation
06/1996
06/27/1996WO1996019912A1 An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus
06/27/1996WO1996019829A1 Device for superheating steam
06/27/1996DE4446594A1 Elektrisches Gerät Electrical equipment
06/27/1996DE4446566A1 Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement Multi-pole surface mount electronic component
06/27/1996DE4445129A1 PCB-based electrical device e.g. for switching motor vehicle heated rear window on and off
06/26/1996EP0719079A1 Printed circuit board
06/26/1996EP0719078A2 Printed circuit assembly having improved reference plane isolation
06/26/1996EP0718930A2 Backplane arrangement for electrical equipment
06/26/1996EP0718905A1 Surface mountable microwave IC package
06/26/1996EP0718878A2 Manufacturing process of conductors on a substrate with depressions
06/26/1996EP0718696A2 A photosensitive polyimide composition
06/26/1996EP0717749A1 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
06/26/1996CN1125218A Novel aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition
06/25/1996US5530814 Bi-directional crossbar switch with control memory for selectively routing signals between pairs of signal ports
06/25/1996US5530623 High speed memory packaging scheme
06/25/1996US5530291 Electronic package assembly and connector for use therewith
06/25/1996US5530289 Semiconductor device and method of manufacturing the same
06/25/1996US5530288 Passive interposer including at least one passive electronic component
06/25/1996US5530286 Semiconductor device
06/25/1996US5530285 Low-impedance surface-mount device
06/25/1996US5529957 Method for blocking contamination and stabilizing chip capacitor during attachment using a tape strip
06/25/1996US5529852 Containing aluminum oxide, calcium oxide, tungsten; adhesion, airtightness, thermoconductivity
06/25/1996US5529836 Multilayer article comprising a toughened polycyanurate
06/25/1996US5529741 Controlling the coefficient of thermal expansion of liquid crystalline polymer based components
06/25/1996US5529441 Drill coordinate optimization for multi-layer printed circuit board
06/25/1996US5528826 Method of constructing high yield, fine line, multilayer printed wiring board panel
06/25/1996US5528825 Method of manufacture of hybrid integrated circuit
06/25/1996CA2166037A1 Method of forming conductive paths on a substrate having depressions
06/25/1996CA2070308C Process of producing multiple-layer glass-ceramic circuit board
06/25/1996CA2044508C Method of forming metallized layer on aluminum nitride base material
06/20/1996WO1996018589A1 Substrate of a ceramic material
06/19/1996EP0717587A2 Multilayer printed circuit board
06/19/1996EP0717586A1 Process to decrease the strength of an electric field produced by a high voltage conductive path on a printed circuit board
06/19/1996EP0717443A1 Integrated circuit device
06/19/1996EP0716918A2 Adhesiveless aromatic polyimide laminate
06/19/1996EP0587634B1 Method of manufacturing a multilayer printed wire board
06/19/1996CN1124942A Hybrid junction box
06/19/1996CN1124912A Photosensitive resin composition and method for using the same in manufacture of circuit boards
06/18/1996USRE35278 Polypyrrole
06/18/1996US5528463 Low profile sockets and modules for surface mountable applications
06/18/1996US5528461 Printed circuit assembly having component locating features
06/18/1996US5528457 Method and structure for balancing encapsulation stresses in a hybrid circuit assembly
06/18/1996US5528403 Flat type display device having flexible wiring board and common wiring board bonded to display panel
06/18/1996US5528001 Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
06/18/1996US5527999 Multilayer conductor for printed circuits
06/18/1996US5527998 Flexible multilayer printed circuit boards and methods of manufacture
06/18/1996US5527997 Conductor for a flat cable, and manufacturing method and equipment therefor
06/18/1996US5527838 Toughened polycyanurate resins containing particulates
06/18/1996US5527620 Reduced gradient of tensile and compressive strength; durability
06/18/1996US5527604 Metal base board and electronic equipment using the same
06/18/1996US5527593 Structures fabricated from toughened polycyanurate