| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/24/1996 | CN1121055A Process for a surface treatment of a glass fabric |
| 04/23/1996 | US5510958 Electronic circuit module having improved cooling arrangement |
| 04/23/1996 | US5510956 Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted on a wiring layer |
| 04/23/1996 | US5510594 Method of manufacturing thick-film circuit component |
| 04/23/1996 | US5510580 Printed circuit board with landless blind hole for connecting an upper wiring pattern to a lower wiring pattern |
| 04/23/1996 | US5510497 Polyalkenamer thermosetting resin monomer |
| 04/23/1996 | US5510395 Poly(4,4-oxydiphenylenepyromellitimide) |
| 04/23/1996 | US5509599 Method for securing a hybrid circuit on a printed circuit board |
| 04/23/1996 | US5509597 Apparatus and method for automatic monitoring and control of a soldering process |
| 04/23/1996 | US5509553 Direct etch processes for the manufacture of high density multichip modules |
| 04/23/1996 | US5509200 Method of making laminar stackable circuit board structure |
| 04/23/1996 | US5509197 Method of making substrate edge connector |
| 04/23/1996 | US5509196 Method of fabricating a flex laminate package |
| 04/21/1996 | CA2159234A1 Electrically conductive paste materials and applications |
| 04/18/1996 | WO1996011105A1 Thermal management for additive printed circuits |
| 04/18/1996 | DE4436644A1 Prodn. of metallised ceramic substrate printed circuit board |
| 04/18/1996 | DE4436523A1 Method for manufacturing sealed electronic revolution counter |
| 04/17/1996 | EP0707038A1 Polybutadiene and polyisopropene based thermosetting compositions and method of manufacture thereof |
| 04/17/1996 | EP0706678A1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material |
| 04/17/1996 | EP0600052B1 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points |
| 04/17/1996 | EP0543979B1 A device comprising laminated conductive patterns and easily selectable dielectrics |
| 04/16/1996 | US5508885 IC card having improved heat dissipation |
| 04/16/1996 | US5508781 Printed circuit board |
| 04/16/1996 | US5508563 Semiconductor assembly having laminated semiconductor devices |
| 04/16/1996 | US5508562 Outer electrode structure for a chip type electronic part appropriate for reflow soldering |
| 04/16/1996 | US5508558 High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion |
| 04/16/1996 | US5508556 Leaded semiconductor device having accessible power supply pad terminals |
| 04/16/1996 | US5508328 Curing epoxy resins using dicy, imidazole and acid |
| 04/16/1996 | US5508089 Multiple substrate and process for its production |
| 04/16/1996 | US5507903 Process for producing two-layered tape for tab |
| 04/16/1996 | US5507896 Method of manufacturing ceramic laminated compact |
| 04/16/1996 | US5507403 Process for producing an electronic part and the electronic part produced by the process |
| 04/16/1996 | CA2044844C Ignition circuit module and method of manufacture |
| 04/16/1996 | CA2028244C Aluminum nitride powder, sintered body and production thereof |
| 04/11/1996 | WO1996010797A1 A method for applying a barcode |
| 04/11/1996 | WO1996010611A1 Surface-treated filler and composition containing said filler |
| 04/11/1996 | WO1996010596A1 Hydrogenated ring-opening polymer |
| 04/11/1996 | WO1996010490A1 Thermal printing head, and clip type terminal lead and cover used for the same |
| 04/11/1996 | DE4435670A1 Circuit board through-hole, and blind hole, drilling method |
| 04/10/1996 | EP0706310A1 Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
| 04/10/1996 | EP0706301A2 Small-sized sound generator |
| 04/10/1996 | EP0705862A1 Poly(amic acid) solution, use thereof and polyimide film or polyimide-coated material obtained therefrom |
| 04/10/1996 | EP0705484A2 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element |
| 04/10/1996 | EP0705479A1 Electrically conductive pastes |
| 04/10/1996 | EP0705183A1 Built-on control device |
| 04/10/1996 | CN1120100A Laminate base stock |
| 04/09/1996 | US5507038 Heat seal connector with integral parting agent |
| 04/09/1996 | US5506991 Printer port adapter with overlaid one-wire interface for electronic key |
| 04/09/1996 | US5506755 Multi-layer substrate |
| 04/09/1996 | US5506754 Thermally matched electronic components |
| 04/09/1996 | US5506514 Electrical interconnect using particle enhanced joining of metal surfaces |
| 04/09/1996 | US5506447 Hybrid integrated circuit |
| 04/09/1996 | US5506445 Optical transceiver module |
| 04/09/1996 | US5506313 Phosphorus-containing flameproofing agents for epoxy resin materials |
| 04/09/1996 | US5506059 Metallic films and articles using same |
| 04/09/1996 | US5506049 Dielectric substrate materials in laminar electrical circuits |
| 04/09/1996 | US5505809 Method of preparing a plurality of ceramic green sheets having conductor films thereon |
| 04/09/1996 | US5505321 Fabrication multilayer combined rigid/flex printed circuit board |
| 04/09/1996 | US5504993 Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders |
| 04/09/1996 | US5504986 Method of manufacturing collinear terminated transmission line structure with thick film circuitry |
| 04/09/1996 | CA2065537C Process for manufacturing multi-layer glass ceramic substrate |
| 04/04/1996 | WO1996010326A1 Printed wiring board, method of producing the same and electronic devices |
| 04/04/1996 | WO1996010261A1 Multi-layer electrical circuit board |
| 04/04/1996 | DE4434846A1 Ceramic mould for mfr. of electronic circuits or heat-sink structures |
| 04/03/1996 | EP0704925A1 Composite high frequency apparatus and method for forming same |
| 04/03/1996 | EP0704897A2 Semiconductor device |
| 04/03/1996 | EP0704864A2 Resistor on a ceramic circuit board |
| 04/03/1996 | EP0704145A1 Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern |
| 04/03/1996 | CN1119903A A circuit board arrangement including shielding grids, and constructing thereof |
| 04/03/1996 | CN1119583A Method of producing laminate |
| 04/02/1996 | US5504373 Semiconductor memory module |
| 04/02/1996 | US5504354 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits |
| 04/02/1996 | US5504283 Key switch device |
| 04/02/1996 | US5504277 Solder ball array |
| 04/02/1996 | US5504273 Fixing means for flat circuit units and the flat circuit units used therefor |
| 04/02/1996 | US5504134 Attenuation of polymer substrate degradation due to ultraviolet radiation |
| 04/02/1996 | US5503787 Heat treating green laminate of glass and ceramic, oxidizing, reducing, firing and densification |
| 04/02/1996 | US5503777 Thixotropic conductive paste |
| 04/02/1996 | US5503122 Engine components including ceramic-metal composites |
| 04/02/1996 | US5502893 Method of making a printing wiring board |
| 04/02/1996 | CA2046615C A method of manufacturing a substrate for placement of electrical and/or electronic components |
| 03/28/1996 | WO1996009748A1 Planar cable array |
| 03/28/1996 | WO1996009747A1 High capacitance sheet adhesives and process for making the same |
| 03/28/1996 | WO1996009746A1 Compliant interface for a semiconductor chip |
| 03/28/1996 | WO1996009660A1 High power radio frequency divider/combiner |
| 03/28/1996 | WO1996009339A1 Ptfe reinforced compliant adhesive and method of fabricating same |
| 03/28/1996 | WO1996009158A1 Foiled ud-prepreg and pwb laminate prepared therefrom |
| 03/28/1996 | CA2200314A1 Foiled ud-prepreg and pwb laminate prepared therefrom |
| 03/28/1996 | CA2197887A1 High power radio frequency divider/combiner |
| 03/27/1996 | EP0703477A1 Connection system between daughter boards |
| 03/27/1996 | EP0702806A1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
| 03/27/1996 | EP0413008B1 Electrical connector having latch means |
| 03/27/1996 | CN1119447A Phosphorus-modified epoxy resins, process for producing them and their use |
| 03/27/1996 | CN1119446A Phosphorus-modified epoxy resins, process for producing them and their use |
| 03/27/1996 | CN1119445A Epoxy resin mixtures |
| 03/27/1996 | CN1119444A Epoxy resin mixtures |
| 03/27/1996 | CN1119402A Dual substrate package assembly for being electrically coupled to a conducting member |
| 03/27/1996 | CN1119352A Microwave oscilator and making of same |
| 03/27/1996 | CN1119343A Method for producing semiconductor device |
| 03/27/1996 | CN1119342A Electronic package with multilevel connections |