Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1995
10/10/1995US5456018 Alignment system for planar electronic devices arranged in parallel fashion
10/05/1995DE19510988A1 Schaltungsträger Circuit board
10/04/1995EP0675674A1 Film circuit metal system for use with bumped IC packages
10/04/1995EP0675673A2 Reinforcement for flexible printed circuit board and reinforced flexible circuit board
10/04/1995EP0675569A1 Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making
10/04/1995EP0675539A2 Ball grid package with integrated passive circuit elements
10/04/1995EP0675537A2 Protective electronic coatings using filled polysilazanes
10/04/1995EP0675532A2 Method for forming solder bump in IC mounting board
10/04/1995EP0675213A1 Electrolytic copper foil for printed wiring boards and process for producing the same
10/04/1995EP0675131A1 Fire retardant epoxy resin composition
10/04/1995EP0674827A1 Circuit-board device
10/04/1995EP0674589A1 Electrical insulation from biaxially oriented penbb film
10/04/1995EP0478562B1 Snap fit contact assembly
10/04/1995CN1109698A Metallic film resistor having fusing function and method for its manufacture
10/04/1995CN1109642A High performance electrical connector
10/03/1995US5455742 Direct circuit board connection
10/03/1995US5455741 Holder for mounting an electronic element
10/03/1995US5455740 Bus communication system for stacked high density integrated circuit packages
10/03/1995US5455734 Insert device for electrical relays, solenoids, motors, controllers, and the like
10/03/1995US5455546 High power radio frequency divider/combiner
10/03/1995US5455461 Semiconductor device having reformed pad
10/03/1995US5455453 Copper or copper alloy as matrix, insulating film, multilayer film; noncracking, nonpeeling
10/03/1995US5455446 Leaded semiconductor package having temperature controlled lead length
10/03/1995US5455393 Multilayered printed wiring board and method of manufacturing the same
10/03/1995US5455384 High frequency module and method of producing the same
10/03/1995US5455383 Shield flat cable
10/03/1995US5455064 Process for fabricating a substrate with thin film capacitor and insulating plug
10/03/1995US5454928 Melting excess plated metal filling substrate holes to eliminate voids then lapping to level the surfaces
10/03/1995US5454927 Ceramic substrates with highly conductive metal vias
10/03/1995US5454926 Electrodeposited copper foil
10/03/1995US5454738 Electrical connector having reduced cross-talk
10/03/1995US5454506 Structure and process for electro/mechanical joint formation
10/03/1995US5454161 Through hole interconnect substrate fabrication process
10/03/1995US5454159 Method of manufacturing I/O terminals on I/O pads
10/03/1995CA1337171C Resin laminates and a process for production thereof
09/1995
09/28/1995WO1995026123A1 Method of preparing foil printed circuit boards or semi-finished products for foil printed circuit boards
09/28/1995WO1995026122A1 Foil printed circuit boards and method of producing the same
09/28/1995WO1995026064A1 Method and apparatus for integrated circuit voltage regulation
09/28/1995WO1995026036A1 Printed circuit board relay with insert connections
09/28/1995DE4410285A1 Leiterplattenrelais mit Einpreßanschlüssen PCB relay with press
09/28/1995DE19509441A1 Hybrid integrated circuit
09/28/1995CA2186116A1 Printed circuit board relay with insert connections
09/28/1995CA2162398A1 Filter substrate for connector and method for production thereof
09/27/1995EP0674473A2 Direct circuit board connection
09/27/1995EP0674472A2 Electronic package assembly and connector for use therewith
09/27/1995EP0673900A2 Carbon/carbon composites and electrical apparatus containing the same
09/26/1995US5453728 Rheostatic device in a switching arrangement for electric tools
09/26/1995US5453582 Circuit board to be precoated with solder layers and solder circuit board
09/26/1995US5453581 Pad arrangement for surface mount components
09/26/1995US5453580 Vibration sensitive isolation for printed circuit boards
09/26/1995US5453161 Polyamic acid to polyimide conversion by microwave heating
09/26/1995US5453148 Adhesive for connecting a circuit member to a substrate
09/26/1995CA2077486C Electrical connector circuit wafer
09/21/1995WO1995025422A1 Mechanical support and electrical interconnection device
09/21/1995WO1995025346A1 Electric connections arranged in a high-density grid
09/21/1995DE4408356A1 Circuit adaptor device
09/21/1995DE19509202A1 Electrically conducting connection
09/21/1995DE19509173A1 Masse aus einem Epoxygruppen enthaltenden Cycloolefinharz Mass of an epoxy group-containing cyclo-olefin
09/20/1995EP0673192A1 Device for mechanical support and for electrical interconnections
09/20/1995EP0673189A1 Interconnection of opposite sides of a circuit board
09/20/1995EP0673067A2 High-frequency circuit with integrated logic circuit
09/20/1995EP0673023A1 Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board
09/20/1995EP0673019A1 Disk drive suspension system
09/20/1995EP0672639A1 Paste for closing holes in ceramic substrates
09/20/1995EP0672500A2 Polymeric mask for sandblasting and method for its use
09/20/1995EP0672333A1 Compliant stacking connector for printed circuit boards
09/20/1995EP0672309A1 High-density electrical interconnect system.
09/20/1995EP0558547B1 Process for the production of copper-coated substrates
09/20/1995EP0458984B1 Novel resin, process for preparing the same, and composition comprising the same
09/20/1995CN1108859A Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminsls even when the electrode terminals have a fine pitch
09/20/1995CN1108813A Surface mount chip package
09/19/1995US5452182 Flexible high density interconnect structure and flexibly interconnected system
09/19/1995US5451885 Interconnect stress test coupon
09/19/1995US5451722 Printed circuit board with metallized grooves
09/19/1995US5451721 Multilayer printed circuit board and method for fabricating same
09/19/1995US5451720 Circuit board thermal relief pattern having improved electrical and EMI characteristics
09/19/1995US5451716 Resin-packaged electronic component having bent lead terminals
09/19/1995US5451637 Organosilicon compositions prepared from unsaturated elastomeric polymers
09/19/1995US5451629 Fast bonding electrically conductive composition and structures
09/19/1995CA1337030C Solder connector device
09/14/1995WO1995024821A1 Fabrication multilayer combined rigid/flex printed circuit board
09/14/1995WO1995024743A1 Transmission line and method of designing same
09/14/1995WO1995024734A1 Technique for producing interconnecting conductive links
09/14/1995WO1995024733A1 Prefabricated semiconductor chip carrier
09/14/1995WO1995024730A2 Apparatus having inner layers supporting surface-mount components
09/14/1995WO1995024729A2 Modular architecture for high bandwidth computers
09/14/1995CA2160257A1 Transmission line and method of designing same
09/13/1995EP0671705A2 Manufacturing process for a contactless card and contactless card
09/13/1995EP0671437A1 Curable resin composition
09/13/1995EP0671041A1 Detection tag.
09/13/1995EP0670779A1 A system of electronic laminates with improved registration properties
09/13/1995EP0662278A4 Hermetically sealed circuit modules having conductive cap anchors.
09/13/1995CN1108439A Surface mount connector
09/12/1995US5450290 Printed circuit board with aligned connections and method of making same
09/12/1995US5450289 Semiconductor package and a printed circuit board applicable to its mounting
09/12/1995US5450288 Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate
09/12/1995US5450286 Printed circuit having a dielectric covercoat
09/12/1995US5450263 Electronic device
09/12/1995US5450222 Electrical connection of devices incorporating multiple liquid crystal cells
09/12/1995US5449955 Copper barrier layer between nickel and gold
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