| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/30/1996 | US5488082 Polymeric adhesive paste |
| 01/30/1996 | US5488019 Blending part of bismuth oxide and glass composition to calcined ceramic powder; firing again at lower temperature |
| 01/30/1996 | US5487964 Pulverulent nonconductor and compound or complex of gold, copper, silver, platinum, palladium or ruthenium; electrography |
| 01/30/1996 | US5487852 Polyamides, polyester ethers or polyimides for sheets |
| 01/30/1996 | US5487673 Package, socket, and connector for integrated circuit |
| 01/30/1996 | US5487218 Method for making printed circuit boards with selectivity filled plated through holes |
| 01/30/1996 | US5487211 Method for fabricating a surface-mountable crystal resonator |
| 01/30/1996 | CA2103328C Electronic circuit board arrangements |
| 01/30/1996 | CA2026191C Meter device |
| 01/27/1996 | CA2154719A1 Multi-chip module semiconductor device |
| 01/25/1996 | WO1996002068A1 Microelectronic mounting with multiple lead deformation |
| 01/25/1996 | WO1996001836A1 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 01/25/1996 | WO1996001739A1 Polymeric film containing silicone resin and clay |
| 01/25/1996 | CA2193619A1 Polymeric film containing silicone resin and clay |
| 01/24/1996 | EP0693866A1 Flexible printed circuit harness device and flexible circuit used thereof |
| 01/24/1996 | EP0693796A1 Connector provided with metal strips as contact members, connector assembly comprising such a connector |
| 01/24/1996 | EP0693138A1 Method for metallising plastics, and resulting products |
| 01/24/1996 | CN1115562A Electromagnetic interference supressing body having low electromagnetic transparency and reflection, and electronic device having the same |
| 01/24/1996 | CN1115329A Epoxy adhesives and copper foils and copper clad laminates using same |
| 01/23/1996 | US5486941 Fine sphere, a spherical spacer for a liquid crystal display element and a liquid display element using the same |
| 01/23/1996 | US5486723 Packaged integrated circuit add-on card |
| 01/23/1996 | US5486657 Beveled edge circuit board with channeled connector pads |
| 01/23/1996 | US5486656 Printed circuit board having an extra plate connected to a product portion |
| 01/23/1996 | CA2032302C Method of forming metallized layer on aluminum nitride sintered body |
| 01/23/1996 | CA2031459C Surface structure of ceramics substrate and method of manufacturing the same |
| 01/18/1996 | WO1996001551A1 Electronic system |
| 01/18/1996 | WO1996001507A1 Resilient or depassivating electrical contact device without temperature rise |
| 01/18/1996 | WO1996001498A1 Integrated circuit device |
| 01/18/1996 | WO1996001437A1 Rack for electronic modules |
| 01/18/1996 | DE4424984A1 Flexible circuit board for SMD components |
| 01/18/1996 | DE4424831A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung A process for producing an electrically conductive connection |
| 01/18/1996 | CA2194404A1 Module subrack with routing module |
| 01/17/1996 | EP0692927A2 Improved printed circuit board and method |
| 01/17/1996 | EP0692841A1 Assembly of shielded connectors and a board having plated holes |
| 01/17/1996 | EP0692823A1 Ball grid array package for an integated circuit |
| 01/17/1996 | EP0692805A1 Electric relay |
| 01/17/1996 | EP0692512A1 Polyamide-imide |
| 01/17/1996 | EP0692177A1 Resin impregnated laminate for wiring board applications |
| 01/17/1996 | EP0692149A1 Electrical connector |
| 01/17/1996 | EP0692137A1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
| 01/17/1996 | EP0692136A1 High strength conductive polymers |
| 01/17/1996 | CN1030708C Imide prepolymers and cured products thereof |
| 01/16/1996 | US5485132 Dielectric ceramic composition containing ZnO-B2 O3 -SiO2 glass, method of preparing the same, and resonator and filter using the dielectric ceramic composition |
| 01/16/1996 | US5485081 Test point reduction system for a printed circuit board test system |
| 01/16/1996 | US5485038 Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers |
| 01/16/1996 | US5484965 Circuit board adapted to receive a single in-line package module |
| 01/16/1996 | US5484963 Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like |
| 01/16/1996 | US5484962 Electrical device provided with three terminals |
| 01/16/1996 | US5484648 Lines of electroconductive paste, for electrode terminals, solvent-absorptive layer |
| 01/16/1996 | US5484516 Resin products and process for producing the same |
| 01/16/1996 | US5484294 Brushless rotary connector |
| 01/16/1996 | US5483741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
| 01/11/1996 | WO1996000752A1 Compatibilized lcp blends |
| 01/11/1996 | DE4423007A1 Generation of test program for checking solder pad data on circuit boards |
| 01/11/1996 | CA2194171A1 Compatibilized lcp blends |
| 01/10/1996 | EP0691803A1 Heat radiating member made of highly oriented graphite |
| 01/10/1996 | EP0691697A1 Electronic device having a flat and thin battery |
| 01/10/1996 | EP0691682A2 Fired body for and manufacture of a substrate |
| 01/10/1996 | EP0691655A1 Module card |
| 01/10/1996 | EP0691626A2 Data carrier comprising an integrated circuit module |
| 01/10/1996 | EP0691041A1 Asymmetrical waveguide |
| 01/10/1996 | EP0635192A4 Circuit board connections. |
| 01/10/1996 | EP0526656B1 Wiring board |
| 01/10/1996 | CN1114819A Mount structure of integrated circuit chip, and mount structure of controller in electronic device |
| 01/10/1996 | CN1114802A Signal transmitting device suitable for fast signal transmission |
| 01/10/1996 | CN1114786A A flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 01/10/1996 | CN1114768A Viscoelastically damped slider suspension system |
| 01/09/1996 | US5483413 Apparatus for controlling electromagnetic interference from multi-layered circuit boards |
| 01/09/1996 | US5483217 Electronic circuit device |
| 01/09/1996 | US5483105 Module input-output pad having stepped set-back |
| 01/09/1996 | US5483101 Multilayer printed circuit board |
| 01/09/1996 | US5483025 Unitary micro-flexure structure |
| 01/09/1996 | US5482793 Assembly having improved thermal sensing capability |
| 01/09/1996 | US5482586 Method of manufacturing multilayer printed wiring board |
| 01/09/1996 | US5482200 Method for applying solder to a fine pitch flip chip pattern |
| 01/09/1996 | US5481894 Method for manufacturing a conductor for a flat cable |
| 01/09/1996 | US5481795 Method of manufacturing organic substrate used for printed circuits |
| 01/09/1996 | CA2105367C Connector for electrical components |
| 01/09/1996 | CA1337915C Unsaturated polyester resin compositions and electrical laminates made therefrom |
| 01/04/1996 | WO1996000491A1 Metallized laminate material having ordered distribution of conductive through holes |
| 01/04/1996 | DE4434731C1 Multilayer electrical circuit board for HF signal lines |
| 01/04/1996 | DE4422669A1 Multilayer circuit board design |
| 01/04/1996 | DE4421731A1 Contact jack for circuit boards |
| 01/04/1996 | DE19523364A1 Leiterplatte Circuit board |
| 01/04/1996 | DE19508284A1 Optical transceiver for optical communication system |
| 01/04/1996 | CA2193729A1 Metallized laminate material having ordered distribution of conductive through holes |
| 01/03/1996 | EP0690530A1 Backplane assembly for connectors |
| 01/03/1996 | EP0690505A2 Sintered body for and manufacture of ceramic substrates |
| 01/03/1996 | EP0690500A1 Ball-grid-array integrated circuit package with solder-connected thermal conductor |
| 01/03/1996 | EP0690498A2 Poly(arcyl ether benzimidazoles) and their use as capping layers in microelectronic structures |
| 01/03/1996 | EP0690461A1 Method for making devices using metallized magnetic substrates |
| 01/03/1996 | EP0690035A1 Metallization of ferrites comprising surface reduction |
| 01/03/1996 | EP0689560A1 Phosphorus-modified epoxy resins, process for producing them and their use |
| 01/03/1996 | EP0689559A1 Epoxy resin mixtures |
| 01/03/1996 | EP0689558A1 Phosphorus-modified epoxy resins, process for producing them and their use |
| 01/03/1996 | EP0689557A1 Epoxy resin mixtures |
| 01/03/1996 | EP0550432B1 Electrical connector structure and method for obtaining an electrical interconnection assembly |
| 01/02/1996 | US5481436 Multi-level assemblies and methods for interconnecting integrated circuits |
| 01/02/1996 | US5481435 Adaptor assembly for adding functionality to a pin grid receptacle on a circuit board |
| 01/02/1996 | US5481432 Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |