| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/18/1996 | US5527592 Electronic circuit package coated with dielectric blend of fluorine-containing cyanate monomer and fluorine-containing arylene ether polymer which cures to polycyanurate network with dispersed thermoplastic polymer particles |
| 06/18/1996 | US5527187 Compliant electrical interconnect |
| 06/18/1996 | US5526565 High density self-aligning conductive networks and contact clusters and method and apparatus for making same |
| 06/18/1996 | US5526564 Method of manufacturing a multilayered printed wiring board |
| 06/13/1996 | WO1996018284A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 06/13/1996 | CA2204532A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 06/12/1996 | EP0716430A1 Thick film conductor compositions with improved adhesion |
| 06/12/1996 | EP0715773A1 Cross-connect system |
| 06/12/1996 | EP0715636A1 Allyl-epoxy ipn |
| 06/12/1996 | EP0614470B1 Phosporous containing resin |
| 06/12/1996 | CN1124539A Transmission line and method of designing same |
| 06/12/1996 | CN1032015C 苯乙烯聚合物组合物 Styrene polymer composition |
| 06/11/1996 | US5526234 Packaging electrical components |
| 06/11/1996 | US5525761 Copper-based paste containing refractory metal additions for densification control |
| 06/11/1996 | US5525760 Fan-fold shielded electrical leads |
| 06/11/1996 | US5525433 Epoxy adhesives and copper foils and copper clad laminates using same |
| 06/11/1996 | US5525405 Adhesiveless aromatic polyimide laminate |
| 06/11/1996 | US5525402 Bump forming paste is metal oxide including copper oxide as major component and bumps are made of reduced and sintered body of paste; used for semiconductors |
| 06/11/1996 | US5525374 Infiltering metal in molten state in sintered ceramic body to fill the void space by capillary action, cooling |
| 06/11/1996 | US5525205 Process for forming circuit with laser |
| 06/11/1996 | US5525181 Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board |
| 06/11/1996 | US5525065 Cavity and bump interconnection structure for electronic packages |
| 06/06/1996 | WO1996017501A1 Chemically grafted electrical devices |
| 06/06/1996 | WO1996017413A1 Electrical connector assembly with interleaved multilayer structure and fabrication method |
| 06/06/1996 | WO1996017391A1 Battery device with integrated circuit substrate packaging |
| 06/06/1996 | WO1996017378A1 Electrical contact structures from flexible wire |
| 06/06/1996 | WO1996017025A1 Conductive ink |
| 06/06/1996 | WO1996017020A1 Multifunctional cyanate ester and epoxy blends |
| 06/05/1996 | EP0715490A2 Method of preparing multilayer wiring board |
| 06/05/1996 | EP0715489A2 Printed circuit board assembly |
| 06/05/1996 | EP0715488A1 Metal-foil-clad composite ceramic board and process for the production thereof |
| 06/05/1996 | EP0715355A2 Cap to close off open via holes in PCBs |
| 06/05/1996 | EP0715318A1 Resistor assembly and electron multiplier using the same |
| 06/05/1996 | EP0715201A2 Circuit assembly and process for production thereof |
| 06/05/1996 | EP0715107A1 Connecting device pluggable into electrical apparatus |
| 06/05/1996 | EP0714591A1 Edge-connecting printed circuit board |
| 06/05/1996 | EP0714553A1 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 06/05/1996 | EP0610385B1 Low thermal expansion coefficient polyimides with improved elongation |
| 06/05/1996 | EP0578652B1 High k dielectric compositions with fine grain size |
| 06/05/1996 | DE4444567A1 Mfg. circuit board based on core plate of aluminium or alloy |
| 06/05/1996 | CN1124030A Thermally cross-linkable heat-sealing adhesive |
| 06/04/1996 | US5524283 Portable transceiver integrated on a printed circuit board |
| 06/04/1996 | US5523921 Printed circuit assembly having improved reference plane isolation |
| 06/04/1996 | US5523920 Printed circuit board comprising elevated bond pads |
| 06/04/1996 | US5523919 Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication |
| 06/04/1996 | US5523873 LCD heater with flex circuit buss bars |
| 06/04/1996 | US5523768 Integrated feed and down converter apparatus |
| 06/04/1996 | US5523697 Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof |
| 06/04/1996 | US5523174 Printed circuit boards |
| 06/04/1996 | US5523148 Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns |
| 06/04/1996 | US5523137 Adhesive paper for tape automated bonding |
| 06/04/1996 | US5522963 Method for machining and depositing metallurgy on ceramic layers |
| 06/04/1996 | US5522733 Electrical connectors |
| 06/04/1996 | US5522727 Electrical angle connector of a printed circuit board type having a plurality of connecting conductive strips of a common length |
| 06/04/1996 | US5522683 Drilling apparatus |
| 06/04/1996 | US5522132 Microwave surface mount package |
| 06/04/1996 | CA2060709C Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material |
| 05/30/1996 | WO1996016440A1 Interconnection elements for microelectronic components |
| 05/30/1996 | DE4441436A1 Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment |
| 05/29/1996 | EP0714226A1 Method of mounting terminal to flexible printed circuit board |
| 05/29/1996 | EP0713930A1 Aqueous silver composition |
| 05/29/1996 | EP0688473A4 Improved high frequency electrical connector |
| 05/29/1996 | CN1123583A An electric fuse and protective circuit |
| 05/29/1996 | CN1123514A Laminar stackable circuit board structure and manufacture |
| 05/29/1996 | CN1123513A Laminar stackable circuit board structure with cap acitor |
| 05/29/1996 | CN1123431A Method and apparatus for providing a remotely located outrigger card electrically coupled to a control card |
| 05/29/1996 | CN1031912C Base board of circuit |
| 05/28/1996 | US5521794 Radio comprised of flexible elements |
| 05/28/1996 | US5521786 Semiconductor module and IC package used for the semiconductor module |
| 05/28/1996 | US5521438 Having stress relief layer of soft metal |
| 05/28/1996 | US5521437 Semiconductor power module having an improved composite board and method of fabricating the same |
| 05/28/1996 | US5521433 IC card including a substrate having improved strength and heat radiation properties |
| 05/28/1996 | US5521122 Process of manufacturing a multichip module using a temporary support base |
| 05/28/1996 | US5520986 Diffusion patterning process and screen therefor |
| 05/28/1996 | US5520967 Solder application to a circuit board |
| 05/28/1996 | US5520900 Graphite intercalation compound and oxidation |
| 05/23/1996 | WO1996015551A1 Mounting electronic components to a circuit board |
| 05/23/1996 | WO1996015459A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 05/23/1996 | WO1996015458A1 Probe card assembly and kit, and methods of using same |
| 05/23/1996 | WO1996015306A1 Sheet material for laminate of printed circuit and laminate for printed circuit using the same |
| 05/23/1996 | DE19542622A1 Thin-walled cable mfr. with micro-wiring preventing cross-talk interference and external electromagnetic influence |
| 05/22/1996 | EP0713359A1 Printed circuit boards with selectively filled plated through holes |
| 05/22/1996 | EP0713358A2 Circuit board |
| 05/22/1996 | EP0713357A1 Thick film paste |
| 05/22/1996 | EP0713356A1 Electrical circuit boards |
| 05/22/1996 | EP0713252A2 Circuit elements mounting |
| 05/22/1996 | EP0713229A1 Planar transformer and method of manufacture |
| 05/22/1996 | EP0712814A1 Thick film conductor paste for automotive glass |
| 05/22/1996 | EP0712534A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 05/22/1996 | EP0581919B1 Housing for control devices |
| 05/21/1996 | US5519582 Magnetic induction coil for semiconductor devices |
| 05/21/1996 | US5519581 Mounting of toroidal inductors |
| 05/21/1996 | US5519580 Electronic package |
| 05/21/1996 | US5519579 Method and apparatus for replacing directly attached chip |
| 05/21/1996 | US5519578 Folded printed wiring board structure with electromagnetic shield |
| 05/21/1996 | US5519577 Spread spectrum radio incorporated in a PCMCIA Type II card holder |
| 05/21/1996 | US5519573 I/O riser card for motherboard in a personal computer/server |
| 05/21/1996 | US5519366 Strip line filter |
| 05/21/1996 | US5519252 Power semiconductor device employing pin block connection arrangement for facilitated and economized manufacture |
| 05/21/1996 | US5519201 Smart card |