Patents for H05K 1 - Printed circuits (98,583)
05/1995
05/16/1995US5415945 Dielectric ceramic composition for low temperature sintering
05/16/1995US5415920 Patterned chromium barrier layer with flange-like structure
05/16/1995US5415893 Dispersion of electrically conductive particles in a dispersing medium
05/16/1995US5415555 Electrical interconnection apparatus utilizing raised connecting means
05/16/1995US5414928 Method of making an electronic package assembly with protective encapsulant material
05/11/1995WO1995012808A1 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
05/11/1995WO1995012627A1 Cure inhibited epoxy resin compositions and laminates prepared from the compositions
05/11/1995DE4337921A1 Contactless chip card having an antenna coil and method for its production
05/11/1995DE4337920A1 Method and arrangement for producing a permanent electrical pressure contact
05/11/1995DE4337749A1 Method for producing ceramic multilayers
05/10/1995EP0652692A1 Printed circuit board
05/10/1995EP0652241A2 Polymer resins and their use
05/10/1995EP0651937A1 Self-aligning electrical contact array
05/10/1995EP0651916A1 Rf waveguide signal transition apparatus
05/10/1995EP0651696A1 A method of manufacturing a ud-reinforced pwb laminate
05/10/1995CN1102424A Pastes for the coating of substrates, methods for manufacturing them and their use
05/09/1995US5414638 Programmable interconnect architecture
05/09/1995US5414587 Surge suppression device
05/09/1995US5414576 Space saving configuration of a printed cirucit board for a magnetic head on a flexure seat for the head
05/09/1995US5414402 Multi-layer substrate
05/09/1995US5414393 Telecommunication connector with feedback
05/09/1995US5414224 Multilayer printed circuit board and method of manufacturing same
05/09/1995US5414223 Solder pad for printed circuit boards
05/09/1995US5414220 Flexible wiring cable
05/09/1995US5414219 Printed circuit board circuit control device
05/09/1995US5414059 Low bromine-content materials for manufacturing printed circuit boards
05/09/1995US5413966 Semiconductors
05/09/1995US5413842 Green sheets of controlled microporosity and method of producing same
05/09/1995US5413660 Method for imparting improved adhesion to polyolefin substrates
05/09/1995US5412865 Method of manufacturing multilayer electronic component
05/04/1995DE4416986A1 Process for producing from thermoplastic material a component having at least one integrated, electrically conducting section, and a component produced by this process
05/03/1995EP0651602A1 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
05/03/1995EP0651599A1 Fastening device for an electronic component on a flexible circuit, and casing containing such a device
05/03/1995EP0651598A1 Electronic circuit module
05/03/1995EP0651468A1 Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge
05/03/1995EP0651465A2 Electrical wiring block with break test capability
05/03/1995EP0651287A1 Base film having dimensional stability and high transparency, and photographic light-sensitive material comprising same
05/03/1995EP0651013A1 A tie-layer and a process for improving adhesion of a surface layer to a polyolefin substrate
05/03/1995EP0650795A2 Solder ball connections and assembly process
05/03/1995EP0650423A1 Electrical device, especially a switching and control device for motor vehicles
05/02/1995US5412541 Specifically configured sheet members or articles for use in improving sound or image quality
05/02/1995US5412538 Multi-layer printed circuit board
05/02/1995US5412160 Multilayer board with dielectric film on substrate and wire metal film on dielectric film
05/02/1995US5412157 Semiconductor device
05/02/1995US5411792 Transparent conductive substrate
05/02/1995US5411765 Flexible multi-layer polyimide film laminates and preparation thereof
05/02/1995US5411629 Method for roughening surface of halocarbon film
05/02/1995US5411628 Diffusion patterning process and screen therefor
05/02/1995US5410957 Screen printing apparatus
05/02/1995US5410806 Method for fabricating conductive epoxy grid array semiconductors packages
04/1995
04/28/1995CA2109383A1 Printed circuit board
04/27/1995WO1995011582A1 Flexible multilayer printed circuit boards and methods of manufacture
04/27/1995WO1995011580A1 Circuit-board device
04/27/1995WO1995011129A1 Composite substrates for preparation of printed circuits
04/27/1995WO1995005061A3 Method for producing a conductive circuit
04/27/1995DE4336235A1 Method for the production of ceramic multilayers
04/27/1995CA2118340A1 Insulating articles with high surface electical resistivity and high flame resistance
04/27/1995CA2118091A1 Means for imparting improved adhesion to polyolefin substrates
04/26/1995EP0650318A1 Fixing means for flat circuit units and the flat circuit units used therefor
04/26/1995EP0650314A2 Method and apparatus for manufacture of printed circuit cards
04/26/1995EP0650230A2 Electrical connector having latch means
04/26/1995EP0650189A1 Method of manufacture of a semiconductor module
04/26/1995EP0650171A2 Insulating articles with high surface electrical resistivity and high flame resistance
04/26/1995EP0649917A1 Electrodeposited copper foil and process for making same
04/26/1995EP0649590A1 Component module
04/26/1995EP0649565A1 Fitting unit for multilayer hybrid circuit with power components
04/26/1995EP0649562A1 Circuit protection device
04/25/1995US5410452 Printed circuit board electrical adaptor pin
04/25/1995US5410451 Location and standoff pins for chip on tape
04/25/1995US5410449 Heatsink conductor solder pad
04/25/1995US5410233 Magneto-repulsion punching with dynamic damping
04/25/1995US5410107 Electrical interconnection medium
04/25/1995US5410084 Aromatic diamine and polyimide, and preparation process of same
04/25/1995US5409741 Method for metallizing surfaces by means of metal powders
04/20/1995WO1995010754A1 Adjustable electric delay detonator
04/20/1995DE4335879A1 Arrangement for quality control and monitoring of through-plated multilayer printed circuit boards
04/20/1995DE4335325A1 Aqueous polyimide paints (surface coatings, lacquers, enamels, varnishes)
04/19/1995EP0649273A1 Process of making an electrical contact
04/19/1995EP0649272A1 Flexible fastening member and its method of manufacturing
04/19/1995EP0649194A1 Electrical connector having reduced cross-talk
04/19/1995EP0649193A1 Low insertion force/low profile flex connector
04/19/1995EP0648710A1 Process for the preparation of fine monodispersed oxide powders, fine monodispersed oxide powder, ceramic composition and its use
04/19/1995EP0640039A4 Thin film metallization and brazing of aluminum nitride.
04/19/1995CN1101603A Resin laminates and a process for production thereof
04/19/1995CN1028266C Screen-printable thick film paste composition
04/19/1995CA2118142A1 Flexible geometry circuit board
04/18/1995US5408568 Electronic circuit board with internal optically transmissive layer forming optical bus
04/18/1995US5408567 Electronic circuit assembly with optical waveguide for interconnecting electronic components
04/18/1995US5408386 Socket assembly including a first circuit board located between a receptacle housing and a second circuit board
04/18/1995US5408385 Control device and method of making the same
04/18/1995US5408383 Container for electronic devices having a plurality of circuit boards
04/18/1995US5408207 Electronic device for high frequencies comprising a printed circuit and process for manufacturing such a circuit
04/18/1995US5408053 Layered planar transmission lines
04/18/1995US5408052 Flexible multi-layer circuit wiring board
04/18/1995US5408026 Blend od a polyene, cyclic silicone compound, and polysiloxane in presence of a hydrosilation catalyst
04/18/1995US5407872 Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material
04/18/1995US5407626 Deprotenation of the amide N by reacting with a quaternary amine to form an anionic polymer; casting from solution; desolventizing; heating to alkylate or neutralize
04/18/1995US5407622 Injection molding; electroless deposition of metals
04/18/1995US5407557 Multilayer laminate composed of wiring boards formed from a flexible dielectric and a wiring pattern
04/18/1995US5407511 Process for forming a sintered conductor circuit board