Patents for H05K 1 - Printed circuits (98,583)
01/1996
01/02/1996US5481242 Debris-reducing telephone resistor combination and method
01/02/1996US5481234 Phase trimmed strip transmission lines and method for trimming
01/02/1996US5481138 Structure and a method for repairing electrical lines
01/02/1996US5481073 Modular broadband bidirectional programmable switch system with stacked modular switch arrangement
01/02/1996US5480839 Semiconductor device manufacturing method
01/02/1996US5480730 Laminate of metal, metal oxide and second metal
01/02/1996US5480503 Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
01/02/1996US5480309 Universal multilayer base board assembly for integrated circuits
01/02/1996CA2073150C Dielectric filter construction having notched mounting surface
01/02/1996CA2043174C Personal computer with shielding of input/output signals
12/1995
12/28/1995WO1995035589A1 High impact digital crash data recorder
12/28/1995WO1995035585A2 Surface mountable substrate edge terminal
12/28/1995WO1995035213A1 Thermal printing head, substrate used therefor and method for producing the substrate
12/28/1995WO1995035207A1 Conductive ink
12/28/1995WO1995032493A3 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer
12/28/1995CA2152578A1 Wiring backplane for plug-type connections
12/27/1995EP0689374A2 Electronic module
12/27/1995EP0689245A2 Electronic device, its arrangement and method of manufacturing the same
12/27/1995EP0689073A1 Alignment and bonding techniques
12/27/1995EP0688473A1 Improved high frequency electrical connector
12/27/1995EP0592471B1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained
12/27/1995CN2216318Y Flexible polyester film coated copper foil plate and film-coated circuit board
12/26/1995US5479529 Computer-implemented method
12/26/1995US5479331 Small form factor power supply
12/26/1995US5479320 Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
12/26/1995US5479319 Electrical assembly
12/26/1995US5479318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
12/26/1995US5479201 Optical beam scanner with circuit board mounted elements
12/26/1995US5479140 Dielectric ceramic composition containing ZnO-B2 O3 -SiO2 glass, method of preparing the same, and resonator and filter using the dielectric ceramic composition
12/26/1995US5479138 Multi-layer wiring board
12/26/1995US5478914 Polyimides and processes for preparaing the same
12/26/1995US5478462 Pre-electroless depositing nickel or cobalt metal or alloy layer in a solution comprising an alkyldiamine, an alkali metal hydroxide, alkylene glycol and water
12/26/1995US5478421 Method for making composite structures by filament winding
12/26/1995US5478244 Hybrid junction box
12/26/1995US5478006 Printed-circuit substrate and its connecting method
12/26/1995US5477933 Electronic device interconnection techniques
12/26/1995US5477612 Method of making high density conductive networks
12/26/1995CA1337832C Dual personal computer architecture peripheral adapter board and circuit
12/21/1995WO1995034911A1 Electrostatic chuck
12/20/1995EP0688158A1 Protection device for an electromagnetic radiation-sensitive device
12/20/1995EP0688155A1 Adapter for electrically connecting opto-electronic components to a printed circuit board
12/20/1995EP0688026A1 Resistor coated on diamond substrate
12/20/1995EP0687983A1 Motherboard for a computer of the AT type, and a computer of the AT type comprising such motherboard
12/20/1995EP0578737B1 Contact device for an electrical or electronic component
12/20/1995CN1113668A Configurable circuit substrate
12/20/1995CN1113607A A chip package, a chip carrier and a method for producing the same, a terminal electrode for a circuit substrate and a method for producing the same, and a chip package-mounted complex
12/19/1995US5477086 Shaped, self-aligning micro-bump structures
12/19/1995US5476970 Reacting of an aromatic hydrocarbon and benzoyl peroxide
12/19/1995US5476726 Circuit board with metal layer for solder bonding and electronic circuit device employing the same
12/19/1995US5476688 Dividing starter aqueous plating solution into plurality of portions, forming baths of different concentrations, immersing powder substrate in each bath until depleted, rinsing between baths and at end of process, drying
12/19/1995US5476211 Method of manufacturing electrical contacts, using a sacrificial member
12/14/1995WO1995034108A1 Corrosion protection of oppositely polarised electrical conductors
12/14/1995WO1995034106A1 Microelectronic contacts and assemblies
12/14/1995WO1995034096A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
12/14/1995DE19520700A1 Semiconductor element used e.g. as integrated circuit
12/14/1995DE19513354A1 Surface processing equipment
12/14/1995CA2188770A1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
12/13/1995EP0687009A2 Multi-layer electronic circuit package with dielectric polymer layers having different optical absorption strength and method of forming it
12/13/1995EP0687007A2 Electronic surface mount device and method for making
12/13/1995EP0686835A1 Compact thermocouple connector
12/13/1995EP0686093A1 Metal on plastic films with adhesion-promoting layer
12/13/1995EP0624305A4 Carrier strip head interconnect assembly.
12/13/1995CN1113332A Resonant tag labels and method of making same
12/12/1995US5475606 Faraday cage for a printed circuit card
12/12/1995US5475568 Power supply structure for multichip package
12/12/1995US5475567 Method for hermetically sealing a single layer ceramic thick film electronic module
12/12/1995US5475263 Thick film hybrid multilayer circuit
12/12/1995US5475260 Electronic read-only module
12/12/1995US5475048 Free radical curable formulation of an unsaturated polyester or vinyl ester, thermoplastic resin and crosslinking agent
12/12/1995US5474798 Method for the manufacture of printed circuit boards
12/12/1995US5474474 Electrically balanced connector assembly
12/12/1995US5473813 Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards
12/07/1995WO1995033363A1 Device for holding hinge plates within an electronic case
12/07/1995WO1995032866A1 Thermal printing head, substrate used therefor and method for producing the substrate
12/07/1995WO1995028735A3 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element
12/07/1995DE4419134A1 Positioning device for substrates processing
12/06/1995EP0685905A2 Electrical connections systems
12/06/1995EP0685436A1 Ceramic substrates for hybrid integrated circuits
12/06/1995EP0588834B1 Electrical connectors
12/06/1995CN1113083A Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate
12/06/1995CN1113069A Printed circuit board
12/06/1995CN1112877A Metallic body with vapor deposited treatment layer(s) and adhesion-promoting layer
12/05/1995US5473511 Printed circuit board with high heat dissipation
12/05/1995US5473499 Hot pluggable motherboard bus connection method
12/05/1995US5473194 Chip carrier having through hole conductors
12/05/1995US5473138 Method for increasing the surface area of ceramics, metals and composites
12/05/1995US5473137 Method of bonding copper and a substrate for power electronics and made of a non-oxide ceramic
12/05/1995US5473119 Stress-resistant circuit board
12/05/1995US5472804 Battery device with integrated circuit substrate packaging
12/05/1995US5472736 Masking a portion of coil-patterned groove partially plated with conductive material, then plating exposed portion with self-aligned second layer, dissolving cured photoresist and mask
12/05/1995CA2036758C Sub power plane to provide emc filtering for vlsi devices
12/05/1995CA1337673C Dielectric composition having controlled thermal expansion
11/1995
11/30/1995WO1995032605A1 Printed circuit board socket
11/30/1995WO1995032604A1 Processing low dielectric constant materials for high speed electronics
11/30/1995WO1995032504A1 Memory module
11/30/1995WO1995032493A2 Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer
11/30/1995DE4418679A1 Integrated circuit interconnect system for wafer test
11/30/1995DE4418617A1 Micro-wiring module with circuit board
11/30/1995DE4418426A1 Semiconductor power modules for motor control inverter
11/30/1995DE4418299A1 Illuminating device for transparent symbols of switch