Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1996
10/08/1996US5563771 IC card with board positioning means
10/08/1996US5563770 IC card with board positioning means
10/08/1996US5563619 Liquid crystal display with integrated electronics
10/08/1996US5563572 Resistor for soldering to a printer circuit board
10/08/1996US5563380 Apparatus for mounting integrated circuit chips on a Mini-Board
10/08/1996US5563237 Includes a bismaleimide hardener
10/08/1996US5562973 Ceramic multi-layer wiring board
10/08/1996US5562971 Multilayer printed wiring board
10/08/1996US5562760 Copper on printed circuits
10/08/1996US5562472 Contact-making device for connecting a conductor film which has a plurality of contact conductor tracks
10/08/1996CA2169427A1 Flexible strip cable
10/03/1996WO1996031107A1 Circuit board with screening arrangement against electromagnetic interference
10/03/1996WO1996031103A1 Printed circuit board arrangement
10/03/1996WO1996031102A1 Arrangement for the manufacture of multilayers
10/03/1996WO1996031100A1 Package of electronic device
10/03/1996WO1996030966A1 System and process for producing electrically conductive connecting structures and a process for producing circuits and printed circuits
10/03/1996WO1996030932A2 Microcircuit via interconnect
10/03/1996CA2211913A1 Microcircuit via interconnect
10/02/1996EP0735810A2 Pluggable power supply for card cage
10/02/1996EP0735809A2 Photodefinable dielectric composition useful in the manufacture of printed circuits
10/02/1996EP0735807A1 Electric-circuit board for a display apparatus
10/02/1996EP0735622A2 Connecting structure for connecting connector terminal unit with wiring board, and assembling method thereof
10/02/1996EP0735605A1 Multilayer transmission line using ground metal with slit, and hybrid using the transmission line
10/02/1996EP0735604A1 Planar dielectric line and integrated circuit using the same
10/02/1996EP0735584A2 Integrated circuit multi-level interconnection technique
10/02/1996EP0735579A1 Structure and method of coupling substrates
10/02/1996EP0735551A1 Transformer assembly, in particular for a supply device of a vehicle discharge lamp
10/02/1996EP0734851A2 Laminate of liquid crystal polyester resin composition film and metallic foil, and printed-wiring board using the same
10/02/1996EP0593584B1 Electrical connection system
10/02/1996DE4446099A1 Hybrid, integrated, thick-film circuit e.g. for telecommunications equipment
10/02/1996DE19611240A1 Conductive printing paste contg. silver@-based powder
10/02/1996DE19611239A1 Conductive paste for connections in ceramic electronic devices
10/02/1996DE19516260C1 Measuring transducer temp indication device
10/02/1996DE19512272A1 Mfg. method for multilayer circuit boards e.g. for entertainment electronics
10/02/1996DE19511487A1 Verfahren zur Herstellung einer Leiterplattenanordnung A process for producing a circuit board assembly
10/02/1996DE19510469A1 Input-output unit for digital controller
10/02/1996CN2236715Y Electronic element with easily sold leads
10/02/1996CN1132530A Metal membrane and its products
10/02/1996CN1132465A Drawer of circuit board
10/02/1996CN1132463A Method of laminating and circuitizing substrates having opening therein
10/02/1996CN1132413A Multi-layered mixed integrated thick-film circuit
10/02/1996CN1132142A Single side metal-clad laminate
10/01/1996US5561734 Dial speed control for hand-held power tool
10/01/1996US5561594 Circuit connection in an electrical assembly
10/01/1996US5561592 Hybrid integrated circuit module
10/01/1996US5561584 For a circuit board
10/01/1996US5561539 Color liquid crystal display having a bent tape carrier package
10/01/1996US5561322 Semiconductor chip package with enhanced thermal conductivity
10/01/1996US5561321 Ceramic-metal composite structure and process of producing same
10/01/1996US5560704 Covered vanity mirror hinge assembly
10/01/1996CA2109701C Low cross talk electrical connector system
10/01/1996CA2102824C Localized surface glazing of ceramic articles
09/1996
09/26/1996WO1996029848A1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages
09/26/1996WO1996029764A1 Cross-connect method and apparatus
09/26/1996WO1996029202A1 A laminate for sealing capsules
09/26/1996WO1996025263A3 Process for bonding a flexible substrate to a chip
09/26/1996DE19509916A1 Hearing aid with modular housing
09/26/1996CA2214890A1 Cross-connect method and apparatus
09/25/1996EP0733910A1 Printed circuit board with built-in testing of connections to ICs
09/25/1996EP0733261A1 Attenuator especially for audio-signals
09/25/1996EP0460223B1 Board for surge absorbing device of communication line
09/25/1996CN1131955A Allyl-epoxy ipn
09/25/1996CN1131897A Circuit substrate having interconnection leads and fabrication process thereof
09/25/1996CN1131896A Special-purpose retainer multilayer circuit board
09/25/1996CN1131751A Circuit assembly and process for production thereof
09/24/1996US5559997 System and method for designing a printed-circuit board
09/24/1996US5559971 Folded hierarchical crosspoint array
09/24/1996US5559676 Self-contained drop-in component
09/24/1996US5558928 Multi-layer circuit structures, methods of making same and components for use therein
09/24/1996US5558789 Method of applying a laser beam creating micro-scale surface structures prior to deposition of film for increased adhesion
09/24/1996US5558271 Shaped, self-aligning micro-bump structures
09/24/1996US5557844 Method of preparing a printed circuit board
09/19/1996WO1996028511A1 Halogen-free flame-retardant epoxy resin composition
09/19/1996WO1996028279A1 Product vending system with pneumatic product delivery
09/19/1996DE19541334A1 Mfg. printed circuit assembly for construction of sub-assemblies in e.g. microwave electronic equipment
09/19/1996DE19540570A1 High packing density circuit board
09/19/1996DE19509554A1 Multilayer circuit manufacturing method for ceramic capacitor
09/18/1996EP0732735A2 Monolithic ceramic electronic device and method of manufacturing same
09/18/1996EP0732713A2 Thin film capacitor and hybrid circuit board, and methods of producing same
09/18/1996EP0732712A2 Capacitor dielectric and method for producing it
09/18/1996EP0732107A2 Circuit substrate shielding device
09/18/1996EP0731992A1 High-density interconnect technique
09/18/1996CN1131303A Non-contact type IC card and method and apparatus for manufacturing the same
09/18/1996CN1131170A Thick film conductor paste for automotive glass
09/17/1996US5557505 Dual pattern microprocessor package footprint
09/17/1996US5557503 Circuit card having a large module strain relief and heat sink support
09/17/1996US5557502 Structure of a thermally and electrically enhanced plastic ball grid array package
09/17/1996US5557500 Heat dissipating arrangement in a portable computer
09/17/1996US5557252 Thick film circuit board and method of manufacturing the same
09/17/1996US5557075 Parallel flexible transmission cable
09/17/1996US5556899 Fluorinated carbon polymer composites
09/17/1996US5556585 Dielectric ceramic body including TIO2 dispersion in crystallized cordierite matrix phase, method of producing the same, and circuit board using the same
09/17/1996US5556300 End connection for a flexible shielded cable conductor
09/17/1996CA2053448C Multilayer printed wiring board and process for manufacturing the same
09/12/1996DE19609118A1 Resistance paste used in mfr. of ceramic circuit substrate
09/12/1996DE19608484A1 Circuit substrate with highly reliable bonding
09/12/1996DE19543894A1 Process for forming interconnections on circuit boards
09/11/1996EP0731506A2 Package for semiconductor device
09/11/1996EP0731153A1 An adhesive composite and method of preparing same
09/11/1996EP0730815A1 High capacitance sheet adhesives and process for making the same
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