Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/1996
11/05/1996US5572069 Conductive epoxy grid array semiconductor packages
11/05/1996US5571996 Trace conductor layout configuration for preserving signal integrity in control boards requiring minimum connector stub separation
11/05/1996US5571855 Attenuation of polymer substrate degradation due to ultraviolet radiation
11/05/1996US5571852 Irradiation with uv excimer laser
11/05/1996US5571761 Strontium or barium titanate ceramics for semiconductors
11/05/1996US5571757 Aluminum-oxygen-carbon-nitrogen
11/05/1996US5571609 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof
11/05/1996US5571608 Apparatus and method of making laminate an embedded conductive layer
11/05/1996US5571593 Circuit carriers
11/05/1996US5571455 Comprising alloy powder, glass frit and organic vehicle; coating on photosensitive element
11/05/1996US5570506 Polyimide with low thermal expansion
11/05/1996US5570505 Method of manufacturing a circuit module
11/05/1996US5570504 Multi-Layer circuit construction method and structure
11/05/1996US5570502 Fabricating metal matrix composites containing electrical insulators
11/05/1996CA2056737C Via resistors within multi-layer, 3-dimensional structure/substrates
11/05/1996CA2055802C Cooling structure for electronics devices
11/03/1996CA2174275A1 High resolution polyimide images using non-photosensitive layers of poly(amic acid) or salts thereof
10/1996
10/31/1996WO1996034517A1 Electronic novelty assembly including a pin switch and embedded printed circuit component
10/31/1996WO1996034497A1 Automatic mdf apparatus
10/31/1996WO1996034433A1 Electrical connector having a two-part articulated housing
10/31/1996WO1996034419A1 Surface mount crystal package with receptable mounting
10/31/1996WO1996033892A1 Control system for an automotive vehicle multi-functional apparatus
10/31/1996WO1996033863A1 Anodized aluminum substrate having increased breakdown voltage
10/31/1996WO1996033813A1 Process for preparing an insulated multilayer structure
10/31/1996DE19616847A1 Printed thick film substrate for use as ceramic substrate
10/31/1996DE19608858A1 Elektrisches Bauteil Electrical component
10/30/1996EP0740497A1 Electric interconnection substrate
10/30/1996EP0740496A1 Method for fabricating highly conductive vias
10/30/1996EP0740013A1 Sheet material for laminate of printed circuit and laminate for printed circuit using the same
10/30/1996EP0739915A2 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these
10/30/1996EP0739877A2 Epoxy resin, resin composition, and resin-encapsulated semiconductor device
10/30/1996EP0739783A1 Electrical distribution center for vehicle
10/30/1996EP0739579A1 A circuit board with specifically designed connection terminals
10/30/1996EP0516819B1 Direct bonding of copper to aluminum nitride substrates
10/30/1996CN1134655A Capactive trace coupling for reduction of crosstalk
10/30/1996CN1134601A Organic chip carriers for wire bond-type chips
10/30/1996CN1134397A Aluminum nitride body having graded metallurgy
10/29/1996US5570274 High density multichip module packaging structure
10/29/1996US5570032 For burning-in and testing of a semiconductor integrated circuit
10/29/1996US5569960 Electronic component, electronic component assembly and electronic component unit
10/29/1996US5569958 Electrically conductive, hermetic vias and their use in high temperature chip packages
10/29/1996US5569886 Flexible printed circuit board
10/29/1996US5569739 Terminally unsaturated polyimide
10/29/1996US5569545 Copper clad laminate, multilayer printed circuit board and their processing method
10/29/1996US5569493 Preparation of cured cyanate ester resins and composites for metal plating
10/29/1996US5569488 Method of making multi-dielectric laminates
10/29/1996US5568892 Alignment and bonding techniques
10/29/1996US5568682 Orthogonal grid circuit interconnect method
10/28/1996CA2175142A1 Epoxy resin, resin composition, and resin-encapsulated semiconductor device
10/26/1996CA2174987A1 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these
10/24/1996WO1996033234A1 Process for producing a polyamide based on a dicarboxylic acid and a diamine
10/24/1996DE19511553A1 System und Verfahren zur Erzeugung elektrisch leitfähiger Verbindungsstrukturen sowie Verfahren zur Herstellung von Schaltungen und von bestückten Schaltungen System and method for producing an electrically conductive connection structures and methods for the preparation of circuits and circuits of loaded
10/23/1996EP0738998A1 Display apparatus and assembly of its driving circuit
10/23/1996EP0738745A1 Polyimide precursor, polyimide and their use
10/23/1996EP0738457A1 Flexible multilayer printed circuit boards and methods of manufacture
10/23/1996EP0738385A1 Measuring probe
10/23/1996EP0647389B1 Annular circuit components coupled with printed circuit board through-hole
10/23/1996CN1134051A Edge card connector with alignment means
10/22/1996US5568361 Three-dimensional electronic circuit of interconnected modules
10/22/1996US5568348 Insert device for electrical relays, solenoids, motors, controllers, and the like
10/22/1996US5568107 Transmission line having impedance set by reference plane fenestration
10/22/1996US5568063 Signal transmitting device, circuit block and integrated circuit suited to fast signal transmission
10/22/1996US5568006 Surface mount crystal package with receptacle mounting
10/22/1996US5567917 Metal base board and electronic equipment using the same
10/22/1996US5567657 Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
10/22/1996US5567554 Mask for producing radomes to high precision
10/22/1996US5567550 Method of making a mask for making integrated circuits
10/22/1996US5567357 Conductive paint having good adhesion to molding of metallic oxide
10/22/1996US5567328 Medical circuit forming process
10/22/1996US5567295 Method and apparatus for making staggered blade edge connectors
10/22/1996US5567240 Apparatus for manufacturing ceramic green sheet laminate for an electronic component
10/22/1996US5567165 Fluid actuated connector/carrier for electric part
10/17/1996WO1996032746A1 Integrated circuit packages
10/17/1996DE19524019C1 Automated distributor for telecommunications system
10/17/1996DE19514145A1 Verfahren zur Herstellung eines Polyamids auf der Basis einer Dicarbonsäure und eines Diamins A process for preparing a polyamide based on a dicarboxylic acid and a diamine
10/16/1996EP0738007A2 Metal-base multilayer circuit substrate
10/16/1996EP0737710A1 Resin composition for electroless metal deposition and method for electroless metal deposition
10/16/1996EP0519085B1 High-frequency device
10/16/1996CN1133548A Drawer of circuit board and support elements
10/16/1996CN1133547A Printed-circuit board and making method thereof
10/16/1996CN1133498A Installation for circuit elements
10/16/1996CN1133234A Base material for laminated board
10/15/1996US5566040 Protection arrangement for an electronic device sensitive to electromagnetic radiation
10/15/1996US5566036 Cable connecting apparatus between audio control head and main printed circuit board for video cassette tape recorder
10/15/1996US5565955 Compact camera having electrical components mounted on one mounted board
10/15/1996US5565837 Low profile printed circuit board
10/15/1996US5565789 Process for encoding printed circuit boards
10/15/1996US5565704 Memory card having two types of memory integrated circuits connected to two different shaped connectors
10/15/1996US5565654 Printed circuit board for plug-type connections
10/15/1996US5565280 Electrical interconnect using particle enhanced joining of metal surfaces
10/15/1996US5565267 Composite substrates for preparation of printed circuits
10/15/1996US5565262 Electrical feedthroughs for ceramic circuit board support substrates
10/15/1996US5565261 Selective call radio having a ceramic substrate for circuit device interconnection
10/15/1996US5564932 Customizeable interconnect device for stacking electrical components of varying configuration
10/10/1996DE19524593A1 Objects arrangement e.g. for components on suface of circuit board
10/09/1996EP0737025A1 Printed wiring board
10/09/1996EP0736774A2 Improved flexible strip cable
10/09/1996EP0736568A1 Resin composition to be plated
10/09/1996EP0736242A1 Method of surface mounting radio frequency components and the components
10/08/1996US5563773 Semiconductor module having multiple insulation and wiring layers
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